US5463247A
Expired / Lapsed
US
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Lead frame material formed of copper alloy for resin sealed type semiconductor devices
Assignee: Mitsubishi Shindoh Co Ltd
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Filing: 1994-02-15
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Granted: 1995-10-31
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Expires: 2014-02-15
Abstract
Abstract There is provided a lead frame material formed of a Cu alloy for a resin sealed type semiconductor device, wherein the Cu alloy consists essentially of 2 to 4% Ni, more than 0.5 to 1%, Si, 0.1 to 2% Zn, more than 0.01 to 0.05%, Mg, 0.05 to 1% Sn, and the balance of Cu and inevitable impurities, the inevitable impurities containing 20 ppm or less sulfur (S) and 20 ppm or less carbon (C). The lead frame material formed of the Cu alloy has improved adhesion strength to an epoxy resin as a sealing material. A semiconductor device prepared from said lead frame material is also provided.
Inventors
- 👤 Rensei Futatsuka
- 👤 Shunichi Chiba
- 👤 Junichi Kumagai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:24
CPC Classifications
C; C22; C22C; C22C9/00; C22C9/06; H; H10; H10W; H10W70/00; H10W70/40; H10W70/456
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
73 words
A lead frame material formed of a CU alloy for use in a resin sealed type semiconductor device, wherein said Cu alloy consists essentially, by weight percent, of 2.0 to 3.8% Ni, 0.51 to 0.9% Si, 0.2 to 1.5% Zn, 0.015 to 0.03% Mg, 0.15 to 0.8% Sn, and the balance being Cu and inevitable impurities, said inevitable impurities containing 15 ppm or less sulfur (S) and 10 ppm or less carbon (C).
Claim 2
Dependent Claim
73 words
A lead frame material formed of a CU alloy for use in a resin sealed type semiconductor device, wherein said Cu alloy consists essentially, by weight percent, of 2.0 to 3.8% Ni, 0.51 to 0.9% Si, 0.2 to 1.5% Zn, 0.015 to 0.03% Mg, 0.15 to 0.8% Sn, and the balance being Cu and inevitable impurities, said inevitable impurities containing 15 ppm or less sulfur (S) and 10 ppm or less carbon (C).
Claim 3
Dependent Claim
35 words
The lead frame material of claim 1, wherein said copper alloy consists essentially of 2.50% Ni, 0.78% Si, 0.93% Zn, 0.025% Mg, 0.51% Sn, 10 ppm S, 4 ppm C, and the balance being copper.
Claim 4
Dependent Claim
35 words
The lead frame material of claim 1, wherein aid copper alloy consists essentially of 2.46% Ni, 0.54% Si, 1.04% Zn, 0.016% Mg, 0.54% Sn, 4 ppm S, 2 ppm C, and the balance being copper.
Claim 5
Dependent Claim
68 words
In a semiconductor device having leads, the improvement comprising said leads comprising a Cu alloy which consists essentially, by weight percent, of 2.0 to 3.8% Ni, 0.51 to 0.9% Si, 0.2 to 1.5% Zn, 0. 015 to 0.03% Mg, 0.15 to 0.8% Sn, and the balance being Cu and inevitable impurities, said inevitable impurities containing 15 ppm or less sulfur (S) and 10 ppm or less carbon (C).
Claim 6
Dependent Claim
68 words
In a semiconductor device having leads, the improvement comprising said leads comprising a Cu alloy which consists essentially, by weight percent, of 2.0 to 3.8% Ni, 0.51 to 0.9% Si, 0.2 to 1.5% Zn, 0. 015 to 0.03% Mg, 0.15 to 0.8% Sn, and the balance being Cu and inevitable impurities, said inevitable impurities containing 15 ppm or less sulfur (S) and 10 ppm or less carbon (C).
Claim 7
Dependent Claim
34 words
The lead frame material of claim 1, wherein said copper alloy consists essentially of 2.53% Ni, 0.52% Si, 0.98% Zn, 0.023% Mg, 0.56% Sn, 3 ppm S, 3 ppm C, and the balance copper.
Claim 8
Dependent Claim
34 words
The semiconductor device of claim 4, wherein said copper alloy consists essentially of 2.53% Ni, 0.52% Si, 0.98% Zn, 0.023% Mg, 0.56% Sn, 3 ppm S, 3 ppm C, and the balance being copper.
Claim 9
Dependent Claim
34 words
The semiconductor device of claim 4, wherein said copper alloy consists essentially of 2.50% Ni, 0.78% Si, 0.93% Zn, 0.025% Mg, 0.51% Sn, 10 ppm S, 4 ppm C, and the balance being copper.
Claim 10
Dependent Claim
34 words
The semiconductor device of claim 4, wherein said copper alloy consists essentially of 2.46% Ni, 0.54% Si, 1.04% Zn, 0.016% Mg, 0.54% Sn, 4 ppm S, 2 ppm C, and the balance being copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-30 | 1999-05-01 | 1999-10-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-30 | 2003-05-01 | 2003-10-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-30 | 2007-05-01 | 2007-10-31 | $7700.00 | Window Closed / Lapsed |