Semiconductor memory component comprising stacked memory modules

Claim 2

Memory component having: a rectangular semiconductor substrate containing active memory circuits and having output terminals on a major surface thereof; an insulating layer on said major surface; a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate; and a plurality of additional pads which are distributed between said connection pads and are devoid of connection leads, said substrate having such a width that said connection pads are beyond a zone of said substrate which contains active memory circuits.

Claim 3

Memory component having: a rectangular semiconductor substrate containing active memory circuits and carrying output terminals on a major surface thereof; an insulating layer on said major surface, metal connecting leads located on said insulating surface and all located above a zone of said substrate containing active memory circuits, said metal connection leads connecting said output terminals to a plurality of connection pads located on said major surface along only one of longer sides of the substrate.

Claim 4

Memory component having: a rectangular semiconductor substrate containing active memory circuits and carrying output terminals on a major surface thereof; an insulating layer on said major surface, metal connecting leads located on said insulating surface and all located above a zone of said substrate containing active memory circuits, said metal connection leads connecting said output terminals to a plurality of connection pads located on said major surface along only one of longer sides of the substrate.

Claim 5

Component according to claim 1, wherein said metal connection leads are devoid of mutual crossing.

Claim 6

Component according to claim 2, wherein said substrate has such a width that said connection pads are beyond the zone thereof which contains active memory circuits.

Claim 7

Memory module comprising: an interconnection support; and a plurality of memory components, all having a same elongated shape, and all mutually stacked in a same angular position; each said memory component having: a rectangular semiconductor substrate containing active memory circuits and having output terminals on a major surface thereof; an insulating layer on said major surface; and a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate; two successive said components being mutually offset by an amount sufficient for the connection pads of one said component to be located beyond the component located above it in the stack.

Claim 8

Memory module comprising: an interconnection support; and a plurality of memory components, all having a same elongated shape, and all mutually stacked in a same angular position; each said memory component having: a rectangular semiconductor substrate containing active memory circuits and having output terminals on a major surface thereof; an insulating layer on said major surface; and a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate; two successive said components being mutually offset by an amount sufficient for the connection pads of one said component to be located beyond the component located above it in the stack.

Claim 9

Module according to claim 5, wherein said interconnection support carries conducting tracks on a lateral portion of a major surface thereof which receives said stack, a lowest component in the stack being offset with respect to an edge of said lateral portion.

Claim 10

Module according to claim 6, wherein said interconnection support carries additional conducting tracks on another major surface thereof opposed to said first-mentioned major surface which receives said stack, and connections are formed between said conducting tracks on said first-mentioned major surface and said additional conducting tracks by metal plated holes.

Claim 11

Module according to claim 6, further comprising connections with external circuits consisting of lengths of flexible wires bonded on said conducting tracks.

Claim 12

Memory module comprising: an interconnecting support; and a plurality of memory components, all having a same elongated shape and all mutually stacked in a same angular position; each said memory component having: a rectangular semiconductor substrate containing active memory circuits and having output.. terminals on a major surface; an insulating layer on said major surface,a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate; and a plurality of additional pads which are distributed between said connection pads and are devoid of connection leads, said additional pads constituting relays for bonding serially mounted short lengths of electrically insulated wire which constitute two successive said components being mutually offset by an amount sufficient for the connection pads and additional pads of one of said component to be located beyond the component located thereabove in the stack.

Claim 13

Memory module comprising: an interconnecting support; and a plurality of memory components, all having a same elongated shape and all mutually stacked in a same angular position; each said memory component having: a rectangular semiconductor substrate containing active memory circuits and having output.. terminals on a major surface; an insulating layer on said major surface,a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate; and a plurality of additional pads which are distributed between said connection pads and are devoid of connection leads, said additional pads constituting relays for bonding serially mounted short lengths of electrically insulated wire which constitute two successive said components being mutually offset by an amount sufficient for the connection pads and additional pads of one of said component to be located beyond the component located thereabove in the stack.