US5455547A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectromechanical signal processors
Assignee: University of California, San Diego
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Filing: 1994-10-31
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Granted: 1995-10-03
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Expires: 2014-10-31
Abstract
Abstract A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.
Inventors
- 👤 Liwei Lin
- 👤 Clark T.-C. Nguyen
- 👤 Roger T. Howe
- 👤 Albert P. Pisano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 19:45
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/02244; H03H9/02259; H03H9/02275; H03H9/02338; H03H9/02362; H03H9/02377; H03H9/46; H03H9/462
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
158 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a second rigid mass; a third rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second flexible structure mechanically connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, said first and second masses and said second flexible structure being thin film structures; and a third flexible structure mechanically connecting said third mass to a mass selected from the group consisting of said first and second masses, said second flexible structure being substantially located in a first plane to a first side of said substrate, said third flexible structure being substantially located in a second plane to said first side of said substrate, and said first plane lying between said second plane and said substrate.
Claim 2
Dependent Claim
158 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a second rigid mass; a third rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second flexible structure mechanically connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, said first and second masses and said second flexible structure being thin film structures; and a third flexible structure mechanically connecting said third mass to a mass selected from the group consisting of said first and second masses, said second flexible structure being substantially located in a first plane to a first side of said substrate, said third flexible structure being substantially located in a second plane to said first side of said substrate, and said first plane lying between said second plane and said substrate.
Claim 3
Dependent Claim
126 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate at a first resonant frequency; a second rigid mass; and a second flexible structure mechanically connecting said second mass to said substrate and allowing said second mass to move relative to said substrate at a second resonant frequency; a first electrode electrostatically coupled to said first mass; a second electrode electrostatically coupled to said first mass; a third electrode electrically connected to said first electrode and electrostatically coupled to said second mass; and a fourth electrode electrostatically coupled to said second one of said masses and electrically connected to said second electrode.
Claim 4
Dependent Claim
126 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate at a first resonant frequency; a second rigid mass; and a second flexible structure mechanically connecting said second mass to said substrate and allowing said second mass to move relative to said substrate at a second resonant frequency; a first electrode electrostatically coupled to said first mass; a second electrode electrostatically coupled to said first mass; a third electrode electrically connected to said first electrode and electrostatically coupled to said second mass; and a fourth electrode electrostatically coupled to said second one of said masses and electrically connected to said second electrode.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-02 | 1999-04-03 | 1999-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-02 | 2003-04-03 | 2003-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-02 | 2007-04-03 | 2007-10-03 | $7700.00 | Window Closed / Lapsed |