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US5083194A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
Assignee: Silicon Graphics International Corp
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Filing: 1990-01-16
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Granted: 1992-01-21
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Expires: 2010-01-16
Abstract
Abstract An air-jet impingement cooling method combined with a miniature pin-fin heat sink provides equivalent fluid flow to each IC package in a module and achieves a high heat transfer rate per volume. The packaging design is comparable to high-density packaging systems utilizing low-temperature coolant.
Inventors
- 👤 Bradley W. Bartilson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:25
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/18; H05K1/182
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
93 words
An apparatus for using a cooling air flow to dissipate heat from an electronic device mounted on a printed circuit board, comprising: (a) a discrete air manifold mounted adjacent to the printed circuit board; (b) inlet means on said manifold for accepting the cooling air flow into said manifold; and (c) nozzle means on said air manifold for expelling the cooling air flow from said air manifold as an air jet, said air jet impinging upon a face of the electronic device, thereby cooling the electronic device mounted on the printed circuit board.
Claim 2
Independent Claim
93 words
An apparatus for using a cooling air flow to dissipate heat from an electronic device mounted on a printed circuit board, comprising: (a) a discrete air manifold mounted adjacent to the printed circuit board; (b) inlet means on said manifold for accepting the cooling air flow into said manifold; and (c) nozzle means on said air manifold for expelling the cooling air flow from said air manifold as an air jet, said air jet impinging upon a face of the electronic device, thereby cooling the electronic device mounted on the printed circuit board.
Claim 3
Dependent Claim
23 words
The apparatus of claim 1, further comprising aperture means through the printed circuit board for directing said air jet onto the electronic device.
Claim 4
Dependent Claim
53 words
The apparatus of claim 2, further comprising pin-fin heat sink means attached to the electronic device for maximizing the transfer of heat from the electronic device to said air jet, said pin-fin heat sink means including a base for attachment to the electronic device and a plurality of rows of pins extending therefrom.
Claim 5
Dependent Claim
38 words
The apparatus of claim 3, wherein said pin-fin heat ink means extends through said aperture means in the printed circuit board so that no gap exists between said nozzle means and the top of said heat sink means.
Claim 6
Dependent Claim
53 words
The apparatus of claim 1, further comprising pin-fin heat sink means attached to the electronic device for maximizing the transfer of heat from the electronic device to said air jet, said pin-fin heat sink means including a base for attachment to the electronic device and a plurality of rows of pins extending therefrom.
Claim 7
Independent Claim
98 words
A method of dissipating heat from an electronic device mounted on a printed circuit board using a cooling air flow, comprising: (a) accepting the cooling air flow into a discrete air manifold, said discrete air manifold mounted adjacent to the printed circuit board; (b) chambering the cooling air flow in said discrete air manifold; (c) expelling the cooling air flow as an air jet through a nozzle on said discrete air manifold; and (d) directing said air jet onto a face of the electronic device to localize cooling of the electronic device mounted on the printed circuit board.
Claim 8
Independent Claim
98 words
A method of dissipating heat from an electronic device mounted on a printed circuit board using a cooling air flow, comprising: (a) accepting the cooling air flow into a discrete air manifold, said discrete air manifold mounted adjacent to the printed circuit board; (b) chambering the cooling air flow in said discrete air manifold; (c) expelling the cooling air flow as an air jet through a nozzle on said discrete air manifold; and (d) directing said air jet onto a face of the electronic device to localize cooling of the electronic device mounted on the printed circuit board.
Claim 9
Dependent Claim
23 words
The method of claim 6, further comprising directing said air jet through an aperture in the printed circuit board onto the electronic device.
Claim 10
Dependent Claim
59 words
The method of claim 7, further comprising directing said air jet onto at least one pin-fin heat sink attached to the electronic device, thereby maximizing the transfer of heat from the electronic device to said air jet, said pin-fin heat sink including a base for attachment to the electronic device and a plurality of rows of pins extending therefrom.
Claim 11
Dependent Claim
32 words
The method of claim 7, further comprising extending said pin-fin heat sink through said aperture in the printed circuit board so that no gap exists between said nozzle and said heat sink.
Claim 12
Dependent Claim
53 words
The method of claim 6, further comprising attaching at least one pin-fin heat sink to the electronic device to maximize the transfer of heat from the electronic device to said heat sink, said heat sink including a base for attachment to the electronic device and a plurality of rows of pins extending therefrom.
Claim 13
Independent Claim
127 words
An apparatus for using a cooling air flow to dissipate heat from electronic devices mounted on a printed circuit board, comprising: (a) an air manifold adapted for mounting the printed circuit board adjacent thereto; (b) inlet means for accepting the cooling air flow into said manifold; (c) nozzle means of said manifold for expelling the cooling air flow from said air manifold as an air jet; and (d) pin-fin sink means attached to the electronic devices for maximizing the transfer of heat from the electronic device to said air jet, said pin-fin heat sink means including a base for attachment to the electronic device and a plurality of rows of pins extending therefrom, said air jet impinging upon the ends of said plurality of rows of pins.
Claim 14
Independent Claim
127 words
An apparatus for using a cooling air flow to dissipate heat from electronic devices mounted on a printed circuit board, comprising: (a) an air manifold adapted for mounting the printed circuit board adjacent thereto; (b) inlet means for accepting the cooling air flow into said manifold; (c) nozzle means of said manifold for expelling the cooling air flow from said air manifold as an air jet; and (d) pin-fin sink means attached to the electronic devices for maximizing the transfer of heat from the electronic device to said air jet, said pin-fin heat sink means including a base for attachment to the electronic device and a plurality of rows of pins extending therefrom, said air jet impinging upon the ends of said plurality of rows of pins.
Claim 15
Dependent Claim
23 words
The apparatus of claim 11, further comprising aperture means through the printed circuit board for directing said air jet onto the electronic device.
Claim 16
Dependent Claim
38 words
The apparatus of claim 12, wherein said pin-fin heat sink means extends through said aperture means in the printed circuit board so that no gap exists between said nozzle means and the top of said heat sink means.
Claim 17
Independent Claim
129 words
A method of dissipating heat from electronic devices mounted on a printed circuit board using a cooling air flow, comprising: (a) attaching at least one pin-fin heat sink to the electronic device, thereby maximizing the transfer of heat from the electronic device, said pin-fin heat sink including a base for attachment to said electronic device and a plurality of rows of pins extending therefrom; (b) accepting the cooling air flow into a manifold, said manifold adapted for mounting printed circuit boards adjacent thereto; (c) chambering the cooling air flow in said manifold; (d) expelling the cooling air flow as an air jet through a nozzle in said manifold; and (e) directing said air jet onto the ends of said plurality of rows and pins of said pin-fin heat sink.
Claim 18
Independent Claim
129 words
A method of dissipating heat from electronic devices mounted on a printed circuit board using a cooling air flow, comprising: (a) attaching at least one pin-fin heat sink to the electronic device, thereby maximizing the transfer of heat from the electronic device, said pin-fin heat sink including a base for attachment to said electronic device and a plurality of rows of pins extending therefrom; (b) accepting the cooling air flow into a manifold, said manifold adapted for mounting printed circuit boards adjacent thereto; (c) chambering the cooling air flow in said manifold; (d) expelling the cooling air flow as an air jet through a nozzle in said manifold; and (e) directing said air jet onto the ends of said plurality of rows and pins of said pin-fin heat sink.
Claim 19
Dependent Claim
23 words
The method of claim 14, further comprising directing said air jet through an aperture in the printed circuit board onto the electronic device.
Claim 20
Dependent Claim
32 words
The method of claim 15, further comprising extending said pin-fin heat sink through said aperture in the printed circuit board so that no gap exists between said nozzle and said heat sink.
Claim 21
Independent Claim
147 words
An apparatus for using a cooling air flow to dissipate heat from electronic devices mounted on a printed circuit board, comprising: (a) an air manifold adapted for mounting said printed circuit board adjacent thereto, said printed circuit board having aperture means therein for directing an air jet onto said electronic device; (b) pin-fin heat sink means attached to said electronic devices for maximizing the transfer of heat from said electronic device to said air jet, said pin-fin heat sink means extends through said aperture means of said printed circuit board so that no gap exists between said nozzle means and the top of said heat sink means; (c) inlet means for accepting said cooling air flow into said manifold; and (d) nozzle means for expelling said cooling said flow from said air manifold as said air jet, said air jet impinging upon and cooling said electronic device.
Claim 22
Independent Claim
147 words
An apparatus for using a cooling air flow to dissipate heat from electronic devices mounted on a printed circuit board, comprising: (a) an air manifold adapted for mounting said printed circuit board adjacent thereto, said printed circuit board having aperture means therein for directing an air jet onto said electronic device; (b) pin-fin heat sink means attached to said electronic devices for maximizing the transfer of heat from said electronic device to said air jet, said pin-fin heat sink means extends through said aperture means of said printed circuit board so that no gap exists between said nozzle means and the top of said heat sink means; (c) inlet means for accepting said cooling air flow into said manifold; and (d) nozzle means for expelling said cooling said flow from said air manifold as said air jet, said air jet impinging upon and cooling said electronic device.
Claim 23
Independent Claim
136 words
A method of dissipating heat from electronic devices mounted on a printed circuit board using a cooling air flow, comprising: (a) accepting said cooling air flow into a manifold, said manifold adapted for mounting said printed circuit board adjacent thereto; (b) chambering said cooling air flow in said manifold; (c) expelling said cooling air flow as an air jet through a nozzle in said manifold; (d) directing said air jet through an aperture in said printed circuit board onto at least one pin-fin heat sink attached to said electronic device to localize cooling of said electronic device, thereby maximizing the transfer of heat from said electronic device to said air jet, said pin-fin heat sink extending through said aperture in said printed circuit board so that no gap exists between said nozzle and said heat sink.
Claim 24
Independent Claim
136 words
A method of dissipating heat from electronic devices mounted on a printed circuit board using a cooling air flow, comprising: (a) accepting said cooling air flow into a manifold, said manifold adapted for mounting said printed circuit board adjacent thereto; (b) chambering said cooling air flow in said manifold; (c) expelling said cooling air flow as an air jet through a nozzle in said manifold; (d) directing said air jet through an aperture in said printed circuit board onto at least one pin-fin heat sink attached to said electronic device to localize cooling of said electronic device, thereby maximizing the transfer of heat from said electronic device to said air jet, said pin-fin heat sink extending through said aperture in said printed circuit board so that no gap exists between said nozzle and said heat sink.
References Cited (Backward Citations)
US2948518A
Cited
US3141999A
Cited
US3065384A
Cited
US3070729A
Cited
US3198991A
Cited
US3417814A
Cited
US3527989A
Cited
US3741292A
Cited
US3737728A
Cited
US3851221A
Cited
US3999105A
Cited
US4072188A
Cited
US4104700A
Cited
US4204247A
Cited
US4283754A
Cited
US4420739A
Cited
US4450472A
Cited
US4578926A
Cited
US4536824A
Cited
US4535385A
Cited
EP0129966A1
Cited
US4628407A
Cited
SU1274165A1
Cited
GB2204181A
Cited
US4839774A
Cited
US4884168A
Cited
US5014904A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-01-20 | 1995-07-22 | 1996-01-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-01-20 | 1999-07-22 | 2000-01-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-01-20 | 2003-07-22 | 2004-01-21 | $7700.00 | Window Closed / Lapsed |