US5469324A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated decoupling capacitive core for a printed circuit board and method of making same
Assignee: Storage Technology Corp
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Filing: 1994-10-07
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Granted: 1995-11-21
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Expires: 2014-10-07
Abstract
Abstract A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.
Inventors
- 👤 Watson R. Henderson
- 👤 Floyd G. Paurus
- 👤 Stanley R. Szerlip
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:26
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H05K1/02; H05K1/03; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0187; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K3/00; H05K3/46; H05K3/4611; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
104 words
A printed circuit board comprising: a planar first outer layer; a planar second outer layer; and a planar capacitive core disposed between said first and second outer layer, said capacitive core including a first electrically conductive layer, a second electrically conductive layer, a perforated sheet of dielectric material disposed between said first and second electrically conductive layers, wherein said dielectric material is a ceramic, and an adhesive filling perforations in said perforated sheet to bind said first electrically conductive layer to a first side of said perforated sheet and to bind said second electrically conductive layer to a second side of said perforated sheet.
Claim 2
Dependent Claim
104 words
A printed circuit board comprising: a planar first outer layer; a planar second outer layer; and a planar capacitive core disposed between said first and second outer layer, said capacitive core including a first electrically conductive layer, a second electrically conductive layer, a perforated sheet of dielectric material disposed between said first and second electrically conductive layers, wherein said dielectric material is a ceramic, and an adhesive filling perforations in said perforated sheet to bind said first electrically conductive layer to a first side of said perforated sheet and to bind said second electrically conductive layer to a second side of said perforated sheet.
Claim 3
Dependent Claim
23 words
The printed circuit board of claim 1, wherein said perforations account for approximately one half of the surface area of said perforated sheet.
Claim 4
Dependent Claim
34 words
The printed circuit board of claim 2, wherein each perforation has a diameter small enough to assure that said first and second electrically conductive sheets do not contact each other through said perforated sheet.
Claim 5
Dependent Claim
37 words
The printed circuit board of claim 3, wherein a thickness of said perforated sheet is equal to 0.003 inches and wherein each said perforation has a diameter not greater than twice said thickness of said perforated sheet.
Claim 6
Dependent Claim
14 words
The printed circuit board of claim 1, wherein said ceramic is lead zirconate titanate.
Claim 7
Dependent Claim
18 words
The printed circuit board of claim 5, wherein said first and second electrically conductive layers are copper foil.
Claim 8
Independent Claim
130 words
A method for manufacturing an integrated decoupling capacitive core for a printed circuit board, the method comprising the steps of: forming a dielectric material into a perforated sheet; applying an adhesive to a surface of said perforated sheet; squeegeeing said perforated sheet to force said adhesive into perforations in said perforated sheet and to remove excess adhesive from said surface of said perforated sheet; sandwiching said perforated sheet between first and second electrically conductive layers to form the capacitive core; applying pressure to the capacitive core to force any adhesive between said perforated sheet and said first electrically conductive layer and between said perforated sheet and said second electrically conductive layer to flow into said perforations in said perforated sheet; and curing said adhesive to bind the capacitive core together.
Claim 9
Independent Claim
130 words
A method for manufacturing an integrated decoupling capacitive core for a printed circuit board, the method comprising the steps of: forming a dielectric material into a perforated sheet; applying an adhesive to a surface of said perforated sheet; squeegeeing said perforated sheet to force said adhesive into perforations in said perforated sheet and to remove excess adhesive from said surface of said perforated sheet; sandwiching said perforated sheet between first and second electrically conductive layers to form the capacitive core; applying pressure to the capacitive core to force any adhesive between said perforated sheet and said first electrically conductive layer and between said perforated sheet and said second electrically conductive layer to flow into said perforations in said perforated sheet; and curing said adhesive to bind the capacitive core together.
Claim 10
Dependent Claim
83 words
A capacitive power distribution core for a primed circuit board, comprising: a first electrically conductive layer; a second electrically conductive layer; a perforated sheet of dielectric material disposed between said first and second electrically conductive layers, wherein said dielectric material is a ceramic; and an adhesive filling perforations in said perforated sheet to bind said first electrically conductive layer to a first side of said perforated sheet and to bind said second electrically conductive layer to a second side of said perforated sheet.
Claim 11
Dependent Claim
83 words
A capacitive power distribution core for a primed circuit board, comprising: a first electrically conductive layer; a second electrically conductive layer; a perforated sheet of dielectric material disposed between said first and second electrically conductive layers, wherein said dielectric material is a ceramic; and an adhesive filling perforations in said perforated sheet to bind said first electrically conductive layer to a first side of said perforated sheet and to bind said second electrically conductive layer to a second side of said perforated sheet.
Claim 12
Dependent Claim
24 words
The capacitive power distribution core of claim 8, wherein said perforations account for approximately one half of the surface area of said perforated sheet.
Claim 13
Dependent Claim
35 words
The capacitive power distribution core of claim 9, wherein each perforation has a diameter small enough to assure that said first and second electrically conductive sheets do not contact each other through said perforated sheet.
Claim 14
Dependent Claim
38 words
The capacitive power distribution core of claim 10, wherein a thickness of said perforated sheet is equal to 0.003 inches and wherein each said perforation has a diameter not greater than twice said thickness of said perforated sheet.
Claim 15
Dependent Claim
15 words
The capacitive power distribution core of claim 8, wherein said ceramic is lead zirconate titanate.
Claim 16
Dependent Claim
19 words
The capacitive power distribution core of claim 12, wherein said first and second electrically conductive layers are copper foil.
References Cited (Backward Citations)
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