US5490041A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor integrated circuit module and a semiconductor integrated circuit device stacking the same
Assignee: Panasonic Holdings Corp
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Filing: 1994-04-04
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Granted: 1996-02-06
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Expires: 2014-04-04
Abstract
Abstract A plurality of memory modules are stacked so as to form a multilayer integrated memory circuit. All of the memory modules have a plurality of bare memory IC chips mounted thereon, and have the same structure, the same circuit configuration and the same terminal arrangement in lead frames with each other. Each of the memory modules to be stacked in each layer is rotated by 90°, 180° or 270° before being stacked and connected to each other. Thus, in the multi-layered memory circuit, it is possible that signals can be selectively input/output to/from a particular layer in the multilayer structure, although the lead terminals of each of memory modules has the same configuration and the same arrangement with each other. As a result, a small-size integrated memory circuit device with a large memory-capacity can be provided, which can be fabricated easily and efficiently. A higher processing speed of digital computers can be also achieved.
Inventors
- 👤 Hitonobu Furukawa
- 👤 Hayami Matsunaga
- 👤 Yoshikazu Suehiro
- 👤 Masao Iwata
- 👤 Takeo Yasuho
- 👤 Izumi Okamoto
- 👤 Kazuo Takeda
- 👤 Shuji Ida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 07:24
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H10; H10W; H10W90/00; H10W70/00; H10W70/40; H10W70/60; H10W72/00; H10W72/60; H10W72/834
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
155 words
A semiconductor integrated circuit device comprising a multilayer structure in which a plurality of modules are stacked, each of said plurality of modules comprising: a wiring board having a first face and a second face; a plurality of semiconductor devices mounted on at least one of said first and said second faces of said wiring board; and a plurality of terminals formed along peripheral edges of said wiring board, the terminals along each of said peripheral edges being grouped into a terminal row so as to form a plurality of terminal rows, each of said plurality of terminal rows being electrically connected respectively to a different one of said plurality of semiconductor devices, wherein each of said plurality of terminal rows comprises at least one specific terminal for transmitting a signal having a predetermined function, and a position of said specific terminal in each of said plurality of terminal rows is different from each other.
Claim 2
Dependent Claim
155 words
A semiconductor integrated circuit device comprising a multilayer structure in which a plurality of modules are stacked, each of said plurality of modules comprising: a wiring board having a first face and a second face; a plurality of semiconductor devices mounted on at least one of said first and said second faces of said wiring board; and a plurality of terminals formed along peripheral edges of said wiring board, the terminals along each of said peripheral edges being grouped into a terminal row so as to form a plurality of terminal rows, each of said plurality of terminal rows being electrically connected respectively to a different one of said plurality of semiconductor devices, wherein each of said plurality of terminal rows comprises at least one specific terminal for transmitting a signal having a predetermined function, and a position of said specific terminal in each of said plurality of terminal rows is different from each other.
Claim 3
Dependent Claim
22 words
An integrated circuit device according to claim 1, wherein at least one of said plurality of semiconductor devices is a memory device.
Claim 4
Dependent Claim
22 words
An integrated circuit device according to claim 1, wherein said signal is selectively input to one of said plurality of semiconductor devices.
Claim 5
Dependent Claim
45 words
An integrated circuit device according to claim 1, wherein each of said plurality of terminals in one of said plurality of modules is connected to other terminals at corresponding positions in the modules which are placed in upper and lower layers in said multilayer structure.
Claim 6
Dependent Claim
69 words
An integrated circuit device according to claim 1, wherein each of said plurality of modules in said multilayer structure are stacked after being rotated at a predetermined angle, whereby positions of said specific terminal in each of said plurality of terminal rows are shifted from each other among the terminal rows at corresponding positions of the modules which are placed in upper and lower layers in said multilayer structure.
Claim 7
Dependent Claim
17 words
An integrated circuit device according to claim 1, wherein said plurality of terminals have a rectangular shape.
Claim 8
Dependent Claim
44 words
An integrated circuit device according to claim 1, wherein said plurality of terminals of said plurality of modules except for a lowermost module in said multilayer structure have a rectangular shape, and said plurality of terminals of said lowermost module have a gull-wing shape.
Claim 9
Dependent Claim
31 words
An integrated circuit device according to claim 1 further comprising a resistor module as an uppermost module, wherein said resistor module comprises a plurality of resistors mounted on a wiring board.
Claim 10
Dependent Claim
30 words
An integrated circuit device according to claim 1, wherein at least one capacitor is mounted on at least one of said first and said second faces of said wiring board.
Claim 11
Dependent Claim
57 words
An integrated circuit device according to claim 1, wherein said plurality of semiconductor devices are four semiconductor devices mounted in a square mounting area with an arrangement in which one of two longer edges of each of said four semiconductor devices and one of two shorter edges of the neighboring semiconductor device are located side by side.
Claim 12
Dependent Claim
24 words
An integrated circuit device according to claim 10, wherein at least one capacitor is mounted in the center portion of said square mounting area.
Claim 13
Dependent Claim
30 words
An integrated circuit device according to claim 1, wherein said wiring board has a regular polygonal shape having n number of vertexes, n being equal to or more than 3.
Claim 14
Dependent Claim
21 words
An integrated circuit device according to claim 1, wherein said plurality of semiconductor devices are a plurality of bare IC chips.
Claim 15
Dependent Claim
69 words
An integrated circuit device according to claim 1, wherein said plurality of semiconductor devices are a plurality of TAB packages, wherein each of said plurality of TAB packages comprises: a film carrier; a bare IC chip being mounted on said film carrier; and outer leads formed along at least one of two longer edges of said film carrier, said outer leads being electrically connected to said bare IC chip.
Claim 16
Dependent Claim
79 words
An integrated circuit device according to claim 14 comprising a plurality of said TAB packages mounted on said wiring board, wherein two of said plurality of TAB packages are paired, said paired TAB packages being arranged in parallel so that each of said outer leads thereof points toward said peripheral edges of said wiring board, each of said outer leads being connected to respective outer lead pads arranged in a pair of parallel pad rows on said wiring board.
Claim 17
Dependent Claim
24 words
An integrated circuit device according to claim 15, wherein other paired TAB packages are stacked overlapping said paired TAB packages in a criss-cross method.
Claim 18
Dependent Claim
39 words
An integrated circuit device according to claim 15, wherein shorter edges of said bare IC chip of each of said plurality of TAB packages is shorter than a half of an interval between said pair of parallel pad rows.
Claim 19
Dependent Claim
25 words
An integrated circuit device according to claim 15, wherein at least one capacitor is mounted on a space between said pair of parallel pad rows.
Claim 20
Dependent Claim
137 words
A semiconductor integrated circuit module comprising: a wiring board having a first face and a second face; a plurality of semiconductor devices mounted on at least one of said first and said second faces of said wiring board; and a plurality of terminals formed along peripheral edges of said wiring board, the terminals along each of said peripheral edges being grouped into a terminal row so as to form a plurality of terminal rows, each of said plurality of terminal rows being electrically connected respectively to a different one of said plurality of semiconductor devices, wherein each of said plurality of terminal rows comprises at least one specific terminal for transmitting a signal having a predetermined function, and a position of said specific terminal in each of said plurality of terminal rows is different from each other.
Claim 21
Dependent Claim
137 words
A semiconductor integrated circuit module comprising: a wiring board having a first face and a second face; a plurality of semiconductor devices mounted on at least one of said first and said second faces of said wiring board; and a plurality of terminals formed along peripheral edges of said wiring board, the terminals along each of said peripheral edges being grouped into a terminal row so as to form a plurality of terminal rows, each of said plurality of terminal rows being electrically connected respectively to a different one of said plurality of semiconductor devices, wherein each of said plurality of terminal rows comprises at least one specific terminal for transmitting a signal having a predetermined function, and a position of said specific terminal in each of said plurality of terminal rows is different from each other.
Claim 22
Dependent Claim
20 words
A module according to claim 19, wherein at least one of said plurality of semiconductor devices is a memory device.
Claim 23
Dependent Claim
20 words
A module according to claim 19, wherein said signal is selectively input to one of said plurality of semiconductor devices.
Claim 24
Dependent Claim
15 words
A module according to claim 19, wherein said plurality of terminals have a rectangular shape.
Claim 25
Dependent Claim
15 words
A module according to claim 19, wherein said plurality of terminals have a gull-wing shape.
Claim 26
Dependent Claim
28 words
A module according to claim 19, wherein at least one capacitor is mounted on at least one of said first and said second faces of said wiring board.
Claim 27
Dependent Claim
55 words
A module according to claim 19, wherein said plurality of semiconductor devices are four semiconductor devices mounted in a square mounting area with an arrangement in which one of two longer edges of each of said four semiconductor devices and one of two shorter edges of the neighboring semiconductor device are located side by side.
Claim 28
Dependent Claim
22 words
A module according to claim 25, wherein at least one capacitor is mounted in the center portion of said square mounting area.
Claim 29
Dependent Claim
26 words
A module according to claim 19, wherein said wiring board has a regular polygonal shape having n vertexes, n being equal to or more than 3.
Claim 30
Dependent Claim
19 words
A module according to claim 19, wherein said plurality of semiconductor devices are a plurality of bare IC chips.
Claim 31
Dependent Claim
67 words
A module according to claim 19, wherein said plurality of semiconductor devices are a plurality of TAB packages, wherein each of said plurality of TAB packages comprises: a film carrier; a bare IC chip being mounted on said film carrier; and outer leads formed along at least one of two longer edges of said film carrier, said outer leads being electrically connected to said bare IC chip.
Claim 32
Dependent Claim
77 words
A module according to claim 29 comprising a plurality of said TAB packages mounted on said wiring board, wherein two of said plurality of TAB packages are paired, said paired TAB packages being arranged in parallel so that each of said outer leads thereof points toward said peripheral edges of said wiring board, each of said outer leads being connected to respective outer lead pads arranged in a pair of parallel pad rows on said wiring board.
Claim 33
Dependent Claim
23 words
A module according to claim 30, wherein the other paired TAB packages are stacked overlapping said paired TAB packages in a criss-cross method.
Claim 34
Dependent Claim
36 words
A module according to claim 30, wherein shorter edges of said bare IC chip of each of said plurality of TAB packages is shorter than a half an interval between said pair of parallel pad rows.
Claim 35
Dependent Claim
23 words
A module according to claim 30, wherein at least one capacitor is mounted on a space between said pair of parallel pad rows.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-05 | 1999-08-07 | 2000-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-05 | 2003-08-07 | 2004-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-05 | 2007-08-07 | 2008-02-06 | $7700.00 | Window Closed / Lapsed |