Electrode structure for semiconductor element

Abstract

Abstract PURPOSE:To improve the connecting strength to a substrate and the reliability of a semiconductor element by uniformly disposing electrodes at an equal interval, thereby plating on the electrodes in a uniform height. CONSTITUTION:Many solder bumps 3 are disposed as electrodes inside a bonding pad 2. These bumps 3 are formed to form a semiconductor element 1 not as a wire bonding but as general use as a face down bonding element in the same manner as a flip chip element. The bumps 3 are disposed uniformly at equal interval, and connected to the respective pads 2 via wirings 4 led from the pads 2. For example, total 3 solder dummy bumps 3a are formed at the right side of the drawing in such a manner that the intervals between the bumps 3 and the dummy bumps 3a and are formed in the same interval as that between other bumps 3, and the size and the like of the bumps 3a are formed in the same size as the bumps 3.

Inventors

• 👤 Keiji Miyamoto
• 👤 宮本　圭二
• 👤 Toru Kawanobe
• 👤 川野辺　徹

Bibliographic Details