US5162977A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board having an integrated decoupling capacitive element
Assignee: Hadco Corp
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Filing: 1991-08-27
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Granted: 1992-11-10
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Expires: 2011-08-27
Abstract
Abstract A printed circuit board is disclosed which includes a high capacitance power distribution core, the manufacture of which is compatible with standard printed circuit board assembly technology. The high capacitance core consists of a ground plane and a power plane separated by a planar element having a high dielectric constant. The high dielectric constant material is typically glass fiber impregnated with a bonding material, such as epoxy resin loaded with a ferro-electric ceramic substance having a high dielectric constant. The ferro-electric ceramic substance is typically a nanopowder combined with an epoxy bonding material. The resulting capacitance of the power distribution core is typically sufficient to totally eliminate the need for decoupling capacitors on a typical printed circuit board.
Inventors
- 👤 Floyd G. Paurus
- 👤 Archibald W. Smith
- 👤 Stanley R. Szerlip
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:02
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/023; H05K1/0231; H05K1/16; H05K1/162; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0242; H05K2201/0257; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
70 words
A printed circuit board comprising: a planar top outer layer; a planar bottom outer layer; and a planar capacitive core element disposed in parallel relation between said top outer layer and said bottom outer layer, said capacitive core element including an electrically conductive ground plane, and a dielectric plane disposed therebetween, said dielectric plane comprising a nanopowder-loaded electrically insulative material including a pre-fired ceramic powder having a high dielectric constant.
Claim 2
Dependent Claim
70 words
A printed circuit board comprising: a planar top outer layer; a planar bottom outer layer; and a planar capacitive core element disposed in parallel relation between said top outer layer and said bottom outer layer, said capacitive core element including an electrically conductive ground plane, and a dielectric plane disposed therebetween, said dielectric plane comprising a nanopowder-loaded electrically insulative material including a pre-fired ceramic powder having a high dielectric constant.
Claim 3
Dependent Claim
30 words
The printed circuit board of claim 1 wherein said capacitive core element comprises a plurality of dielectric planes, each of said dielectric planes being separated by an electrically conductive element.
Claim 4
Dependent Claim
26 words
The printed circuit board of claim 1, wherein at least one of said planar outer layers comprises means for interconnecting a plurality of components mounted thereupon.
Claim 5
Dependent Claim
41 words
The printed circuit board of claim 1, wherein said nanopowder loaded material comprises an insulating material loaded with a fine powder, said powder having a dielectric constant more than 10 times greater than a dielectric constant of said electrically insulative material.
Claim 6
Dependent Claim
39 words
The printed circuit board of claim 1, wherein said nanopowder loaded material comprises epoxy resin loaded with a fine powder, said powder having a dielectric constant more than 10 times greater than a dielectric constant of said epoxy resin.
Claim 7
Dependent Claim
21 words
The printed circuit board of claim 1, wherein said high dielectric constant of said pre-fired ceramic powder is greater than 500.
Claim 8
Dependent Claim
19 words
The printed circuit board of claim 1, wherein said dielectric plane medium has a dielectric constant greater than 50.
Claim 9
Dependent Claim
24 words
The printed circuit board of claim 1, wherein an average radius of a particle in said pre-fired ceramic powder is less than 1 micron.
Claim 10
Dependent Claim
16 words
The printed circuit board of claim 1, wherein said pre-fired ceramic powder comprises a ferro-electric material.
Claim 11
Dependent Claim
33 words
The printed circuit board of claim 1, wherein said pre-fired ceramic powder is a ferro-electric material selected from the group of materials having a Perovskite crystal structure comprising barium titanate and lead zirconate-titanate.
Claim 12
Dependent Claim
38 words
The printed circuit board of claim 10, wherein any of said materials in said group of materials having a Perovskite crystal structure are combined with an additive selected from the group comprising calcium, bismuth, iron, lanthanum, and strontium.
Claim 13
Dependent Claim
42 words
The printed circuit board of claim 1, wherein said pre-fired ceramic powder is a ferro-electric material selected from the group of materials having a tungsten-bronze crystal structure comprising lead meta-niobate, lead meta-tantalate, sodium barium niobate, potassium barium niobate, and rubidium barium niobate.
Claim 14
Dependent Claim
36 words
The printed circuit board of claim 12, wherein any of said materials in said group of materials having a tungsten-bronze crystal structure are combined with an additive selected from the group comprising bismuth, lanthanum, and strontium.
Claim 15
Dependent Claim
33 words
The printed circuit board of claim 1, wherein said pre-fired ceramic powder is a ferro-electric material having a Curie temperature equal to or greater than an operating temperature of said printed circuit board.
Claim 16
Dependent Claim
24 words
The printed circuit board of claim 14, wherein said Curie temperature of said ferro-electric material is between 50 degrees centigrade and 100 degrees centigrade.
Claim 17
Dependent Claim
30 words
The printed circuit board of claim 1, wherein said pre-fired ceramic powder is a para-electric material having a Curie temperature less than an operating temperature of said printed circuit board.
Claim 18
Dependent Claim
24 words
The printed circuit board of claim 16, wherein said Curie temperature of said para-electric material is between -70 degrees centigrade and 0 degrees centigrade.
Claim 19
Dependent Claim
30 words
The printed circuit board of claim 1, wherein said pre-fired ceramic powder is derived from a sol-gel composition, said sol-gel composition having been fired, and ground to said fine powder.
References Cited (Backward Citations)
US3673092A
Cited
US4558020A
Cited
US4490429A
Cited
US4882455A
Cited
US4987108A
Cited
US4775573A
Cited
US4908258A
Cited
US5010641A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-10 | 1996-05-11 | 1996-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-10 | 2000-05-11 | 2000-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-10 | 2004-05-11 | 2004-11-10 | $7700.00 | Window Closed / Lapsed |