EP0339154A2
Expired / Lapsed
EP
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Memory card
Assignee: Citizen Watch Co Ltd
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Filing: 1988-09-14
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Granted: —
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Expires: 2008-09-14
Abstract
Abstract A device for packaging many IC chips D1 to D4 having a plurality of common connecting terminals on a main circuit board 1. A plurality of IC chips D1 to D4 are packaged on an auxiliary board 4 to make an IC chip unit B1 to B4, and a plurality of IC chip units B1 to B4 are aligned on the main circuit board 1. The connections between unit-connecting terminals t1 to t4 (te) provided on the respective IC chip units B1 to B4 and the main circuit board 1 are made by means of wiring patterns P1 to P4 (Pd and Pe) on the main circuit board 1.
Inventors
- 👤 Yoshihiro Ishida
- 👤 Yoshio Iinuma
- 👤 Shingo Ichikawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 08:31
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/65; H10W90/00; H10W90/401; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/36; H05K3/368; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
231 words
An IC package comprising: (a) a main board including a plurality of external connecting terminal patterns aligned along one of the edges of said board, and a plurality of wiring patterns running in a row direction of said board on at least a front side of said board, said external connecting terminal patterns and said wiring patterns being connected by means of wiring patterns without crossing each other on the front side of said board; and (b) a plurality of IC chip units each having an auxiliary board and a plurality of IC chips mounted on a front side of said auxiliary board, said auxiliary board including a plurality of unit-connecting terminal patterns aligned along one of the longitudinal edges of said auxiliary board, said auxiliary board unit-connecting terminal patterns corresponding to said plurality of main board row-direction wiring patterns, said auxiliary board further including plural columns of wiring patterns running in a column direction of said auxiliary board, and said plurality of IC chips being mounted on said plural columns of wiring patterns and aligned along said plurality of unit-connecting terminal patterns; (c) said plurality of IC chip units being mounted on said main board, in a plurality of columns in parallel with the main board external connecting terminal patterns, and said auxiliary board unit-connecting terminal patterns being electrically connected to corresponding ones of said main board row-direction wiring patterns.
Claim 2
Dependent Claim
231 words
An IC package comprising: (a) a main board including a plurality of external connecting terminal patterns aligned along one of the edges of said board, and a plurality of wiring patterns running in a row direction of said board on at least a front side of said board, said external connecting terminal patterns and said wiring patterns being connected by means of wiring patterns without crossing each other on the front side of said board; and (b) a plurality of IC chip units each having an auxiliary board and a plurality of IC chips mounted on a front side of said auxiliary board, said auxiliary board including a plurality of unit-connecting terminal patterns aligned along one of the longitudinal edges of said auxiliary board, said auxiliary board unit-connecting terminal patterns corresponding to said plurality of main board row-direction wiring patterns, said auxiliary board further including plural columns of wiring patterns running in a column direction of said auxiliary board, and said plurality of IC chips being mounted on said plural columns of wiring patterns and aligned along said plurality of unit-connecting terminal patterns; (c) said plurality of IC chip units being mounted on said main board, in a plurality of columns in parallel with the main board external connecting terminal patterns, and said auxiliary board unit-connecting terminal patterns being electrically connected to corresponding ones of said main board row-direction wiring patterns.
Claim 3
Dependent Claim
58 words
The IC package according to claim 1 wherein said main board row-direction wiring patterns are provided in groups: said auxiliary board unit-connecting terminal patterns are arranged in groups corresponding to the groups of said main board row-direction wiring patterns; and said plurality of IC chips are mounted on positions corresponding to the respective groups on said auxiliary board.
Claim 4
Dependent Claim
68 words
The IC package according to claim 1 wherein a back side of said main board is further provided with wiring patterns corresponding to said front wiring patterns in shape and connected to the same by means of through-hole patterns; and on the respective wiring patterns on the front and back sides of the main board, IC chip units identical with said first mentioned IC chip units are mounted.
Claim 5
Dependent Claim
100 words
The IC package according to claim 1 wherein a back side of said main board is further provided with wiring patterns corresponding to said front wiring patterns in shape and connected to the same by means of through-hole patterns; and on the front side of the main board, IC chip units of a type identical with that of said first mentioned IC chip units are mounted, while on the back side of the main board, IC chip units of a second type different from that of said first mentioned IC chip units in their unit terminal pattern positions are mounted.
Claim 6
Dependent Claim
102 words
The IC package according to claim 4 wherein said IC chip units of a second type have each a second auxiliary board and a plurality of IC chips mounted on a front side of the second auxiliary board, said another auxiliary board including a plurality of unit-connecting terminal patterns aligned along an edge corresponding to the other of the longitudinal edges of said first mentioned auxiliary board, said unit-connecting terminal patterns corresponding to said plurality of main board row-direction wiring patterns, said second auxiliary board further including plural columns of wiring patterns running in a column direction of said second auxiliary board.
Claim 7
Dependent Claim
93 words
The IC package according to claim 1 further comprising a chip selecting circuit, wherein connections between said external connecting terminal patterns and input terminals of said chip selecting circuit and connections between output terminals of said chip selecting circuit and chip enable terminals of the wiring patterns on the front side of said main board are made by means of the wiring patterns on the main board, whereby connections between the main board and components to be mounted on the main board are made only on the front side of the main board.
Claim 8
Dependent Claim
41 words
The IC package according to claim 1 wherein on said main board row-direction wiring patterns, there are provided bonding portions formed wide enough to allow bonding at positions corresponding to the unit-connecting terminal patterns of said plurality of IC chip units.
Claim 9
Dependent Claim
28 words
The IC package according to claim 7 wherein an insulating coating is provided except for the regions of said main board external connecting terminals and said bonding portions.
Claim 10
Dependent Claim
70 words
The IC package according to claim 1 wherein said auxiliary board further includes a plurality of through-hole patterns leading from said front column-direction wiring patterns to the back side of the auxiliary board, and back wiring patterns for connecting the back through-hole patterns to the unit-connecting terminal patterns, said front column-direction wiring patterns being connected to said unit connecting terminal patterns via said through-hole patterns and said back wiring patterns.
Claim 11
Dependent Claim
29 words
The IC package according to claim 9 wherein part of said front column-direction wiring patterns are connected to said unit connecting patterns by means of the front wiring patterns.
Claim 12
Dependent Claim
53 words
The IC package according to claim 9 whrein a total of unit connecting terminals on one auxiliary board is equal to a sum of the number of the common connecting terminals of one IC chip and the number of chip enable terminals equivalent to the number of chips mounted on one auxiliary board.
Claim 13
Dependent Claim
66 words
The IC package according to claim 1 wherein the number of said plural columns of wiring patterns running on the front side of said auxiliary board is equal to the number of common connecting terminals of at least one IC chip; and said plural columns of wiring patterns include bonding portions formed wide enough to allow bonding at the regions corresponding to said IC chip terminals.
Claim 14
Dependent Claim
30 words
The IC package according to claim 1 wherein said auxiliary board is covered with an insulating coating except for the regions of said unit connecting patterns and said bonding portions.
Claim 15
Dependent Claim
44 words
The IC package according to claim 1 or 4 wherein said IC chips mounted on said auxiliary board are divided into at least two blocks and molded with resin respectively, the wiring patterns between said plurality of molds being stripped from said molding resin.
Claim 16
Dependent Claim
45 words
The IC package according to claim 14 wherein an even number of IC chips are mounted, divided into each equal number of IC chips and molded with resin, said column-direction wiring patterns being exposed from said resin at the middle portion of the auxiliary board.
References Cited (Backward Citations)
No citation records indexed.
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