Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
166 words
A semiconductor device comprising a capacitor having as the lower electrode, a diffusion layer having a first electrically conductive type formed inside a semiconductor substrate, wherein, said lower electrode, which is a diffusion layer having a first electrically conductive type, is isolated using another diffusion layer having a conductive type opposite to that of the diffusion layer corresponding to the lower electrode; said another diffusion layer having the opposite conductive type is further isolated using a diffusion layer for isolation having the first conductive type; said diffusion layer for isolation having the first conductive type is earthed; and wherein said diffusion layer having a first conductive type and corresponding to said lower electrode is a P type graft base of an NPN transistor; said diffusion layer having the opposite conductive type is an N type epitaxially grown layer; and said diffusion layer for isolation having the first conductive type is a buried P type layer and P type isolation layer, or a P type isolation monolayer.
Claim 2
Dependent Claim
166 words
A semiconductor device comprising a capacitor having as the lower electrode, a diffusion layer having a first electrically conductive type formed inside a semiconductor substrate, wherein, said lower electrode, which is a diffusion layer having a first electrically conductive type, is isolated using another diffusion layer having a conductive type opposite to that of the diffusion layer corresponding to the lower electrode; said another diffusion layer having the opposite conductive type is further isolated using a diffusion layer for isolation having the first conductive type; said diffusion layer for isolation having the first conductive type is earthed; and wherein said diffusion layer having a first conductive type and corresponding to said lower electrode is a P type graft base of an NPN transistor; said diffusion layer having the opposite conductive type is an N type epitaxially grown layer; and said diffusion layer for isolation having the first conductive type is a buried P type layer and P type isolation layer, or a P type isolation monolayer.
Claim 3
Dependent Claim
172 words
A semiconductor device comprising a capacitor having as the lower electrode, a diffusion layer having a first electrically conductive type formed inside a semiconductor substrate, wherein, said lower electrode, which is a diffusion layer having a first electrically conductive type, is isolated using another diffusion layer having a conductive type opposite to that of the diffusion layer corresponding to the lower electrode; said another diffusion layer having the opposite conductive type is further isolated using a diffusion layer for isolation having the first conductive type; said diffusion layer for isolation having the first conductive type is earthed; and wherein said diffusion layer having a first conductive type and corresponding to said lower electrode is a P type source/drain of a PMOS transistor; said diffusion layer having the opposite conductive type is an N type well layer of a PMOS transistor; and said diffusion layer for isolation having the first conductive type is a buried P type layer and P type well layer of an NMOS transistor, or a P type isolation monolayer.
Claim 4
Dependent Claim
172 words
A semiconductor device comprising a capacitor having as the lower electrode, a diffusion layer having a first electrically conductive type formed inside a semiconductor substrate, wherein, said lower electrode, which is a diffusion layer having a first electrically conductive type, is isolated using another diffusion layer having a conductive type opposite to that of the diffusion layer corresponding to the lower electrode; said another diffusion layer having the opposite conductive type is further isolated using a diffusion layer for isolation having the first conductive type; said diffusion layer for isolation having the first conductive type is earthed; and wherein said diffusion layer having a first conductive type and corresponding to said lower electrode is a P type source/drain of a PMOS transistor; said diffusion layer having the opposite conductive type is an N type well layer of a PMOS transistor; and said diffusion layer for isolation having the first conductive type is a buried P type layer and P type well layer of an NMOS transistor, or a P type isolation monolayer.
Claim 5
Dependent Claim
170 words
A semiconductor device comprising a capacitor having as the lower electrode, a diffusion layer having a first electrically conductive type formed inside a semiconductor substrate, wherein, said lower electrode, which is a diffusion layer having a first electrically conductive type, is isolated using another diffusion layer having a conductive type opposite to that of the diffusion layer corresponding to the lower electrode; said another diffusion layer having the opposite conductive type is further isolated using a diffusion layer for isolation having the first conductive type; said diffusion layer for isolation having the first conductive type is earthed; and wherein said diffusion layer having a first conductive type and corresponding to said lower electrode is an N type emitter of an NPN transistor; said diffusion layer having the opposite conductive type is a P type well layer of an NMOS transistor; and said diffusion layer for isolation having the first conductive type is a buried N type layer of an NPN transistor and N type well layer of a PMOS transistor.
Claim 6
Dependent Claim
170 words
A semiconductor device comprising a capacitor having as the lower electrode, a diffusion layer having a first electrically conductive type formed inside a semiconductor substrate, wherein, said lower electrode, which is a diffusion layer having a first electrically conductive type, is isolated using another diffusion layer having a conductive type opposite to that of the diffusion layer corresponding to the lower electrode; said another diffusion layer having the opposite conductive type is further isolated using a diffusion layer for isolation having the first conductive type; said diffusion layer for isolation having the first conductive type is earthed; and wherein said diffusion layer having a first conductive type and corresponding to said lower electrode is an N type emitter of an NPN transistor; said diffusion layer having the opposite conductive type is a P type well layer of an NMOS transistor; and said diffusion layer for isolation having the first conductive type is a buried N type layer of an NPN transistor and N type well layer of a PMOS transistor.
Claim 7
Dependent Claim
92 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor, and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said arbitrary conductor is made of polycrystalline silicon.
Claim 8
Dependent Claim
92 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor, and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said arbitrary conductor is made of polycrystalline silicon.
Claim 9
Dependent Claim
92 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said arbitrary conductor is made of a metal.
Claim 10
Dependent Claim
92 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said arbitrary conductor is made of a metal.
Claim 11
Dependent Claim
98 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor, and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said arbitrary conductor is made of an alloy of polycrystalline silicon and a metal.
Claim 12
Dependent Claim
98 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor, and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said arbitrary conductor is made of an alloy of polycrystalline silicon and a metal.
Claim 13
Dependent Claim
111 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor, and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said resistor is made of a conductor film having high resistance, and the gate of said MOS transistor is made of a conductor film having low resistance.
Claim 14
Dependent Claim
111 words
A BiCMOS semiconductor device comprising a bipolar transistor, a MOS transistor, and a resistor formed from an arbitrary conductor film, wherein, the impurity source for forming the emitter of said bipolar transistor and the emitter electrode are made of a conductor from the same layer of said arbitrary conductor film forming said resistor, the conductor film from the same layer of the arbitrary conductor film forming the gate of said MOS transistor is provided on the electrode contact region of said resistor, and, wherein said resistor is made of a conductor film having high resistance, and the gate of said MOS transistor is made of a conductor film having low resistance.