Patent US5455382A successfully refreshed from Google Patents.
US5455382A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC package heat sink fin
Assignee: Nippon Steel Corp
•
Filing: 1994-11-03
•
Granted: 1995-10-03
•
Expires: 2014-11-03
Abstract
Abstract A fin assembly for use as a heat sink and production thereof are disclosed. The fin assembly comprises a plurality of heat dissipating plates formed by means of a multi-wire saw, and the heat dissipating plates each has a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm the heat dissipating plates or pins having a height h, wherein the ratio h/t is not less than 20 and the ratio h/g is not less than 15 in one embodiment and 19 in another embodiment of the invention.
Inventors
- 👤 Masayasu Kojima
- 👤 Chihiro Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/02; H10W70/027; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
82 words
A heat sink fin comprising a bottom plate mounted on an IC package and a plurality of heat dissipating plates integrally formed with and extending in parallel from the bottom plate, the heat dissipating plates each having a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating plates having a height h wherein h/t is not less than 20 and h/g is not less than 19.
Claim 2
Dependent Claim
82 words
A heat sink fin comprising a bottom plate mounted on an IC package and a plurality of heat dissipating plates integrally formed with and extending in parallel from the bottom plate, the heat dissipating plates each having a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating plates having a height h wherein h/t is not less than 20 and h/g is not less than 19.
Claim 3
Dependent Claim
21 words
A heat sink fin according to claim 1 wherein the heat dissipating plates are formed by means of a multi-wire saw.
Claim 4
Dependent Claim
41 words
A heat sink fin according to claim 1 wherein the heat dissipating plates comprise end plates disposed at ends of the heat sink fin and inner plates disposed between the end plates and having a smaller thickness than the end plates.
Claim 5
Dependent Claim
17 words
A heat sink fin according to claim 1 wherein the fin is made of an aluminum alloy.
Claim 6
Dependent Claim
41 words
A heat sink fin according to claim 1 wherein the bottom plate has four sides at fight angles to each other, the heat dissipating plates along each of the four sides being thicker than a remainder of the heat dissipating plates.
Claim 7
Dependent Claim
20 words
A heat sink fin according to claim 1 wherein the bottom plate is in direct contact with the IC package.
Claim 8
Dependent Claim
33 words
A heat sink fin according to claim 1 wherein the bottom plate is a solid metal plate wherein the heat dissipating plates comprise portions of the solid metal plate formed by wire sawing.
Claim 9
Dependent Claim
42 words
A heat sink fin according to claim 1 wherein the bottom plate is mounted to the IC package such that heat from an IC chip of the IC package flows directly into the bottom plate and then into the heat dissipating plates.
Claim 10
Dependent Claim
88 words
A heat sink fin comprising a monolithic combination of a bottom plate mounted on an IC package and a plurality of heat dissipating pins arranged in an array and extending from the bottom plate, the heat dissipating pins each having a thickness t, planar dimensions of no more than 1 mm×1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating pins having a height h wherein h/t is not less than 20 and h/g is not less than 19.
Claim 11
Dependent Claim
88 words
A heat sink fin comprising a monolithic combination of a bottom plate mounted on an IC package and a plurality of heat dissipating pins arranged in an array and extending from the bottom plate, the heat dissipating pins each having a thickness t, planar dimensions of no more than 1 mm×1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating pins having a height h wherein h/t is not less than 20 and h/g is not less than 19.
Claim 12
Dependent Claim
21 words
A heat sink fin according to claim 9 wherein the heat dissipating pins are formed by means of a multi-wire saw.
Claim 13
Dependent Claim
32 words
A heat sink fin according to claim 9 wherein the heat dissipating pins at the four corners and/or on the four sides are thicker than the other heat dissipating pins positioned inward.
Claim 14
Dependent Claim
17 words
A heat sink fin according to claim 9 wherein the fin is made of an aluminum alloy.
Claim 15
Dependent Claim
41 words
A heat sink fin according to claim 9 wherein the bottom plate has four sides at right angles to each other, the heat dissipating pins along each of the four sides being thicker than a remainder of the heat dissipating pins.
Claim 16
Dependent Claim
20 words
A heat sink fin according to claim 9 wherein the bottom plate is in direct contact with the IC package.
Claim 17
Dependent Claim
33 words
A heat sink fin according to claim 9 wherein the bottom plate is a solid metal plate wherein the heat dissipating pins comprise portions of the solid metal plate formed by wire sawing.
Claim 18
Dependent Claim
47 words
A heat sink fin according to claim 9 wherein the bottom plate is mounted to the IC package such that heat from an IC chip of the IC package flows directly into the bottom plate and then via a heat conducting plate into the heat dissipating pins.
Claim 19
Dependent Claim
82 words
A heat sink fin comprising a bottom plate mounted on an IC package and a plurality of heat dissipating plates integrally formed with and extending in parallel from the bottom plate, the heat dissipating plates each having a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating plates having a height h wherein h/t is not less than 20 and h/g is not less than 15.
Claim 20
Dependent Claim
82 words
A heat sink fin comprising a bottom plate mounted on an IC package and a plurality of heat dissipating plates integrally formed with and extending in parallel from the bottom plate, the heat dissipating plates each having a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating plates having a height h wherein h/t is not less than 20 and h/g is not less than 15.
Claim 21
Dependent Claim
88 words
A heat sink fin comprising a monolithic combination of a bottom plate mounted on an IC package and a plurality of heat dissipating pins arranged in an array and extending from the bottom plate, the heat dissipating pins each having a thickness t, planar dimensions of no more than 1 mm×1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating pins having a height h wherein h/t is not less than 20 and h/g is not less than 15.
Claim 22
Dependent Claim
88 words
A heat sink fin comprising a monolithic combination of a bottom plate mounted on an IC package and a plurality of heat dissipating pins arranged in an array and extending from the bottom plate, the heat dissipating pins each having a thickness t, planar dimensions of no more than 1 mm×1 mm and being spaced apart by a gap g of no more than 1.5 mm, the heat dissipating pins having a height h wherein h/t is not less than 20 and h/g is not less than 15.
References Cited (Backward Citations)
US3180404A
Cited
US3961666A
Cited
JPS56198A
Cited
EP0029501A2
Cited
US4296455A
Cited
US4459638A
Cited
JPS6151931A
Cited
JPS61100361A
Cited
US4694378A
Cited
US4823869A
Cited
EP0253126A1
Cited
US4698663A
Cited
GB2204181A
Cited
US4879891A
Cited
US4884331A
Cited
US4884331B1
Cited
US4899210A
Cited
US4884631A
Cited
WO1991011024A1
Cited
US5083194A
Cited
US5003429A
Cited
US5155579A
Cited
EP0540420A2
Cited
EP0542478A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-02 | 1999-04-03 | 1999-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-02 | 2003-04-03 | 2003-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-02 | 2007-04-03 | 2007-10-03 | $7700.00 | Window Closed / Lapsed |