Circuit board for optical devices

Claim 2

An optical circuit board for adapted mounting one or more LSI chips for emitting and/or receiving light, comprising: a transparent substrate; a window portion which is formed as a slit-like transparent region of said transparent substrate for transmitting light coming in and going out of said LSI chip; a plurality of electrodes provided on a first primary surface of said transparent substrate corresponding to said LSI chip respectively and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate; wherein each of said aggregated electrodes is electrically connected with a plurality of electrodes which constitute a part of said electrodes through said electrical connection portion, respectively.

Claim 3

The optical circuit board according to claim 1, wherein said electrode is composed of at least one metal selected from the group consisting of gold, silver, copper, nickel, chromium, tungsten, tin, lead, solder, and an alloy thereof.

Claim 4

The optical circuit board according to claim 1, wherein said electrode is composed of a laminate having a first metal layer and a second metal layer formed on said first metal layer.

Claim 5

The optical circuit board according to claim 3, wherein each of said first and second metal layers is composed of at least one metal selected from the group consisting of gold, silver, copper, nickel, chromium, tungsten, tin, lead, solder, and an alloy thereof; and said second metal layer is formed in such a manner that one or more LSI chips can be mounted thereon by press-bonding and can be mounted thereon by heat-bonding.

Claim 6

The optical circuit board according to claim 4, wherein said second metal layer is formed by plating using at least one material selected from a group consisting of gold and solder.

Claim 7

The optical circuit board according to claim 4, wherein said second metal layer is formed by printing using at least one material selected from a group consisting of a gold, silver and solder layer.

Claim 8

The optical circuit board according to claim 1, wherein said aggregated electrode is composed of at least one metal selected from the group consisting of gold, silver, copper, nickel, chromium, tungsten, tin, lead, solder, and an alloy thereof.

Claim 9

The optical circuit board according to claim 1, wherein a plurality of external connection terminals electrically connected with said plurality of aggregated electrodes respectively are provided on a primary surface of said transparent substance, said transparent substrate including said first primary surface and said second primary surface.

Claim 10

The optical circuit board according to claim 8, wherein said external connection terminal is composed of at least one metal selected from the group consisting of gold, silver, copper, nickel, chromium, tungsten, tin, lead, solder, and an alloy thereof.

Claim 11

The optical circuit board according to claim 9, wherein said external connection terminal is provided on the first primary surface, and the electrical connection portion for electrically connecting each said external connection terminal and each said aggregated electrode is provided penetrating through said transparent substrate.

Claim 12

The optical circuit board according to claim 1, wherein a common electrode to which a plurality of electrodes which constitute a part of said electrodes are commonly connected and an external connection terminal to be electrically connected to said common electrode, are both provided on said first primary surface.

Claim 13

The optical circuit board according to claim 1, wherein a common electrode to which a plurality of electrodes which constitute a part of said electrodes are commonly connected is provided on said first primary surface, a plurality of external connection terminals are provided on a primary surface of said transparent substrate, said transparent substrate including said first and second primary surfaces, and each of the said external connection terminals is electrically connected with each of said aggregated electrodes and said common electrode.

Claim 14

The optical circuit board according to claim 1, wherein a shading layer for defining said window portion and preventing the light passing through an area other than said window portion in the transparent substrate is provided on a primary surface of said transparent substrate including said first and second primary surfaces bordering on said window portion.

Claim 15

The optical circuit board according to claim 1, wherein a shading layer for defining said window portion and preventing the light passing through an area other than said window portion in the transparent substrate is provided on said first primary surface in opposite relationship to said metal electrodes interposing said window portion bordering thereon.

Claim 16

The optical circuit board according to claim 1, wherein a shading layer for defining said window portion and preventing the light passing through the area other than said window portion in said transparent substrate is provided on said first primary surface so as to be disposed on said metal electrodes and on each space between neighboring metal electrodes.

Claim 17

The optical circuit board according to claim 13, wherein said shading layer is composed of metal.

Claim 18

The optical circuit board according to claim 13, wherein said shading layer is composed of the resin containing carbon black particles or color pigment components.

Claim 19

The optical circuit board according to claim 1, wherein a conductive antistatic layer is provided on said second primary surface.

Claim 20

The optical circuit board according to claim 18, wherein said antistatic layer is composed of a member having a shading property and provided so as to define said window portion while preventing the light passing through an area other than said window portion in said transparent substrate.

Claim 21

The optical circuit board according to claim 19, wherein said antistatic layer is composed of metal.

Claim 22

The optical circuit board according to claim 19, wherein said antistatic layer is composed of a resin having particles selected from a grove consisting of carbon black and metal particles dispersed therein.

Claim 23

The optical circuit board according to claim 19, wherein said antistatic layer is formed so as to enclose the circumference of said window portion.

Claim 24

The optical circuit board according to claim 19, wherein said antistatic layer is provided extending in the longitudinal direction of said window portion being disposed on both sides thereof.

Claim 25

The optical circuit board according to claim 1, further comprising a light guide provided on said second primary surface for guiding the light from said window portion and to said window portion.

Claim 26

The optical circuit board according to claim 1, wherein a low reflection layer is provided in the bonding interface between said electrode and said transparent substrate.

Claim 27

The optical circuit board according to claim 1, wherein a low reflection layer is provided in the bonding interface between said aggregated electrode and said transparent substrate.

Claim 28

The optical circuit board according to claim 13, wherein a low reflection layer is provided in the bonding interface between said shading layer and said transparent substrate.

Claim 29

The optical circuit board according to claim 19, wherein a low reflection layer is provided in the bonding interface between said antistatic layer and said transparent substrate.

Claim 30

The optical circuit board according to any one of claims 25, 26, 27 and 28, wherein the light reflectance of said low reflection layer is 50% or less.

Claim 31

The optical circuit board according to any one of claims 25, 26, 27 and 28, wherein said low reflection layer is composed of one material selected from a group consisting of a metal, a metal compound, resin and an organic compound.

Claim 32

The optical circuit board according to claim 1, wherein a transparent protection layer is provided on said second primary surface in such a manner that the protection layer covers said window portion.

Claim 33

The optical circuit board according to claim 19, wherein a transparent protection layer is provided on said second primary surface for protecting portions of the second primary surface such as said window portion and said antistatic layer.

Claim 34

The optical circuit board according to claim 1, wherein said transparent substrate is composed of a flexible film-like material.

Claim 35

The optical circuit board according to claim 33, wherein said transparent substrate is composed of at least one selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyamide, polyether, polysulfone, polyethersulfone, polycarbonate, polyarylate, polyetherimide, polyether etherketone, polyimide, polyparabanic acid, and copolymer thereof.

Claim 36

The optical circuit board according to claim 33, wherein the thickness of said transparent substrate is in the range of 5 to 500 μm.

Claim 37

The optical circuit board according to claim 33, wherein the thickness of said transparent substrate is in the range of 10 to 200 μm.

Claim 38

The optical circuit board according to claim 33, wherein the thickness of said transparent substrate is in the range of 20 to 50 μm.

Claim 39

An optical circuit board adapted for mounting thereon one or more optical reading LSI chips with connection bumps used in an optical reader for optically reading a manuscript, comprising: a transparent substrate; a window portion which is formed as a slit-shaped transparent region of said transparent substrate for transmitting the light incident upon said reading devices; a plurality of electrodes provided on a first primary surface of said transparent substrate to be used for electrical connection with said LSI chip respectively and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being disposed opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate; wherein said circuit board is disposed with the longitudinal direction of said window portion traversing the direction of the relative movement of said manuscript exercised with reference to said optical reader; and each of said aggregated electrodes is electrically connected with a plurality of electrodes which constitute a part of said electrodes, through said electrical connection portion.

Claim 40

An optical circuit board adapted for mounting thereon one or more optical reading LSI chips with connection bumps used in an optical reader for optically reading a manuscript, comprising: a transparent substrate; a window portion which is formed as a slit-shaped transparent region of said transparent substrate for transmitting the light incident upon said reading devices; a plurality of electrodes provided on a first primary surface of said transparent substrate to be used for electrical connection with said LSI chip respectively and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being disposed opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate; wherein said circuit board is disposed with the longitudinal direction of said window portion traversing the direction of the relative movement of said manuscript exercised with reference to said optical reader; and each of said aggregated electrodes is electrically connected with a plurality of electrodes which constitute a part of said electrodes, through said electrical connection portion.

Claim 41

An optical circuit board adapted for mounting one or more optical image forming LSI chips with connection bumps used in an optical image forming apparatus for optically forming an image with reference to photosensitive matter, comprising: a transparent substrate; a window portion which is formed as a slit-shaped transparent region of said transparent substrate for transmitting the light emitted from said optical image forming LSI chip; a plurality of electrodes provided on a first primary surface of said transparent substrate to be used for electrical connection with said optical image forming LSI chip, respectively, and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being disposed opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate; wherein said circuit board is placed with the longitudinal direction of said window portion traversing the direction in which the relative movement between said photosensitive matter and said optical image forming apparatus occurs; and each of said aggregated electrodes is electrically connected with a plurality of electrodes which are included in said electrodes through said electrical connection portion, respectively.

Claim 42

An optical circuit board adapted for mounting one or more optical image forming LSI chips with connection bumps used in an optical image forming apparatus for optically forming an image with reference to photosensitive matter, comprising: a transparent substrate; a window portion which is formed as a slit-shaped transparent region of said transparent substrate for transmitting the light emitted from said optical image forming LSI chip; a plurality of electrodes provided on a first primary surface of said transparent substrate to be used for electrical connection with said optical image forming LSI chip, respectively, and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being disposed opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate; wherein said circuit board is placed with the longitudinal direction of said window portion traversing the direction in which the relative movement between said photosensitive matter and said optical image forming apparatus occurs; and each of said aggregated electrodes is electrically connected with a plurality of electrodes which are included in said electrodes through said electrical connection portion, respectively.