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Patent US5459081A successfully refreshed from Google Patents.
US5459081A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for transferring a device to a substrate by viewing a registration pattern
Assignee: NEC Corp
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Filing: 1994-12-16
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Granted: 1995-10-17
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Expires: 2014-12-16
Abstract
Abstract In a device fabrication method, there are prepared a first substrate having registration patterns formed thereon and a second substrate having through bores formed therein and devices formed thereon through a separation layer. The two substrates are overlapped by viewing the registration patterns through the through bores. After the first substrate and the devices formed on the second substrate have been bonded, the devices are separated from the second substrate by selectively etching the separation layer, and are transferred to the first substrate.
Inventors
- 👤 Mikihiro Kajita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:29
CPC Classifications
H; H10; H10F; H10F55/00; H10F55/20; H10F55/25; H10F55/255; H10W; H10W46/00; H01; H01S; H01S5/00; H01S5/02; H01S5/0206; H01S5/0215; H01S5/0217; H01S5/026; H01S5/0262; H01S5/10; H01S5/18; H01S5/183; H01S5/18305; H01S5/40; H01S5/42; H01S5/423; H10W46/601; Y; Y10; Y10S; Y10S438/00; Y10S438/975
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
87 words
A device fabrication method using direct-bonding, the method comprising the steps of: preparing a first substrate on which at least one registration pattern is formed; preparing a second substrate in which at least one through bore is formed corresponding to at least one registration pattern and on which at least one device is formed; overlapping the first and second substrates by viewing at least one registration pattern through at least one through bore; and transferring at least one device from the second substrate to the first substrate.
Claim 2
Independent Claim
87 words
A device fabrication method using direct-bonding, the method comprising the steps of: preparing a first substrate on which at least one registration pattern is formed; preparing a second substrate in which at least one through bore is formed corresponding to at least one registration pattern and on which at least one device is formed; overlapping the first and second substrates by viewing at least one registration pattern through at least one through bore; and transferring at least one device from the second substrate to the first substrate.
Claim 3
Dependent Claim
48 words
The device fabrication method as set forth in claim 1, wherein at least one device is formed on the second substrate through a separation layer, and at least one device is transferred from the second substrate to the first substrate by selectively removing the separation layer by etching.
Claim 4
Dependent Claim
24 words
The device fabrication method as set forth in claim 1, wherein at least one other device has already been formed on the first substrate.
Claim 5
Independent Claim
102 words
A device fabrication method using direct-bonding, the method comprising the steps of: forming at least one registration pattern on a first substrate; forming at least one through bore in a second substrate corresponding to at least one registration pattern; forming at least one device on the second substrate through a separation layer; overlapping the first and second substrates by viewing at least one registration pattern through at least one through bore, and bonding the first substrate and at least one device together; and separating at least one device from the second substrate by selectively etching the separation layer of the second substrate.
Claim 6
Independent Claim
102 words
A device fabrication method using direct-bonding, the method comprising the steps of: forming at least one registration pattern on a first substrate; forming at least one through bore in a second substrate corresponding to at least one registration pattern; forming at least one device on the second substrate through a separation layer; overlapping the first and second substrates by viewing at least one registration pattern through at least one through bore, and bonding the first substrate and at least one device together; and separating at least one device from the second substrate by selectively etching the separation layer of the second substrate.
Claim 7
Dependent Claim
24 words
The device fabrication method as set forth in claim 4, wherein at least one other device has already been formed on the first substrate.
Claim 8
Independent Claim
117 words
A device fabrication method using direct-bonding, the method comprising the steps of: preparing a first substrate on which at least one first device and at least one registration pattern are formed; preparing a second substrate on which at least one second device is formed through a separation layer and in which at least one through bore is formed corresponding to at least one registration pattern; overlapping the first and second substrates by viewing at least one registration pattern through at least one through bore, and bonding the first substrate and at least one second device together; and separating at least one second device from the second substrate by selectively etching the separation layer of the second substrate.
Claim 9
Independent Claim
117 words
A device fabrication method using direct-bonding, the method comprising the steps of: preparing a first substrate on which at least one first device and at least one registration pattern are formed; preparing a second substrate on which at least one second device is formed through a separation layer and in which at least one through bore is formed corresponding to at least one registration pattern; overlapping the first and second substrates by viewing at least one registration pattern through at least one through bore, and bonding the first substrate and at least one second device together; and separating at least one second device from the second substrate by selectively etching the separation layer of the second substrate.
Claim 10
Dependent Claim
39 words
The device fabrication method as set forth in claim 6, wherein the first device comprises a light-emitting device having a certain lasing wavelength and the second device comprises a light-emitting device different in lasing wavelength from the first device.
Claim 11
Dependent Claim
31 words
The device fabrication method as set forth in claim 7, wherein the first device comprises a light-emitting device having a certain lasing wavelength and the second device comprises a light-receiving device.
Claim 12
Dependent Claim
41 words
The device fabrication method as set forth in claim 8, wherein the first device comprises a light-emitting device having a certain lasing wavelength and the second device comprises a light-receiving device having a receiving wavelength different from the certain lasing wavelength.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-16 | 1999-04-17 | 1999-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-16 | 2003-04-17 | 2003-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-16 | 2007-04-17 | 2007-10-17 | $7700.00 | Window Closed / Lapsed |