Barrier alignment and process monitor for TIJ printheads

Claim 2

A thermal ink jet printhead comprising: a silicon substrate; a thin film resistor layer disposed on said silicon substrate; a metallization layer disposed on said thin film resistor layer; a metallization pattern formed in said metallization layer for defining a plurality of ink firing resistors in said resistor layer and for defining a target pattern in said metallization layer, said plurality of ink firing resistors having locations and dimensions defined by said metallization pattern; a barrier layer overlying said resistor layer and said metallization layer; respective firing chamber openings formed in said barrier layer and disposed over each of the ink firing resistors; and a reference opening formed in said barrier layer and disposed over said target pattern, said reference opening having a plurality of connected linear walls which have predetermined intended locations relative to said target pattern; said target pattern comprised of a plurality of sub-patterns respectively associated with said plurality of connected walls, each sub-pattern comprised of first and second regions that diverge from a common vertex that underlies the predetermined intended location of the associated wall of said reference opening; whereby the alignment of said reference opening relative to said target is representative of the alignment of said respective firing chamber openings relative to the associated underlying ink firing resistors defined by said metallization pattern in said metallization layer.

Claim 3

The thermal ink jet printhead of claim 1 wherein said first and second regions of each sub-pattern each includes linear sides that diverge with distance from their common vertex.

Claim 4

The thermal ink jet printhead of claim 1 wherein said first and second regions of each sub-pattern include linear sides formed by line segments that intersect at the common vertex of said first and second regions.

Claim 5

The thermal ink jet printhead of claim 1 wherein said vertexes are respectively centered relative to the respective predetermined intended locations of said plurality of connected walls.

Claim 6

A thermal ink jet printhead comprising: a silicon substrate; a thin film resistor layer disposed on said silicon substrate; a metallization layer disposed on said thin film resistor layer; a metallization pattern formed in said metallization layer for defining a plurality of ink firing resistors in said resistor layer and for defining a target pattern in said metallization layer, said plurality of ink firing resistors having locations and dimensions defined by said metallization pattern; a barrier layer overlying said resistor layer and said metallization layer; and respective firing chamber openings formed in said barrier layer and disposed over each of the ink firing resistors; and a reference opening formed in said barrier layer and disposed over said target pattern, said reference opening having three connected linear walls that form three walls of a rectangle and which have predetermined intended locations relative to said target pattern; said target pattern comprised of three sub-patterns respectively associated with said three connected walls, each sub-pattern comprised of first and second regions that diverge from a common vertex that underlies the predetermined intended location of the associated wall of said reference opening; whereby the alignment of said reference opening relative to said target is representative of the alignment of said respective firing chamber openings relative to the associated underlying ink firing resistors defined by said metallization pattern in said metallization layer.

Claim 7

A thermal ink jet printhead comprising: a silicon substrate; a thin film resistor layer disposed on said silicon substrate; a metallization layer disposed on said thin film resistor layer; a metallization pattern formed in said metallization layer for defining a plurality of ink firing resistors in said resistor layer and for defining a target pattern in said metallization layer, said plurality of ink firing resistors having locations and dimensions defined by said metallization pattern; a barrier layer overlying said resistor layer and said metallization layer; and respective firing chamber openings formed in said barrier layer and disposed over each of the ink firing resistors; and a reference opening formed in said barrier layer and disposed over said target pattern, said reference opening having three connected linear walls that form three walls of a rectangle and which have predetermined intended locations relative to said target pattern; said target pattern comprised of three sub-patterns respectively associated with said three connected walls, each sub-pattern comprised of first and second regions that diverge from a common vertex that underlies the predetermined intended location of the associated wall of said reference opening; whereby the alignment of said reference opening relative to said target is representative of the alignment of said respective firing chamber openings relative to the associated underlying ink firing resistors defined by said metallization pattern in said metallization layer.

Claim 8

The thermal ink jet printhead of claim 5 wherein said first and second regions of each sub-pattern each includes linear sides that diverge with distance from their common vertex.

Claim 9

The thermal ink jet printhead of claim 5 wherein said first and second regions of each sub-pattern include linear sides formed by line segments that intersect at the common vertex of said first and second regions.

Claim 10

The thermal ink jet printhead of claim 5 wherein said target pattern comprises a parallelogram shaped central region located within said intended locations, and triangular shaped regions outside of said intended locations.

Claim 11

The thermal ink jet printhead of claim 5 wherein said vertexes are respectively centered relative to the respective predetermined intended locations of said three connected walls.