Multilayer dielectric compositions comprising lead-barium borosilicate glass and ceramic powder

Claim 1

A dielectric composition comprising: a. about 60-40 percent by weight of a glass binder having an average particle size of about 1.0 - 9.0 microns, said glass binder consisting essentially of by weight % about: 30-40 percent SiO2; 8-12 percent B2O3; 10-15 percent Al2O3; 11-16 percent PbO; 20-25 percent BaO; and 0 - 3.0 percent TiO2; and b. about 60-40 percent by weight of a ceramic powder selected from the group consisting of ZrO2, Al2O3, TiO2, the zirconium silicates, and devitrified glass particles, and having an average particle size of about 1-10 microns; the amount and particle size of said glass binder and ceramic powder being correlated such that the ceramic powder substantially saturates the glass binder in that insufficient glass binder remains in Unsaturated form to wet the surfaces of a solderable conductor when said conductor is heat-sealed thereto at about at least the temperature at which the dielectric composition is fired and the resulting dielectric lamina formed from said composition is substantially free from pinholes and cracks.