Microelectronic capacitor material and method of fabrication

Claim 1

A METHOD OF FORMING A MICROELECTRONIC CAPACITOR DEVICE ON A DIELECTRIC SUBSTRATE WHICH INCLUDES THS STEPS OF: DEPOSITING A FIRST ELECTRODE MATERIAL ON THE SUBSTRATE AND FORMING A FIRST CAPACITOR ELECTRODE; MIXING A HIGH PERMITTIVITY DIELECTRIC MATERIAL TOGETHER WITH A GLASS BINDER MATERIAL TO FORM A RESULTANT MIXTURE THEREOF, SAID BINDER MATERIAL COMPRISING 5-15%, BY VOLUME, OF SAID MIXTURE; DISPERSING SAID RESULTANT MIXTURE IN A CARRIER VEHICLE TO FORM A PASTE, THE RATIO OF RESULTANT MIXTURE TO VEHICLE BEING APPROXIMATELY 70-30%, BY WEIGHT; PRINTING SAID PASTE ON SAID FIRST CAPACITOR ELECTRODE; FIRING SAID PASTE ON SAID FIRST CAPAITOR ELECTRODE AT A TEMPERATURE ABOVE THE SOFTENING POINT OF SAID GLASS BINDER MATERIAL BUT BELOW THE MELTING POINT OF SAID FIRST ELECTRODE MATERIAL FOR BINDING SAID MATERIALS TOGETHER AND FORMING A NON-POROUS DIELECTRIC COMPOSITION, SAID DIELECTRIC MATERIAL HAVING A SINTERING TEMPERATURE ABOVE AND SAID BINDER MATERIAL HAVING A SOFTENING POINT BELOW, THE MELTING POINT OF SAID FIRST ELECTRODE MATERIAL; AND DEPOSIRING A SECOND ELECTRODE MATERIAL ON SAID DIELECTRIC MATERIAL AND FORMING A SECOND CAPACITOR ELECTRODE.