Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent

Claim 1

A method of forming an electrical bonding interconnect to a substrate comprising the following steps: providing an electrically conductive metal contact area on a substrate; exposing the metal contact area to conditions effective to reactively form an electrically resistive metal oxide material from the metal; applying an electrically conductive epoxy over the electrically resistive oxide material, the epoxy comprising a reducing agent effective to reduce the metal oxide back to conductive metal; reducing the metal oxide back to conductive metal using the reducing agent present in the conductive epoxy; and curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

Claim 2

A method of forming an electrical bonding interconnect to a substrate comprising the following steps: providing an electrically conductive metal contact area on a substrate; exposing the metal contact area to conditions effective to reactively form an electrically resistive metal oxide material from the metal; applying an electrically conductive epoxy over the electrically resistive oxide material, the epoxy comprising a reducing agent effective to reduce the metal oxide back to conductive metal; reducing the metal oxide back to conductive metal using the reducing agent present in the conductive epoxy; and curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

Claim 3

A method of forming an electrical bonding interconnect to a substrate comprising the following steps: providing an electrically conductive metal contact area on a substrate; exposing the metal contact area to conditions effective to reactively form an electrically resistive metal oxide material from the metal; applying an electrically conductive epoxy over the electrically resistive oxide material, the conductive epoxy comprising a resin component and a hardener component, the hardener component comprising a reducing agent effective to reduce the metal oxide back to conductive metal; reducing the metal oxide back to conductive metal using the reducing agent present in the hardener component of the conductive epoxy; and curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

Claim 4

A method of forming an electrical bonding interconnect to a substrate comprising the following steps: providing an electrically conductive metal contact area on a substrate; exposing the metal contact area to conditions effective to reactively form an electrically resistive metal oxide material from the metal; applying an electrically conductive epoxy over the electrically resistive oxide material, the conductive epoxy comprising a resin component and a hardener component, the hardener component comprising a reducing agent effective to reduce the metal oxide back to conductive metal; reducing the metal oxide back to conductive metal using the reducing agent present in the hardener component of the conductive epoxy; and curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

Claim 5

A method of forming an electrical bonding interconnect to a substrate comprising the following steps: providing a copper metal contact area on a substrate; exposing the copper contact area to conditions effective to reactively form an electrically resistive copper oxide from the copper; applying an electrically conductive epoxy over the electrically resistive oxide material, the epoxy comprising at least one of an alkoxylated polyalkyl amine or ethylene diamine; reducing the copper oxide back to conductive copper metal using the at least one of the alkoxylated polyalkyl amine or ethylene diamine present in the conductive epoxy; and curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

Claim 6

A method of forming an electrical bonding interconnect to a substrate comprising the following steps: providing a copper metal contact area on a substrate; exposing the copper contact area to conditions effective to reactively form an electrically resistive copper oxide from the copper; applying an electrically conductive epoxy over the electrically resistive oxide material, the epoxy comprising at least one of an alkoxylated polyalkyl amine or ethylene diamine; reducing the copper oxide back to conductive copper metal using the at least one of the alkoxylated polyalkyl amine or ethylene diamine present in the conductive epoxy; and curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.