Method of and apparatus for placing blocks in semiconductor integrated circuit

Claim 1

A method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks, wherein the initial placement of the blocks is by placing mass points using a spring model of a mass system in which mass points, replacing the blocks and ignoring areas of the blocks, are interconnected by a spring, a block area being imparted to each of the mass points in the form of a rectangle, when the block area is imparted to each of the mass points, a rectangle corresponding to an actual shape is imparted to the block of a hard macro cell whose shape is undeformable, while a square is imparted to the block of a soft macro cell whose shape is deformable in a first direction and a second direction perpendicular to the first direction; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in the second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained.

Claim 2

A method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks, wherein the initial placement of the blocks is by placing mass points using a spring model of a mass system in which mass points, replacing the blocks and ignoring areas of the blocks, are interconnected by a spring, a block area being imparted to each of the mass points in the form of a rectangle, when the block area is imparted to each of the mass points, a rectangle corresponding to an actual shape is imparted to the block of a hard macro cell whose shape is undeformable, while a square is imparted to the block of a soft macro cell whose shape is deformable in a first direction and a second direction perpendicular to the first direction; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in the second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained.

Claim 8

An apparatus for placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, said apparatus comprising: input means for inputting necessary information; a layout specification storage unit for storing a layout specification necessary for determining the placement of the blocks; a central processing unit for executing processing which includes: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained; wherein when said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of areas of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length; a layout information storage unit for storing layout information being processed by said central processing unit; a display for displaying a state of processing by said central processing unit; and output means for outputting information determined by said central processing unit.

Claim 9

An apparatus for placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, said apparatus comprising: input means for inputting necessary information; a layout specification storage unit for storing a layout specification necessary for determining the placement of the blocks; a central processing unit for executing processing which includes: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained; wherein when said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of areas of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length; a layout information storage unit for storing layout information being processed by said central processing unit; a display for displaying a state of processing by said central processing unit; and output means for outputting information determined by said central processing unit.

Claim 10

An apparatus for placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, said apparatus comprising: input means for inputting necessary information; a layout specification storage unit for storing a layout specification necessary for determining the placement of the blocks; a central processing unit for executing processing which includes: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained; wherein when said overlapping has occurred at plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of side lengths of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length; a layout information storage unit for storing layout information being processed by said central processing unit; a display for displaying a state of processing by said central processing unit; and output means for outputting information determined by said central processing unit.

Claim 11

An apparatus for placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, said apparatus comprising: input means for inputting necessary information; a layout specification storage unit for storing a layout specification necessary for determining the placement of the blocks; a central processing unit for executing processing which includes: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained; wherein when said overlapping has occurred at plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of side lengths of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length; a layout information storage unit for storing layout information being processed by said central processing unit; a display for displaying a state of processing by said central processing unit; and output means for outputting information determined by said central processing unit.

Claim 12

The method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained, wherein where said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of respective amounts of overlapping, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length.

Claim 13

The method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained, wherein where said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of respective amounts of overlapping, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length.

Claim 14

The method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained, wherein where said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of areas of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length.

Claim 15

The method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained, wherein where said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of areas of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length.

Claim 16

The method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained, wherein where said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of side lengths of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length.

Claim 17

The method of placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, comprising the steps of: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained, wherein where said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of sums of side lengths of respective two overlapping blocks, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length.

Claim 18

An apparatus for placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, said apparatus comprising: input means for inputting necessary information; a layout specification storage unit for storing a layout specification necessary for determining the placement of the blocks; a central processing unit for executing processing which includes: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained; wherein when said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of respective amounts of overlapping, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length; a layout information storage unit for storing layout information being processed by said central processing unit; a display for displaying a state of processing by said central processing unit; and output means for outputting information determined by said central processing unit.

Claim 19

An apparatus for placing blocks in a semiconductor integrated circuit for determining the placement of a plurality of blocks having different sizes, said apparatus comprising: input means for inputting necessary information; a layout specification storage unit for storing a layout specification necessary for determining the placement of the blocks; a central processing unit for executing processing which includes: setting an externally contacting frame for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks; moving the blocks by compressing the externally contacting frame of the plurality of blocks by a predetermined length in a first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; moving the blocks by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and moving the blocks in which overlapping has consequently occurred, or deforming said blocks without changing their areas; and repeating the compression in the two directions until a target size is obtained; wherein when said overlapping has occurred at a plurality of portions, a total amount of overlapping is distributed to the overlapping portions in accordance with a ratio of respective amounts of overlapping, and each corresponding block is deformed by using the distributed amount of overlapping as a compression length; a layout information storage unit for storing layout information being processed by said central processing unit; a display for displaying a state of processing by said central processing unit; and output means for outputting information determined by said central processing unit.