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US5406025A
Expired / Lapsed
US
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VLSI-chips package with floatingly mounted chip means
Assignee: Carlstedt Elektronik AB
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Filing: 1992-02-28
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Granted: 1995-04-11
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Expires: 2012-02-28
Abstract
Abstract The invention relates to a package for VLSI-chips. A substrate means (A1;B1;C1), a frame means (3;14) and a lid means (A5;B5;C5) makes a housing having an inside cavity. First connection means (4;16) are provided on the inside of said cavity in electrical contact with external contact means (6;22) on the outside of the housing. A chip (A3;B3;C3) having second connection means (8;B19) is placed inside the cavity. At least one interconnection film (A2;B2;C2) is placed adjacent the chip (A3;B3;C3) and has third and fourth connection means (9,5;21,20). The third connection means (9;21) are positioned to make contact with the second connection means (8;B19) on the chip. The fourth connection means (5;20) are positioned to make contact with the first connection means (4;16) inside the cavity. Individual ohmic contacts are provided individually between chosen among the third and fourth connection means (9, 5;21,20) for making connection between chosen of the first and second connection means (4,8;16,22).
Inventors
- 👤 L. Gunnar Carlstedt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:45
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W72/00; H10W95/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 49
Claim 1
Independent Claim
238 words
A package for VLSI-chips, comprising: a) a substrate means (A1; B1; C1; El), a frame means (3; 14; 39) and a lid means (A5; B5; C5; E5), said substrate means providing a housing having an inside cavity, first electrical contacts (4; 16; 38) being provided inside of said cavity and in electrical contact with external electrical contact means (6; 22; 41) provided on the outside of said housing, b) a chip means (A3; B3; C3; E3) having second electrical contacts (8; 19; 40) thereon, said chip means being provided inside said cavity, c) at least one first film (A2; B2; C2; E2) adjacent said chip means (A3; B3; C3; E3) having third and fourth electrical contacts (9, 5; 21, 20; 36, 37) thereon, at least two of the third contacts (9; 21; 36) being positioned to make contact with at least two of said second contacts (8; 19; 40) on said chip means, at least two of said fourth contacts (5; 20; 37) being positioned to make contact with at least two of said first contacts (4; 16; 38) being provided inside said cavity, said first film providing individual electrical connections between selected third contacts (9, 20, 36) and selected fourth contacts (5, 21, 37) to connect selected first contacts (4, 16, 38) with selected second contacts (8, 19, 40), and d) a pressure means to press said chip means (A3; B3; C3; E3) towards said substrate means.
Claim 2
Dependent Claim
238 words
A package for VLSI-chips, comprising: a) a substrate means (A1; B1; C1; El), a frame means (3; 14; 39) and a lid means (A5; B5; C5; E5), said substrate means providing a housing having an inside cavity, first electrical contacts (4; 16; 38) being provided inside of said cavity and in electrical contact with external electrical contact means (6; 22; 41) provided on the outside of said housing, b) a chip means (A3; B3; C3; E3) having second electrical contacts (8; 19; 40) thereon, said chip means being provided inside said cavity, c) at least one first film (A2; B2; C2; E2) adjacent said chip means (A3; B3; C3; E3) having third and fourth electrical contacts (9, 5; 21, 20; 36, 37) thereon, at least two of the third contacts (9; 21; 36) being positioned to make contact with at least two of said second contacts (8; 19; 40) on said chip means, at least two of said fourth contacts (5; 20; 37) being positioned to make contact with at least two of said first contacts (4; 16; 38) being provided inside said cavity, said first film providing individual electrical connections between selected third contacts (9, 20, 36) and selected fourth contacts (5, 21, 37) to connect selected first contacts (4, 16, 38) with selected second contacts (8, 19, 40), and d) a pressure means to press said chip means (A3; B3; C3; E3) towards said substrate means.
Claim 3
Dependent Claim
34 words
The package according to claim 1, wherein said pressure means comprises means maintaining an underpressure in relation to atmospheric pressure in said cavity, whereby said chip means is held in place by said underpressure.
Claim 4
Dependent Claim
133 words
The package according to claim 2, wherein a sealing foil means (32;34) is provided on that side of said chip means (C3;D3) which is turned from said substrate means (C1;D1) extending over a surface area of the chip at least covering its edges and extending beyond the edges of said chip means and being attached in a gas tight manner on parts of said cavity outside said chip means, a first underpressure being provided in a first volume covered by said foil means (32;34) outside said chip means (C3;D3), said chip means (C3;D3) and said substrate means (C1;D1), a second underpressure is provided in the cavity volume outside said first volume, said first underpressure is stronger than said second underpressure, said lid means (C5) is pressed towards said cavity by the atmospheric pressure.
Claim 5
Dependent Claim
54 words
The package according to claim 3, wherein said first film (B2) is an interconnection film and said sealing foil means and said interconnection film is one and the same element (B2, 34) having its third contacts provided at its part covering said chip means and its fourth contacts provided near its edges (FIG. 11).
Claim 6
Dependent Claim
18 words
The package according to claim 1, wherein said pressure means presses said lid means towards said substrate means.
Claim 7
Dependent Claim
18 words
The package in accordance with claim 5, wherein a pressure-absorbing filler means (A4;B4;C4;E4) is provided inside said cavity.
Claim 8
Dependent Claim
30 words
The package in accordance with claim 6, wherein a pressure-absorbing filler means is selected from the group consisting of a gel, a polymer and at least one flexible, gas-filled cushion.
Claim 9
Dependent Claim
34 words
The package according to claim 1, wherein said lid means (A5;B5;C5;E5) is flexible; said cavity is isolated in a gas tight manner and has an inside gas pressure, which is below atmospheric gas pressure.
Claim 10
Dependent Claim
58 words
The package according to claim 1, wherein said lid means (A5; B5; C5; E5) is stiff at least in a central part and said central part is planar on its side turned towards said cavity; and a pressure providing means is pressing said lid means towards said substrate means such that a pressure within said cavity is provided.
Claim 11
Dependent Claim
39 words
The package according to claim 1, wherein at least one second film (1, 2; i; 24) having alpha-particle obstructing features is disposed at least between said chip means and said substrate means, said second film being polyimide or metal.
Claim 12
Dependent Claim
23 words
The package according to claim 10, wherein at least one of said alpha-particle obstructing films (i) is included in said interconnection film means.
Claim 13
Dependent Claim
47 words
The package according to claim 1, wherein said chip means (A3;L3) is situated inside said cavity having said second connection means (8) turned towards said substrate means (A1;L1); and wherein said interconnection film means (A2;L2) is disposed between said substrate means (A1;L1) and said chip means (A3;L3).
Claim 14
Dependent Claim
55 words
The package according to claim 12, wherein at least two of said third contacts (9) contacting said second contacts (8) on said chip means and said fourth contacts (5) contacting said first contacts (4) placed inside said cavity are placed opposite each other and are connected through a material of said interconnection film means (A2).
Claim 15
Dependent Claim
36 words
The package according to claim 12, wherein said first contacts inside said cavity and said fourth contacts on said interconnection film means are placed in contact with one another and are fixedly connected with each other.
Claim 16
Dependent Claim
39 words
The package according to claim 1, wherein said first contacts (50) on said substrate means (49) are situated on a side of said substrate means turned towards said cavity and in an area around said chip means (48) .
Claim 17
Dependent Claim
85 words
The package according to claim 1, wherein said chip means is situated inside said cavity having said second contacts turned away from said substrate means; wherein said interconnection film means (F2) is disposed on a side of said chip means turned away from said substrate means; said first contacts (45) inside said cavity are situated in an area around said chip means; and wherein wire bonding (46) is provided between said third contacts (44) on said interconnection film means (F2) and said first contacts (45).
Claim 18
Dependent Claim
64 words
The package according to claim 1, wherein said first contacts (16) inside said cavity are placed on an internal peripheral shelf means (15); and wherein said interconnection film means (B2) has an extention covering said chip means and at least a part of said shelf means (15) and having said fourth contacts (21) in its peripheral part in register with said first contacts (16).
Claim 19
Dependent Claim
46 words
The package according to claim 1, wherein said substrate means (B1) and said frame means (14) are separate units; and wherein said first contacts (16) and said external contacts (22) are in electrical contact with each other via conductors which are provided in said frame means.
Claim 20
Dependent Claim
25 words
The package according to claim 18, wherein said frame means (14) is manufactured of a ceramic material and the substrate means is made of metal.
Claim 21
Dependent Claim
34 words
The package according to claim 1, wherein said chip means is oriented in such a manner that said second contacts turned away from said substrate means and is tied to said substrate means (F1).
Claim 22
Dependent Claim
22 words
The package according to claim 1, wherein a cooling means is provided to cool an exterior side of said substrate means (A1).
Claim 23
Dependent Claim
22 words
The package according to claim 1, wherein a cooling means is provided to cool an exterior side of said lid means (A5).
Claim 24
Dependent Claim
31 words
The package according to claim 1, wherein cooling means are provided to cool both an exterior side of said substrate means (A1) and an exterior side of said lid means (A5).
Claim 25
Dependent Claim
62 words
The package according to claim 1, wherein said chip means (B3) is situated inside said cavity having said second connection means (B19) turned away from said substrate means (B1); and wherein a layer (24) of a lenient substance having good thermal conductivity, such as soft metal, gold, or a thermally conductive paste, is placed between said chip means and said substrate means.
Claim 26
Dependent Claim
61 words
The package according to claim 1, wherein said chip means is situated inside said cavity having said second connection means turned away from said substrate means; and wherein several patches of a lenient substance having good thermal conductivity, such as soft metal, gold, or a thermally conductive paste, are distributed in an interface between said chip means and said substrate means.
Claim 27
Dependent Claim
40 words
The package according to claim 1, wherein said chip means is situated inside said cavity having said second connection means turned away from said substrate means; and wherein an internal side of said substrate means is polished to be smooth.
Claim 28
Dependent Claim
46 words
The package according to claim 1, wherein said chip means (E3) is situated inside said cavity having said second connection means turned away from said substrate means (El); and wherein said interconnection film means (E2) is provided on said lid means (E5) in an integral way.
Claim 29
Dependent Claim
45 words
The package according to claim 27, wherein the interconnection film means is provided on an inner side of said lid means as several layers of alternating polymer and metal leader pattern layers, connection pathways being provided between said metal leader pattern layers in appropriate places.
Claim 30
Dependent Claim
14 words
The package according to claim 28, wherein said pathways are via-openings plated with metal.
Claim 31
Dependent Claim
65 words
The package according to claim 1, wherein where one of said first connection means (4) is adapted to make ohmic contact to one of said fourth connection means (5), one of said connection means, preferably said fourth connection means (5), is provided with a bump, which is a metal protrusion having considerably smaller outer surface than the connection means to which it is making contact.
Claim 32
Dependent Claim
64 words
The package according to claim 1, wherein where one of said second connection means (8) is adapted to make ohmic contact to one of said third connection means (9), one of said connection means, preferably said third connection means, is provided with a bump, which is a metal protrusion having considerably smaller outer surface than the connection means to which it is making contact.
Claim 33
Dependent Claim
38 words
The package according to claim 1, wherein interconnection film means includes several layers of alternating polymer and metal leader pattern layers (e,f,g,h,i,j,k) , connection pathways (11) being provided between said metal leader pattern layers (e,g,k) in appropriate places.
Claim 34
Dependent Claim
42 words
The package according to claim 32, wherein the surfaces of said third and fourth connecting means are in form of metal surfaces on a polymer film, said metal surfaces being provided by at least two layers of different metals having different conductivity.
Claim 35
Dependent Claim
18 words
The package according to claim 33, wherein an outermost metal layer is provided at least spotwise (9, 5).
Claim 36
Dependent Claim
70 words
The package according to claim 1, wherein a multilayer leader pattern (18) comprising polymer as isolator between leaders is disposed on said chip means (42) on its side turned towards said interconnection film means, said multilayer leader pattern (18) having metallized pathways (43) for connections between said metal leader patterns and for connections to pads (19) on said chip means and to said inner first connection means in said cavity.
Claim 37
Dependent Claim
50 words
The package according to claim 1, wherein said contact means (6;22;41) on an exterior side of said package are provided at least on one broadside of the package along at least one lateral side of the package near the edge of it, preferably along all lateral sides of the package.
Claim 38
Dependent Claim
27 words
The package according to claim 36, wherein said contact means (6) on an exterior side of said package are provided on a laterally protruding shelf means (3;14;39).
Claim 39
Dependent Claim
37 words
The package according to claim 36, wherein said contact means on an exterior side of said package include elongated contact means (gnd, Vcc) for connection to ground and supply voltage extending along the edge of the package.
Claim 40
Dependent Claim
33 words
The package according to claim 36, wherein said contact means on an exterior side of the package are provided in at least two parallel lines (28,29,30) extending to said edge of the package.
Claim 41
Dependent Claim
70 words
The package according to claim 1, wherein leaders (7) making contact between said first connection means (4) inside said cavity and said contact means (6) on an exterior side of the package are of the following three types: ground leaders, voltage supply leaders and groups of three balanced data leaders (Kr,Ks,Kt), a sum of currents and a sum of voltages, respectively, on said data leaders (Kr,Ks,Kt) being constant in time.
Claim 42
Dependent Claim
39 words
The package according to claim 40, wherein said data leaders (Kr,Ks,Kt) are provided as three planar, symmetrical leaders provided side by side and having such mutual dimensions that a same characteristic impedance is provided between arbitrary combinations of them.
Claim 43
Dependent Claim
34 words
The package according to claim 41, wherein the two outermost data leaders (Kr,Kt) are broader than the data leader (Ks) placed between them, and wherein the width ratio between said data leaders is fixed.
Claim 44
Dependent Claim
51 words
The package according to claim 40, wherein a non-connected leader (S1) is provided in a plane parallel to a plane in which said data leaders (Kr,Ks,Kt) are provided and electrically isolated in relation to said data leaders and covering an area extending a predetermined distances over said outermost data leaders (Kr,Kt).
Claim 45
Dependent Claim
26 words
The package according claim 40, wherein the width of said data leaders (Kr,Ks,Kt) are varying along their path while keeping the characteristic impedance between them constant.
Claim 46
Dependent Claim
79 words
The package according to claim 1, wherein an electrical connection between said first connection means inside said cavity and said contact means (N8) on an exterior side of said housing are drawn in a plane parallel to a broad side of said housing in said substrate means and drawn to said outside contact means (N8) on the outside of said housing away from said plane in at least one plane perpendicular to said plane parallel to said broad side.
Claim 47
Dependent Claim
11 words
The package according to claim 1, wherein said chip is wafer-sized.
Claim 48
Dependent Claim
36 words
The package according to claim 1, said chip means (A3; B3; C3; E3) being floatingly mounted inside said cavity without any bonding, and held in place by means of said pressure away from said pressure means.
Claim 49
Dependent Claim
39 words
The package according to claim 1, wherein said chip means is floatingly mounted inside said cavity by means of a small spot of adhesive applied to a central portion of the chip, thereby to avoid problems with thermal stress.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-10 | 1998-10-10 | 1999-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-10 | 2002-10-10 | 2003-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-10 | 2006-10-10 | 2007-04-11 | $7700.00 | Window Closed / Lapsed |