Method for bonding integrated circuit to substrate

Abstract

Abstract PURPOSE:To eliminate the need for the formation of protruding electrodes on an IC and thereby to reduce the cost of the IC by a method wherein a conductive adhesive is transferred by a jig to a connecting terminal of an IC chip and the IC chip with the conductive adhesive is bonded face down to a substrate. CONSTITUTION:A conductive adhesive 3 is uniformly applied to the surface of a female jig 4 and the female jig 4 is pressed down onto male jig 5, transferring the conductive adhesive 3 to the end points of the male jig 5. Connecting terminals 2 of an IC chip 1 are aligned to the conductive adhesive 3 on the male jig 5, which results in the transfer of the conductive adhesive 3 to the connecting terminals 2. The IC chip 1 now provided with the adhesive agent 3 is bonded face down to a wiring 7 formed on a substrate 6. This method eliminates the need of forming protruding electrodes on an IC, reducing the IC cost.

Inventors

• 👤 Masahisa Yamashita
• 👤 山下　雅久

Bibliographic Details