Silicone release compositions

Claim 2

A release modifier which comprises (i) a MQ resin consisting essentially of units of the formulae SiO 2 (Q) and R 3 SiO 1/2 (M) wherein R is selected from the group consisting of a monovalent hydrocarbon group having up to 3 carbon atoms, a hydrogen atom and an alkenyl group of the formula --R'CH═CH 2 , wherein R' denotes an alkylene group of from 0 to 3 carbon atoms, provided there is at least one group --R'CH═CH 2 present per MQ molecule and (ii) a α,ω-diolefin having the general formula CH 2 ═CH--(CH 2 ) n --CH═CH 2 , wherein n denotes an integer with a value of from 4 to 18.

Claim 3

A release modifier according to claim 1 wherein the MQ resin has a ratio of M units to Q units of from 0.6/1 to 1.1/1.

Claim 4

A release modifier according to claim 1 wherein the alkenyl group is vinyl.

Claim 5

A release modifier according to claim 1 wherein the value of n in the α,ω-diolefin is from 6 to 12.

Claim 6

A release modifier according to claim 1 which is solventless and also comprises a linear alkenyl-substituted polydimethylsiloxane material.

Claim 7

A release modifier according to claim 1 which is solventless and also comprises a cure inhibitor.

Claim 8

A release modifier according to claim 1 which is solventless and also comprises a catalyst.

Claim 9

A release modifier according to claim 1 which comprises from 40 to 80% by weight of the MQ resin and from 10 to 50% of the α,ω-diolefin.

Claim 10

A solventless release composition comprising (A) a release modifier which comprises (i) a MQ resin consisting essentially of units of the formulae SiO 2 (Q) and R 3 SiO 1/2 (M) wherein R is selected from the group consisting of a monovalent hydrocarbon group having up to 3 carbon atoms, a hydrogen atom and an alkenyl group of the formula --R' CH═CH 2 , wherein R' denotes an alkylene group of from 0 to 3 carbon atoms, provided there is at least one group --R'CH═CH 2 present per MQ molecule and (ii) a α,w-diolefin having the general formula CH 2 ═CH--(CH 2 ) n --CH═CH 2 , wherein n denotes an integer with a value of from 4 to 18; (B) an organosilicon compound having at least three silicon-bonded hydrogen atoms per molecule; (C) an effective amount of a precious metal catalyst capable of promoting the addition reaction between alkenyl or oxyalkenyl groups and silicon-bonded hydrogen groups and (D) optionally a diorganopolysiloxane having at least 2 alkenyl-functional silicon-bonded substituents.

Claim 11

A solventless release composition comprising (A) a release modifier which comprises (i) a MQ resin consisting essentially of units of the formulae SiO 2 (Q) and R 3 SiO 1/2 (M) wherein R is selected from the group consisting of a monovalent hydrocarbon group having up to 3 carbon atoms, a hydrogen atom and an alkenyl group of the formula --R' CH═CH 2 , wherein R' denotes an alkylene group of from 0 to 3 carbon atoms, provided there is at least one group --R'CH═CH 2 present per MQ molecule and (ii) a α,w-diolefin having the general formula CH 2 ═CH--(CH 2 ) n --CH═CH 2 , wherein n denotes an integer with a value of from 4 to 18; (B) an organosilicon compound having at least three silicon-bonded hydrogen atoms per molecule; (C) an effective amount of a precious metal catalyst capable of promoting the addition reaction between alkenyl or oxyalkenyl groups and silicon-bonded hydrogen groups and (D) optionally a diorganopolysiloxane having at least 2 alkenyl-functional silicon-bonded substituents.

Claim 12

A solventless release composition according to claim 9 wherein the organosilicon compound (B) is selected from the group consisting of compounds having the general formula R 2 2 R 3 SiO--[R 2 2 SiO] m --[R 2 HSiO] n --SiR 2 2 R 3 and compounds having the general formula ##STR2## wherein R 2 is selected from the group consisting of alkyl and aryl groups having up to 8 carbon atoms, R 3 is selected from the group consisting of a group R 2 and a hydrogen atom, m has a value of from 0 to 20, n has a value of from 1 to 70, and there are at least 3 silicon-bonded hydrogen atoms present.

Claim 13

A solventless release composition according to claim 9 wherein the number ratio of SiH/alkenyl is from 1.1/1 to 1.8/1.

Claim 14

A solventless release composition according to claim 9 wherein Component (D) is present and its alkenyl groups are vinyl groups.

Claim 15

A solventless release composition according to claim 9 wherein Component (D) is a polydiorganosiloxane having the general formula X 2 Y°SiO--[X 2 SiO] x --[XYSiO] y --SiX 2 Y°, wherein each X independently is selected from the group consisting of a phenyl radical and a saturated hydrocarbon group having 1 to 6 carbon atoms, at least 90% of all X groups being methyl groups, Y denotes an alkenyl group having up to 6 carbon atoms, Y° is selected from the group consisting of a group Y and a group X and the average value of the sum total of x and y is such that the resulting viscosity of the polydiorganosiloxane is at least 10 mPa.s at 25° C.

Claim 16

A solventless release coating according to claim 13 wherein each alkenyl group Y in component (D) is selected from the group consisting of vinyl and hexenyl.

Claim 17

A solventless release composition according to claim 9 wherein the weight percentage of component (A) based on the total weight of components (A), (C) and (D) combined is from 10 to 80%.

Claim 18

A solventless release composition according to claim 9 which also comprises one or more ingredients selected from the group consisting of cure inhibitors and bath life extenders.

Claim 19

A solventless release composition according to claim 9 which is stored by keeping components (A) and (C) separate from component (B).

Claim 20

A process of coating a substrate comprising applying to the substrate a solventless release composition according to claim 9 and thereafter causing the composition to cure.

Claim 21

A process according to claim 18 wherein the substrate is flexible and the composition is applied to the substrate in a layer of 0.1 to 2.0 grams per square meter of surface.

Claim 22

A process according to claim 18 wherein the curing is effected by heating the coated substrate to a temperature below 200° C.