Patent US4395459A successfully refreshed from Google Patents.
Patent US5438478A successfully refreshed from Google Patents.
US5438478A
Expired / Lapsed
US
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Electronic component carriers and method of producing the same as well as electronic devices
Assignee: Ibiden Co Ltd
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Filing: 1993-10-18
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Granted: 1995-08-01
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Expires: 2013-10-18
Abstract
Abstract An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection, and a solder layer formed in the through-hole for electrical connection to the conductor pattern of the substrate.
Inventors
- 👤 Mitsuhiro Kondo
- 👤 Osamu Fujikawa
- 👤 Katsumi Sagisaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 01:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/464; H10W70/468; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49204; Y10T29/49208; Y10T29/4921
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
111 words
An electronic component carrier comprising: a printed wiring substrate having front and rear surfaces, a through-hole extending through the substrate so as to pass between the front and rear surfaces, and a conductor pattern formed on each of the front and rear surfaces; an adhesive layer formed on at least an outer peripheral portion of the front surface of the substrate; a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection; and a solder layer formed in the through-hole for electrically connecting an inner lead portion of the lead frame to the conductor pattern formed on the rear surface of the substrate.
Claim 2
Dependent Claim
111 words
An electronic component carrier comprising: a printed wiring substrate having front and rear surfaces, a through-hole extending through the substrate so as to pass between the front and rear surfaces, and a conductor pattern formed on each of the front and rear surfaces; an adhesive layer formed on at least an outer peripheral portion of the front surface of the substrate; a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection; and a solder layer formed in the through-hole for electrically connecting an inner lead portion of the lead frame to the conductor pattern formed on the rear surface of the substrate.
Claim 3
Dependent Claim
21 words
The electronic component carrier according to claim 1, further comprising a heat sink coupled to the rear surface of the substrate.
Claim 4
Dependent Claim
31 words
The electronic component carrier according to claim 1, wherein said adhesive layer is comprised of a thermosetting resin and has a width of 0.3-2.0 mm and a thickness of 5-100 μm.
Claim 5
Dependent Claim
24 words
The electronic component carrier according to claim 1, wherein said adhesive layer is located at a portion outward from said through-hole of the substrate.
Claim 6
Dependent Claim
17 words
The electronic component carrier according to claim 1, wherein said solder layer is comprised of a solder.
Claim 7
Dependent Claim
22 words
The electronic component carrier according to claim 1, wherein said lead frame is provided at its central portion with an opening portion.
Claim 8
Dependent Claim
30 words
The electronic component carrier according to claim 6, wherein an inward end portion of said inner lead in the lead frame is thinned in the vicinity of said opening portion.
Claim 9
Independent Claim
133 words
A method of producing an electronic component carrier, which comprises the steps of: providing a printed wiring substrate having front and rear surfaces, a through-hole extending through the substrate so as to pass between the front and rear surfaces, and a conductor pattern formed on each of the front and rear surfaces; applying an adhesive to at least an outer peripheral portion of the front surface of the substrate to form an adhesive layer; joining inner lead portions of a lead frame comprised of plural leads to the front surface of the substrate through the adhesive layer; and contacting the rear surface of the substrate with a fused solder to fill the through-hole with the solder thereby to connect electrically the inner lead portion to the conductor pattern formed on the rear surface.
Claim 10
Independent Claim
133 words
A method of producing an electronic component carrier, which comprises the steps of: providing a printed wiring substrate having front and rear surfaces, a through-hole extending through the substrate so as to pass between the front and rear surfaces, and a conductor pattern formed on each of the front and rear surfaces; applying an adhesive to at least an outer peripheral portion of the front surface of the substrate to form an adhesive layer; joining inner lead portions of a lead frame comprised of plural leads to the front surface of the substrate through the adhesive layer; and contacting the rear surface of the substrate with a fused solder to fill the through-hole with the solder thereby to connect electrically the inner lead portion to the conductor pattern formed on the rear surface.
Claim 11
Dependent Claim
29 words
The method according to claim 8, wherein said adhesive layer is comprised of a thermosetting resin and has a width of 0.3-2.0 mm and a thickness of 5-100 μm.
Claim 12
Dependent Claim
149 words
An electronic device comprising: an electronic component carrier comprising a printed wiring substrate having front and rear surfaces, a through-hole extending through the substrate so as to pass between the front and rear surfaces, and a conductor pattern formed on each of the front and rear surfaces; an adhesive layer formed on at least an outer peripheral portion of the front surface of the substrate; a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection; and a solder layer formed in the through-hole for electrically connecting an inner lead portion of the lead frame to the conductor pattern formed on the rear surface of the substrate; and an electronic component packaged in the electronic component carrier with a resin, said electronic component being electrically connected to the rear surface of the substrate through the solder layer formed in the through-hole.
Claim 13
Dependent Claim
149 words
An electronic device comprising: an electronic component carrier comprising a printed wiring substrate having front and rear surfaces, a through-hole extending through the substrate so as to pass between the front and rear surfaces, and a conductor pattern formed on each of the front and rear surfaces; an adhesive layer formed on at least an outer peripheral portion of the front surface of the substrate; a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection; and a solder layer formed in the through-hole for electrically connecting an inner lead portion of the lead frame to the conductor pattern formed on the rear surface of the substrate; and an electronic component packaged in the electronic component carrier with a resin, said electronic component being electrically connected to the rear surface of the substrate through the solder layer formed in the through-hole.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-31 | 1999-01-30 | 1999-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-31 | 2003-01-30 | 2003-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-31 | 2007-01-30 | 2007-08-01 | $7700.00 | Window Closed / Lapsed |