Dielectric paste
Abstract
Abstract A dielectric paste for fabrication of multilayer ceramic substrates containing capacitive circuits. The paste comprises a dielectric powder composed of a dielectric material and a vitreous binder suspended in an organic vehicle. The dielectric material consists essentially of a composition expressed by the general formula: {(Ba.sub.1-x-y-z Sr.sub.x Ca.sub.y Mg.sub.z)O}.sub.m ·(Ti.sub.1-u Zr u )O 2 wherein x, y, z, u and m take values within the following respective ranges: 0≦x<0.30, 0≦y<0.30, 0≦z<0.05, 0≦u<0.25, 1≦m<1.03, and the vitreous binder consists essentially of a composition expressed by the general formula: αLi.sub.2 O·βBaO·γB.sub.2 O.sub.3 ·(1-α-β-γ)SiO 2 wherein α, β and γ are molar ratios of the respective ingredients and take values within the following respective ranges: 0≦α<0.25, 0.1≦β<0.5, 0.1<γ<0.5, and 0.3 <α+β+γ<0.8. The content of the vitreous binder in the dielectric powder ranges from not less than 5 wt % to less than 40 wt %.
Inventors
- 👤 Hiroshi Takagi
- 👤 Yoshiaki Mori
- 👤 Hiroji Tani
- 👤 Yukio Sakabe
Bibliographic Details
Claims Analysis
Total Claims: 9References Cited (Backward Citations)
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