Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
221 words
A method of fabricating a sidewall charge-coupled device with trench isolation comprising the steps of: providing a substrate of semiconductor material; defining a plurality of isolation trenches in a surface of said substrate to form columns of charge coupled cells between the isolation trenches, said plurality of isolation trenches being formed to increase the surface areas of the charge coupled cells therebetween and facilitate transport of charges along the cell sidewalls; disposing a plurality of alternating first and second sets of substantially parallel surface electrodes arranged in an overlapping electrode configuration over substantially the entire upper surface of the substrate extending substantially perpendicular to the isolation trenches, said plurality of alternating first and second sets of surface electrodes producing, by an applied electric field, an induced potential well in the substrate beneath each of the plurality of alternating first and second sets of surface electrodes, such that substantially the entire upper surface of the substrate and the sidewalls in common with the upper portions of the sidewalls of the isolation trenches produce photon to electron conversion in response to incident light; and disposing a plurality of shallow trenches, shallow relative to the deeper isolation trenches, under the surface electrodes in each column of cells defined between adjacent isolation trenches to increase the charge carrying surface area and provide better gate control.
Claim 2
Independent Claim
221 words
A method of fabricating a sidewall charge-coupled device with trench isolation comprising the steps of: providing a substrate of semiconductor material; defining a plurality of isolation trenches in a surface of said substrate to form columns of charge coupled cells between the isolation trenches, said plurality of isolation trenches being formed to increase the surface areas of the charge coupled cells therebetween and facilitate transport of charges along the cell sidewalls; disposing a plurality of alternating first and second sets of substantially parallel surface electrodes arranged in an overlapping electrode configuration over substantially the entire upper surface of the substrate extending substantially perpendicular to the isolation trenches, said plurality of alternating first and second sets of surface electrodes producing, by an applied electric field, an induced potential well in the substrate beneath each of the plurality of alternating first and second sets of surface electrodes, such that substantially the entire upper surface of the substrate and the sidewalls in common with the upper portions of the sidewalls of the isolation trenches produce photon to electron conversion in response to incident light; and disposing a plurality of shallow trenches, shallow relative to the deeper isolation trenches, under the surface electrodes in each column of cells defined between adjacent isolation trenches to increase the charge carrying surface area and provide better gate control.
Claim 3
Dependent Claim
43 words
A method as claimed in claim 1, wherein said plurality of alternating first and second sets of surface electrodes comprise a storage electrode and a receiving electrode as adjacent surface electrodes and a transfer electrode and a blocking electrode as adjacent surface electrodes.
Claim 4
Dependent Claim
34 words
A method as claimed in claim 1, further including the step of disposing an insulation layer between said alternating first and second sets of surface electrodes and between said surface electrodes and said substrate.
Claim 5
Dependent Claim
70 words
A method as claimed in claim 1, wherein each of said plurality of isolation trenches is defined by etching a plurality of trenches in said substrate and wherein said isolation trenches are disposed by partially refilling said trenches with an undoped polysilicon semiconductor material to a depth S below the surface of the substrate, and forming a charge carrying sidewall of the trench to a depth S below the substrate.