US3762040A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming circuit crossovers
Assignee: AT&T Inc
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Filing: 1971-10-06
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Granted: 1973-10-02
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Expires: 1991-10-06
Abstract
Abstract Crossovers are fabricated by forming a conductive element on a carrier member and deforming selected portions of the conductive element into arches. The arches are formed either prior to or during bonding so that after bonding the arches cross over any intervening circuit elements. The carrier member is associated with a backing member having slots at those portions of the conductive element which are to be formed into arches. Deformation of the conductive elements into the slots is employed to form the arches. An intermediate material can be used to separate the conductive element from the circuit patterns at selected crossover points so that the conductive element is deformed into the slots during bonding. Or, the conductive elements can be deformed into the slots prior to bonding.
Inventors
- 👤 J Burns
- 👤 A Coucoulas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 21:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H01; H01R; H01R12/00; H01R12/70; H01R12/71; H01R12/712; H01R12/714; H05; H05K; H05K3/00; H05K3/46; H05K3/4685; H10W70/099; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49155
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
103 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: attaching a carrier member to a backing member having a slot therein; forming a conductive element on said carrier member with a selected portion of the conductive element adjacent said slot; deforming said selected portion of said conductive element into said slot to form a crossover arch; aligning said conductive element with bonding sites on the circuit pattern, said arch crossing over any intervening circuit elements; applying sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thereto.
Claim 2
Independent Claim
103 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: attaching a carrier member to a backing member having a slot therein; forming a conductive element on said carrier member with a selected portion of the conductive element adjacent said slot; deforming said selected portion of said conductive element into said slot to form a crossover arch; aligning said conductive element with bonding sites on the circuit pattern, said arch crossing over any intervening circuit elements; applying sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thereto.
Claim 3
Dependent Claim
68 words
The method of claim 1 wherein the carrier member is a polyimide capable of absorbing water, including the steps of: adjusting the amount of water absorbed by the carrier member prior to bonding, the amount of water absorbed determining the adhesion strength between the carrier member and the conductive element after bonding; and stripping the carrier member from the crossover to test bond strength at each bonding site.
Claim 4
Independent Claim
109 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: depositing an intermediate material on intervening circuit elements in those areas which are to be crossed over, aligning a conductive element with bonding sites on the circuit pattern, a selected portion of said conductive element passing over said intermediate material, the intermediate material spacing the selected portion of the conductive element from the intervening circuit elements, applying sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thEreto, said intermediate material deforming the selected portion of the conductive element to form a crossover arch.
Claim 5
Independent Claim
109 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: depositing an intermediate material on intervening circuit elements in those areas which are to be crossed over, aligning a conductive element with bonding sites on the circuit pattern, a selected portion of said conductive element passing over said intermediate material, the intermediate material spacing the selected portion of the conductive element from the intervening circuit elements, applying sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thEreto, said intermediate material deforming the selected portion of the conductive element to form a crossover arch.
Claim 6
Dependent Claim
54 words
The method of claim 3, including the steps of: attaching a carrier member to a backing member having a slot therein; and forming the conductive element on said carrier member with the selected portion of said conductive element overlying said slot, said deforming step including the deformation of the selected portion into said slot.
Claim 7
Dependent Claim
67 words
The method of claim 4 wherein the carrier member is a polyimide capable of absorbing water, including the steps of: adjusting the amount of water absorbed by the carrier member prior to bonding, the amount of water absorbed determining the strength between the carrier member and the conductive element after bonding; and stripping the carrier member from the crossover to test bond strength at each bonding site.
Claim 8
Dependent Claim
25 words
The method of claim 3 wherein the intermediate material is a dielectric material which is left between the crossover arch and any intervening circuit elements.
Claim 9
Dependent Claim
17 words
The method of claim 3 including the additional step of removing the intermediate material subsequent to bonding.
Claim 10
Independent Claim
133 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: depositing an intermediate material on a selected portion of a conductive element, aligning said conductive element with bonding sites on the circuit pattern, said selected portion of said conductive element and said intermediate material deposited therein being located adjacent intervening circuit elements of the circuit pattern said intermediate material being interposed between said selected portion of the conductive element and said intervening circuit elements, the intermediate material spacing the selected portion of the conductive element from the intervening circuit element, applying sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thereto, said intermediate material deforming the selected portion of the conductive element to form a crossover arch.
Claim 11
Independent Claim
133 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: depositing an intermediate material on a selected portion of a conductive element, aligning said conductive element with bonding sites on the circuit pattern, said selected portion of said conductive element and said intermediate material deposited therein being located adjacent intervening circuit elements of the circuit pattern said intermediate material being interposed between said selected portion of the conductive element and said intervening circuit elements, the intermediate material spacing the selected portion of the conductive element from the intervening circuit element, applying sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thereto, said intermediate material deforming the selected portion of the conductive element to form a crossover arch.
Claim 12
Dependent Claim
54 words
The method of claim 8, including the steps of: attaching a carrier member to a backing member having a slot therein; and forming the conductive element on said carrier member with the selected portion of said conductive element overlying said slot, said deforming step including the deformation of the selected portion into said slot.
Claim 13
Dependent Claim
69 words
The method of claim 9 wherein the carrier member is a polyimide capable of absorbing water, including the steps of: adjusting the amount of water absorbed by the carrier member prior to bonding, the amount of water absorbed determining the strength of attachment between the carrier member and the conductive element after bonding; and stripping the carrier member from the crossover to test bond strength at each bonding site.
Claim 14
Dependent Claim
25 words
The method of claim 8 wherein the intermediate material is a dielectric material which is left between the crossover arch and any intervening circuit elements.
Claim 15
Dependent Claim
17 words
The method of claim 8 including the additional step of removing the intermediate material subsequent to bonding.
Claim 16
Independent Claim
157 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: forming a conductive element on the first surface of a carrier member having first and second opposite surfaces; depositing an intermediate material on intervening circuit elements in those areas which are to be crossed over; placing the first surface of the carrier member against the circuit pattern and aligning said conductive element with bonding sites on the circuit pattern, a selected portion of said conductive element passing over said intermediate material; placing a ductile backing member against the second surface of said carrier member; applying through said ductile backing member and said carrier member sufficient bonding energy to seleCted areas of said conductive element at said bonding sites to bond said conductive element thereto, the ductile backing member acting through said carrier member to deform the selected portion of said conductive element over the intermediate material to form a crossover arch.
Claim 17
Independent Claim
157 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: forming a conductive element on the first surface of a carrier member having first and second opposite surfaces; depositing an intermediate material on intervening circuit elements in those areas which are to be crossed over; placing the first surface of the carrier member against the circuit pattern and aligning said conductive element with bonding sites on the circuit pattern, a selected portion of said conductive element passing over said intermediate material; placing a ductile backing member against the second surface of said carrier member; applying through said ductile backing member and said carrier member sufficient bonding energy to seleCted areas of said conductive element at said bonding sites to bond said conductive element thereto, the ductile backing member acting through said carrier member to deform the selected portion of said conductive element over the intermediate material to form a crossover arch.
Claim 18
Dependent Claim
24 words
The method of claim 13 wherein the intermediate meterial is a dielectric material which is left between the crossover arch and intervening circuit elements.
Claim 19
Dependent Claim
17 words
The method of claim 13 including the additional step of removing the intermediate material subsequent to bonding.
Claim 20
Independent Claim
182 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: forming a conductive element on the first surface of a carrier member having first and second opposite surfaces; depositing an intermediate material on a selected portion of the conductive element; placing the first surface of the carrier member against the circuit pattern and aligning said conductive element with bonding sites on the circuit pattern, the selected portion of said conductive element and the intermediate material deposited thereon being located adjacent intervening circuit elements of the circuit pattern, the said intermediate material being interposed between said selected portion of the conductive element and said intervening circuit elements; placing a ductile backing member against the second surface of said carrier member; applying through said ductile backing member and said carrier member sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thereto, the ductile backing member acting through said carrier member to deform the selected portion of said conductive element over the intermediate material to form a crossover arch.
Claim 21
Independent Claim
182 words
A method of crossing over intervening circuit elements of a circuit pattern, comprising the steps of: forming a conductive element on the first surface of a carrier member having first and second opposite surfaces; depositing an intermediate material on a selected portion of the conductive element; placing the first surface of the carrier member against the circuit pattern and aligning said conductive element with bonding sites on the circuit pattern, the selected portion of said conductive element and the intermediate material deposited thereon being located adjacent intervening circuit elements of the circuit pattern, the said intermediate material being interposed between said selected portion of the conductive element and said intervening circuit elements; placing a ductile backing member against the second surface of said carrier member; applying through said ductile backing member and said carrier member sufficient bonding energy to selected areas of said conductive element at said bonding sites to bond said conductive element thereto, the ductile backing member acting through said carrier member to deform the selected portion of said conductive element over the intermediate material to form a crossover arch.
Claim 22
Dependent Claim
24 words
The method of claim 16 wherein the intermediate material is a dielectric material which is left between the crossover arch and intervening circuit elements.
Claim 23
Dependent Claim
17 words
The method of claim 16 including the additional step of removing the intermediate material subsequent to bonding.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-01 | 1977-04-02 | 1977-10-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-01 | 1981-04-02 | 1981-10-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-01 | 1985-04-02 | 1985-10-02 | $7700.00 | Window Closed / Lapsed |