Patent US5404005A successfully refreshed from Google Patents.
US5404005A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solid state imaging device and method of manufacturing same
Assignee: Panasonic Holdings Corp
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Filing: 1993-10-06
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Granted: 1995-04-04
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Expires: 2013-10-06
Abstract
Abstract On the surface of a protecting layer mounted on a solid state imaging devices substrate, transparent gap filler layers and a transparent flattening layer are formed to flatten a surface of overlying protecting layer. On a surface of the transparent flattening layer, color filters of red, blue and yellow are formed. The color filters are made of synthetic photosensitive material. By using the synthetic photosensitive material, the color filters are formed with good shape and precision. All of the color filter show good photo spectrography and uniform characteristics. For the reasons, excellent characteristics of the solid state imaging device are provided which are free form image inferiority caused by flicker, shading, dust and so forth.
Inventors
- 👤 Koji Shimomura
- 👤 Yoshikazu Sano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:47
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/011; H10F39/024; H10F39/80; H10F39/805; H10F39/8053; H10F77/00; H10F77/30; H10F77/306; H10F77/331; H10F77/40; H10F77/413; H10F39/10; H10F39/12; H10F39/18
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
47 words
A solid state imaging device comprising: a semiconductor substrate carrying a transfer section and a light-receiving section; a transparent gap filler layer and a transparent flattening layer mounted on the semiconductor substrate; a color filter formed of a synthetic photosensitive material formed on said transparent flattening layer.
Claim 2
Dependent Claim
47 words
A solid state imaging device comprising: a semiconductor substrate carrying a transfer section and a light-receiving section; a transparent gap filler layer and a transparent flattening layer mounted on the semiconductor substrate; a color filter formed of a synthetic photosensitive material formed on said transparent flattening layer.
Claim 3
Dependent Claim
27 words
A solid state imaging device according to claim 1, wherein said transparent gap filler layer and said transparent flattening layer are made of positive photosensitive thermosetting material.
Claim 4
Dependent Claim
24 words
A solid state imaging device according to claim 2, wherein said positive photosensitive thermosetting material is are copolymers of polymethyl methacrylate and polyglycidyl methacrylate.
Claim 5
Dependent Claim
24 words
A solid state imaging device according to claim 1, wherein said color filter is formed of synthetic photosensitive materials containing water as a solvent.
Claim 6
Dependent Claim
36 words
A solid state imaging device according to claim 1, wherein said transparent flattening layer is made of non-photosensitive thermosetting material and said color filter is made of synthetic photosensitive materials containing an organic solvent as solvent.
Claim 7
Dependent Claim
36 words
A solid state1236Ximagedevice according to claim 1, wherein said transparent flattening layer is made of negative photosensitive thermosetting material and said color filter is are made of synthetic photosensitive material containing an organic solvents as solvent.
Claim 8
Dependent Claim
31 words
A solid state imaging device according to claim 5, wherein said color filter is formed of synthetic photosensitive materials containing an azide compound of cross-link and an organic solvent as solvent.
Claim 9
Dependent Claim
37 words
A solid state imaging device according to claim 4, wherein the synthetic photosensitive material for said color filters contains in water an acrylic copolymer, oxy poly basic acid salt and a diazo compound of light cross-link type.
Claim 10
Dependent Claim
124 words
A solid state imaging device according to claim 8, wherein said acrylic compound contained in the synthetic photosensitive material for the said color filter is represented by the following general expression in the range of 5000 through 100000 of average molecule weight: ##STR2## where R 1 represents a hydrogen atom or CH 3 , R 2 and R 3 represent an alkyl group or allyl group such as CH 3 , C 2 H 5 , C 6 H 5 and the like independently, and n represents an integer from 1 to 10; and said acrylic compound comprises 5-20 weight % of a monomer, 45-55 weight % of 2-hydroxy ethyl methacrylate; 20-30 weight % of methacrylic amide; and 5-10 weight % of benzylic methacrylate.
Claim 11
Dependent Claim
35 words
A solid state imaging device according to claim 8, wherein said diazo compound contained in the synthetic photosensitive materials for said color filters comprises a polycondensation product including diphenylamine--4--diazonimum salt or its derivative and formaldehyde.
Claim 12
Dependent Claim
36 words
A solid state imaging device according to claim 8, wherein said diazo compound contained in the synthetic photosensitive material for said color filters comprises a polycondensation product including dephyndylamine--4--diazonium salt or its derivative, and 4.4'--bis--methoxylmethyl diphenylether.
Claim 13
Dependent Claim
31 words
A solid state imaging device according to claim 8, wherein said diazo compound contained in the synthetic photosensitive material for said color filter comprises a compound not including an amino radical.
Claim 14
Dependent Claim
24 words
A solid state imaging device according to claim 10, wherein said diphenylamine--4--diazonium salt or its derivative includes diphenylamine--4--diazonium salt and/or 3--methoxyl diphenylamine--4 diazonium chloride.
Claim 15
Dependent Claim
62 words
A solid state imaging device according to claim 12, wherein said diazo compound contained in said synthetic photosensitive materials for said color filter include one or more couplings out of --C(CH 2 )q--(q is an integer from 1 to 5) or --O--R6--O-- (R 6 through 12C--carbon atoms or aryl) or --O--or --S-- in said diphenylamine--4--diazonium salt or phenyl radicals in its derivative,
Claim 16
Independent Claim
146 words
A method of manufacturing a solid state imaging device comprising the steps of: forming a gap filler layer between a scribe line and a protecting layer mounted on a semiconductor substrate, using positive photosensitive thermosetting material; forming a transparent gap filler layer between the protecting layers on an insulating layer covering the semiconductor substrate and the protecting layers on light-shielding metal layers using positive photosensitive thermosetting material; forming a transparent flattening layer on a surface of the gap filler layer, the transparent gap filler layers and the protecting layers, using positive photosensitive thermosetting material; forming color filters on a surface of the transparent flattening layer by means of exposure and development, using synthetic photosensitive material containing water as a solvent; and removing the gap filler layer and the transparent flattening layer mounted on the scribe line and the bonding pad by means of exposure and development.
Claim 17
Independent Claim
146 words
A method of manufacturing a solid state imaging device comprising the steps of: forming a gap filler layer between a scribe line and a protecting layer mounted on a semiconductor substrate, using positive photosensitive thermosetting material; forming a transparent gap filler layer between the protecting layers on an insulating layer covering the semiconductor substrate and the protecting layers on light-shielding metal layers using positive photosensitive thermosetting material; forming a transparent flattening layer on a surface of the gap filler layer, the transparent gap filler layers and the protecting layers, using positive photosensitive thermosetting material; forming color filters on a surface of the transparent flattening layer by means of exposure and development, using synthetic photosensitive material containing water as a solvent; and removing the gap filler layer and the transparent flattening layer mounted on the scribe line and the bonding pad by means of exposure and development.
Claim 18
Dependent Claim
61 words
A method of manufacturing a solid state imaging device according to claim 15, wherein the step of forming the color filters on the surface of said transparent layer by means of irradiation and development using the synthetic photosensitive material containing water for solvent, forms the color filters by means of coloring with desired dyestuffs after the color filter patterns are formed.
Claim 19
Independent Claim
133 words
A method of manufacturing a solid state imaging device comprising the steps of: forming a gap filler layer between a scribe line and a protecting layer mounted on a semiconductor substrate; forming transparent gap filler layers between the protecting layers mounted on an insulating layer covering the semiconductor substrate and the protecting layers on light-shielding metal layers; forming a transparent flattening layer on a surface of the gap filler layer, the transparent gap filler layers and the protecting layers, using non-photosensitive thermosetting material; treating the transparent flattening layer with heat to form color filters on a surface of the transparent flattening layer, using synthetic photosensitive material containing an organic solvent; and removing the transparent flattening layer on bonding pads and the gap filler layer on the scribe line by means of dry etching.
Claim 20
Independent Claim
133 words
A method of manufacturing a solid state imaging device comprising the steps of: forming a gap filler layer between a scribe line and a protecting layer mounted on a semiconductor substrate; forming transparent gap filler layers between the protecting layers mounted on an insulating layer covering the semiconductor substrate and the protecting layers on light-shielding metal layers; forming a transparent flattening layer on a surface of the gap filler layer, the transparent gap filler layers and the protecting layers, using non-photosensitive thermosetting material; treating the transparent flattening layer with heat to form color filters on a surface of the transparent flattening layer, using synthetic photosensitive material containing an organic solvent; and removing the transparent flattening layer on bonding pads and the gap filler layer on the scribe line by means of dry etching.
Claim 21
Independent Claim
113 words
A method of manufacturing a solid state imaging device comprising the steps of: forming a gap filler layer between a scribe line and a protecting layer mounted on a semiconductor substrate; forming a transparent flattening layer on a surface of the gap filler layer, the transparent gap filler layers and the protecting layers, using negative thermosetting material; treating the transparent flattening layer with heat and/or radiation exposure; forming color filters on the transparent flattening layer, using synthetic photosensitive material containing an organic solvent; and removing the transparent flattening layer formed on bonding pads for the solid state imaging device and the gap filler layer on the scribe line by means of dry etching.
Claim 22
Independent Claim
113 words
A method of manufacturing a solid state imaging device comprising the steps of: forming a gap filler layer between a scribe line and a protecting layer mounted on a semiconductor substrate; forming a transparent flattening layer on a surface of the gap filler layer, the transparent gap filler layers and the protecting layers, using negative thermosetting material; treating the transparent flattening layer with heat and/or radiation exposure; forming color filters on the transparent flattening layer, using synthetic photosensitive material containing an organic solvent; and removing the transparent flattening layer formed on bonding pads for the solid state imaging device and the gap filler layer on the scribe line by means of dry etching.
Claim 23
Dependent Claim
131 words
A dyeable synthetic photosensitive material for color filters on a solid state imaging device which is dissolved into water with a solvent of: an acrylic copolymer consisting of 5-20 weight % of monomer as shown by the following general formula within a range of mean molecular weight from 5000 to 100000 where R 1 represents a hydrogen atom or CH 3 , R 2 and R 3 represent an alkyl group or allyl group such as CH 3 , C 2 H 5 , C 6 H 5 and the like independently, and n represents an integer from 1 to 10; 45-55 weight % of 2-hydroxy ethyl methacrylate; 20-30 weight % of methacrylic amide; and 5-10 weight % of benzylic methacrylate; and oxy poly basic acid salt and a diazo compound.
Claim 24
Dependent Claim
131 words
A dyeable synthetic photosensitive material for color filters on a solid state imaging device which is dissolved into water with a solvent of: an acrylic copolymer consisting of 5-20 weight % of monomer as shown by the following general formula within a range of mean molecular weight from 5000 to 100000 where R 1 represents a hydrogen atom or CH 3 , R 2 and R 3 represent an alkyl group or allyl group such as CH 3 , C 2 H 5 , C 6 H 5 and the like independently, and n represents an integer from 1 to 10; 45-55 weight % of 2-hydroxy ethyl methacrylate; 20-30 weight % of methacrylic amide; and 5-10 weight % of benzylic methacrylate; and oxy poly basic acid salt and a diazo compound.
Claim 25
Independent Claim
112 words
A method of manufacturing a solid state imaging device which comprises the steps of: preparing a substrate having at least light receiving sections and charge transfer sections; forming light-shield material on the charge transfer sections; covering the light receiving sections and the charge transfer sections with a protecting layer; forming a transparent gap filler layer of photosensitive thermosetting material on the protecting layer in the light receiving sections; forming a transparent flattening layer of photosensitive thermosetting materials on the transparent gap filler layer and the protecting layer in the charge transfer sections; and forming color filters of synthetic photosensitive material with a water solvent, on the surface of the transparent flattening layers.
Claim 26
Independent Claim
112 words
A method of manufacturing a solid state imaging device which comprises the steps of: preparing a substrate having at least light receiving sections and charge transfer sections; forming light-shield material on the charge transfer sections; covering the light receiving sections and the charge transfer sections with a protecting layer; forming a transparent gap filler layer of photosensitive thermosetting material on the protecting layer in the light receiving sections; forming a transparent flattening layer of photosensitive thermosetting materials on the transparent gap filler layer and the protecting layer in the charge transfer sections; and forming color filters of synthetic photosensitive material with a water solvent, on the surface of the transparent flattening layers.
Claim 27
Dependent Claim
25 words
A method of manufacturing a solid state imaging device according to claim 20 wherein the color filters are formed through light exposure and development techniques.
Claim 28
Independent Claim
184 words
A method of manufacturing a solid state imaging device which comprises the steps of: preparing a substrate having at least light receiving sections and charge transfer sections, said substrate further having bonding pads for external connection of the solid state imaging device and a scribe line for separation of the solid state imaging device into individual solid state imaging units; forming light-shield material on the charge transfer sections; covering the light receiving sections and the charge transfer sections with a protecting layer; forming a transparent gap filler layer of positive type photosensitive thermosetting material on the protecting layer in the light receiving sections; forming a transparent gap filler layer of photosensitive thermosetting material in the scribe line and in the bonding pads; forming a transparent flattening layer of photosensitive thermosetting materials on the transparent gap filler layer and the protecting layer in the charge transfer sections; forming color filters of synthetic photosensitive material with a water solvent, on the surface of the transparent flattening layers; and removing the gap filler layer and the transparent flattening layer from the scribe line and the bonding pads.
Claim 29
Independent Claim
184 words
A method of manufacturing a solid state imaging device which comprises the steps of: preparing a substrate having at least light receiving sections and charge transfer sections, said substrate further having bonding pads for external connection of the solid state imaging device and a scribe line for separation of the solid state imaging device into individual solid state imaging units; forming light-shield material on the charge transfer sections; covering the light receiving sections and the charge transfer sections with a protecting layer; forming a transparent gap filler layer of positive type photosensitive thermosetting material on the protecting layer in the light receiving sections; forming a transparent gap filler layer of photosensitive thermosetting material in the scribe line and in the bonding pads; forming a transparent flattening layer of photosensitive thermosetting materials on the transparent gap filler layer and the protecting layer in the charge transfer sections; forming color filters of synthetic photosensitive material with a water solvent, on the surface of the transparent flattening layers; and removing the gap filler layer and the transparent flattening layer from the scribe line and the bonding pads.
Claim 30
Dependent Claim
97 words
A solid state imaging device comprising: a semiconductor substrate carrying a transfer section and a light-receiving section; a flattening layer mounted on the semiconductor substrate for flattering a surface of the transfer section and a surface of the light-receiving section, said flattering layer including thermosetting material; a color filter formed on said transparent flattening layer, said color filter including synthetic photosensitive material and being colored to manifest a desired photo spectrograph, said synthetic photosensitive material containing water as solvent, wherein the thermosetting material in the flattening layer is selected not to dissolve into the synthetic photosensitive material.
Claim 31
Dependent Claim
97 words
A solid state imaging device comprising: a semiconductor substrate carrying a transfer section and a light-receiving section; a flattening layer mounted on the semiconductor substrate for flattering a surface of the transfer section and a surface of the light-receiving section, said flattering layer including thermosetting material; a color filter formed on said transparent flattening layer, said color filter including synthetic photosensitive material and being colored to manifest a desired photo spectrograph, said synthetic photosensitive material containing water as solvent, wherein the thermosetting material in the flattening layer is selected not to dissolve into the synthetic photosensitive material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-03 | 1998-10-03 | 1999-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-03 | 2002-10-03 | 2003-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-03 | 2006-10-03 | 2007-04-04 | $7700.00 | Window Closed / Lapsed |