US4822560A
Expired / Lapsed
US
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Copper alloy and method of manufacturing the same
Assignee: Furukawa Electric Co Ltd
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Filing: 1986-10-08
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Granted: 1989-04-18
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Expires: 2006-10-08
Abstract
Abstract A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800 DEG to 950 DEG C., the alloy is cooled by passage through a region of 800 DEG to 400 DEG C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400 DEG to 650 DEG C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.
Inventors
- 👤 Yoshimasa Oyama
- 👤 Masato Asai
- 👤 Toru Tanigawa
- 👤 Shigeo Shinozaki
- 👤 Shoji Shiga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:00
CPC Classifications
C; C22; C22C; C22C9/00; H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; C22C9/02; C22F; C22F1/00; C22F1/08; H01; H01B; H01B1/00; H01B1/02; H01B1/026
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
68 words
An alloy consisting essentially of 0.09 to 0.4 wt.% of Cr, 0.01 to 8 wt.% of Sn, 0.001 to 5 wt.% in total of at least one of 0.001 to 5 wt.% of Zn, 0.001 to 0.5 wt.% of Mn and 0.001 to 0.2 wt.% of Mg and the balance being Cu, and wherein the content of O 2 in said alloy is not more than 0.005 wt.%.
Claim 2
Dependent Claim
68 words
An alloy consisting essentially of 0.09 to 0.4 wt.% of Cr, 0.01 to 8 wt.% of Sn, 0.001 to 5 wt.% in total of at least one of 0.001 to 5 wt.% of Zn, 0.001 to 0.5 wt.% of Mn and 0.001 to 0.2 wt.% of Mg and the balance being Cu, and wherein the content of O 2 in said alloy is not more than 0.005 wt.%.
Claim 3
Dependent Claim
16 words
The alloy according to claim 1, wherein the content of Cr is 0.15 to 0.4 wt.%.
Claim 4
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 2.
Claim 5
Dependent Claim
16 words
The alloy according to claim 2, wherein the content of Sn is 0.05 to 4 wt.%.
Claim 6
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 4.
Claim 7
Dependent Claim
17 words
The alloy according to claim 1, wherein the content of P is not more than 0.02 wt.%.
Claim 8
Dependent Claim
16 words
The alloy according to claim 6, wherein the content of P is 0.0001 to 0.001 wt.%.
Claim 9
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 7.
Claim 10
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 6.
Claim 11
Dependent Claim
19 words
The alloy according to claim 1, wherein the content of of O 2 is not more than 0.0025 wt.%.
Claim 12
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 10.
Claim 13
Dependent Claim
17 words
The alloy according to claim 1, wherein the content of S is not more than 0.001 wt.%.
Claim 14
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 12.
Claim 15
Dependent Claim
16 words
The alloy according to claim 1, wherein the content of Sn is 0.05 to 0.5 wt.%.
Claim 16
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 14.
Claim 17
Dependent Claim
28 words
The alloy according to claim 1, wherein said alloy contains precipitates or inclusions not smaller than 5 microns, and having not more than 10 3 /mm 2 thereof.
Claim 18
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 16.
Claim 19
Dependent Claim
85 words
The alloy according to claim 1, consisting essentially of 0.09 to 0.4 wt.% of Cr, 0.05 to 6 wt.% of Sn and 0.005 to 1 wt.% in total of at least one of 0.01 to 1 wt.% of Zn, 0.01 to 0.2 wt.% of Mn and 0.005 to 0.1 wt.% of Mg, and wherein the content of P is 0.0001 to 0.005 wt.%, the content of O 2 is not more than 0.0025 wt.% and the content of S is not more than 0.001 wt.%.
Claim 20
Dependent Claim
16 words
The alloy according to claim 18, wherein the content of Sn is 0.05 to 3 wt.%.
Claim 21
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 19.
Claim 22
Dependent Claim
16 words
The alloy according to claim 18, wherein the content of Sn is 0.05 to 0.5 wt.%.
Claim 23
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 21.
Claim 24
Dependent Claim
16 words
The alloy according to claim 18, wherein the content of Ni is 0.05 to 0.5 wt.%.
Claim 25
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 23.
Claim 26
Dependent Claim
15 words
An alloy material for electric or electronic instruments having the composition according to claim 18.
Claim 27
Dependent Claim
12 words
A lead for a semiconductor having the composition according to claim 18.
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JPS619385A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-17 | 1992-10-17 | 1993-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-17 | 1996-10-17 | 1997-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-17 | 2000-10-17 | 2001-04-18 | $7700.00 | Window Closed / Lapsed |