US5500540A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer scale optoelectronic package
Assignee: ALPERT HERB
•
Filing: 1994-04-15
•
Granted: 1996-03-19
•
Expires: 2014-04-15
Abstract
Abstract A package and method for packaging optoelectronic or electronic components is provided in which multiple chip regions are packaged simultaneously prior to sectioning of the wafer into chips. The method and package allows micro-optic and other package elements to be integrated onto wafers on the same face as the optoelectronic or electronic devices without inhibiting the ability to make electrical contact to the devices. The package elements may be integrated to the wafer by material deposition, by spinning, or by physical mounting.
Inventors
- 👤 Jack L. Jewell
- 👤 William E. Quinn
- 👤 Stan E. Swirhun
- 👤 Robert P. Bryan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:35
CPC Classifications
H; H10; H10H; H10H29/00; H10H29/10; H10W; H10W90/00; H10H20/00; H10H20/80; H10H20/85; H10H20/855
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
205 words
An optoelectronic package comprising: at least a portion of a first layer having at least a top surface which contains at least two optoelectronic chip regions, each of said optoelectronic chip regions containing at least one optoelectronic element which receives or emits at least one beam of light and receives or emits at least one electronic signal, each of said optoelectronic chip regions containing at least one electrical contact; means for separating said optoelectronic chip regions; and a medium comprising medium regions integrated with and aligned with said optoelectronic chip regions, each of said medium regions containing modifying elements which modify said at least one beam of light or said at least one electronic signal, at least one of said medium regions comprising at least a portion of a second layer having at least a top surface which contains at least two electronic chip regions, each of said electronic chip regions containing at least one electronic element electrically connected to said at least one optoelectronic element, each of said electronic chip regions containing at least one electrical contact; characterized in that said medium regions are commonly mounted when integrated to said optoelectronic chip regions, and that said at least one electrical contact is electrically accessible.
Claim 2
Dependent Claim
205 words
An optoelectronic package comprising: at least a portion of a first layer having at least a top surface which contains at least two optoelectronic chip regions, each of said optoelectronic chip regions containing at least one optoelectronic element which receives or emits at least one beam of light and receives or emits at least one electronic signal, each of said optoelectronic chip regions containing at least one electrical contact; means for separating said optoelectronic chip regions; and a medium comprising medium regions integrated with and aligned with said optoelectronic chip regions, each of said medium regions containing modifying elements which modify said at least one beam of light or said at least one electronic signal, at least one of said medium regions comprising at least a portion of a second layer having at least a top surface which contains at least two electronic chip regions, each of said electronic chip regions containing at least one electronic element electrically connected to said at least one optoelectronic element, each of said electronic chip regions containing at least one electrical contact; characterized in that said medium regions are commonly mounted when integrated to said optoelectronic chip regions, and that said at least one electrical contact is electrically accessible.
Claim 3
Dependent Claim
24 words
The optoelectronic package recited in claim 1 wherein said optical material is selected from the group consisting of photoresit, polyimide and spin cast glass.
Claim 4
Dependent Claim
20 words
The optoelectronic package recited in claim 1 wherein at least one of said electrical contacts is a wire bonding pad.
Claim 5
Dependent Claim
20 words
The optoelectronic package recited in claim 1 wherein at least one of said electrical contacts is a bump bonding pad.
Claim 6
Dependent Claim
21 words
The optoelectronic package recited in claim 1 wherein at least one of said electrical contacts is a tape automated bonding pad.
Claim 7
Dependent Claim
22 words
The optoelectronic package recited in claim 1 wherein at least one of said electrical contacts is a via through said first layer.
Claim 8
Dependent Claim
20 words
The optoelectronic package recited in claim 1 wherein at least one of said optical elements comprises at least one lens.
Claim 9
Dependent Claim
18 words
The optoelectronic package recited in claim 1 wherein said least one optical element comprises at least one prism.
Claim 10
Dependent Claim
19 words
The optoelectronic package recited in claim 1 wherein said at least one optical element comprises at least one grating.
Claim 11
Dependent Claim
32 words
The optoelectronic package recited in claim 1 wherein said at least one optical element comprises at least one reflector which reflects at least some of said at least one beam of light.
Claim 12
Dependent Claim
17 words
The optoelectronic package recited in claim 1 wherein said at least one optical element comprises a waveguide.
Claim 13
Dependent Claim
18 words
The optoelectronic package recited in claim 1 wherein said at least one optical element comprises a refractive element.
Claim 14
Dependent Claim
18 words
The optoelectronic package recited in claim 1 wherein said at least one optical element comprises a diffractive element.
Claim 15
Dependent Claim
19 words
The optoelectronic package recited in claim 1 wherein said at least one optical element comprises a gradient index element.
Claim 16
Dependent Claim
13 words
The optoelectronic package recited in claim 1 wherein said optical material is partitioned.
Claim 17
Dependent Claim
22 words
The optoelectronic package recited in claim 1 wherein at least one of said electrical contacts is not covered by said optical material.
Claim 18
Dependent Claim
18 words
The optoelectronic package recited in claim 1 wherein at least one of said optoelectronic elements comprises a modulator.
Claim 19
Dependent Claim
20 words
The optoelectronic package recited in claim 1 wherein at least one of said optoelectronic elements comprises a light emitting diode.
Claim 20
Dependent Claim
18 words
The optoelectronic package recited in claim 1 wherein at least one of said optoelectronic elements comprises a laser.
Claim 21
Dependent Claim
17 words
The optoelectronic package recited in claim 19 wherein said laser comprises a vertical cavity surface emitting laser.
Claim 22
Dependent Claim
30 words
The optoelectronic package recited in claim 1 wherein said optical material is selected from the group consisting of silicon nitride, silicon dioxide, titanium dioxide, aluminum gallium arsenide and indium phosphide.
Claim 23
Dependent Claim
25 words
The optoelectronic package recited in claim 1, further comprising an insulating layer disposed between portions of said optoelectronic chip regions and said electronic chip regions.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-19 | 1999-09-18 | 2000-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-19 | 2003-09-18 | 2004-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-19 | 2007-09-18 | 2008-03-19 | $7700.00 | Window Closed / Lapsed |