Process of using a jig to align and mount terminal conductors to a semiconductor plastic package

Claim 1

A method for manufacturing a semiconductor device having a resin package, comprising the steps of: supplying a plurality of terminal members, each terminal member having a geometric form permitting substantially free rolling movement thereof when placed on a flat surface, on a jig that has an upper major surface, said upper major surface being formed with a plurality of depressions arranged in accordance with a desired lead pattern, such that the terminal members settle in the depressions and are held thereby, said depressions being smaller than the terminal members such that a space is formed between the terminal members and the depressions when the terminal members are held in the depressions; placing an interconnection member on said jig, the interconnection member having upper and lower major surfaces and carrying a semiconductor chip on one of the upper and lower major surfaces, said interconnection member further having a conductor pattern in electrical connection with the semiconductor chip, such that the lower major surface of the interconnection member establishes contact with the terminal members held in the depressions; establishing an electric connection and a mechanical connection between the terminal members held in the depressions and the interconnection member; and casting a resin on the interconnection member thereby to form the resin package and such that the semiconductor chip and the interconnection member are embedded in the resin package with the terminal members projecting from the package.

Claim 2

A method for manufacturing a semiconductor device having a resin package, comprising the steps of: supplying a plurality of terminal members, each terminal member having a geometric form permitting substantially free rolling movement thereof when placed on a flat surface, on a jig that has an upper major surface, said upper major surface being formed with a plurality of depressions arranged in accordance with a desired lead pattern, such that the terminal members settle in the depressions and are held thereby, said depressions being smaller than the terminal members such that a space is formed between the terminal members and the depressions when the terminal members are held in the depressions; placing an interconnection member on said jig, the interconnection member having upper and lower major surfaces and carrying a semiconductor chip on one of the upper and lower major surfaces, said interconnection member further having a conductor pattern in electrical connection with the semiconductor chip, such that the lower major surface of the interconnection member establishes contact with the terminal members held in the depressions; establishing an electric connection and a mechanical connection between the terminal members held in the depressions and the interconnection member; and casting a resin on the interconnection member thereby to form the resin package and such that the semiconductor chip and the interconnection member are embedded in the resin package with the terminal members projecting from the package.

Claim 6

A method for manufacturing a semiconductor device having a resin package, comprising the steps of: placing an interconnection member on a jig, the interconnection member having upper and lower major surfaces and carrying a semiconductor chip on one of the upper and lower major surfaces thereof, said interconnection member further having a conductor pattern in electrical connection with the semiconductor chip, the jig further having a plurality of support members projecting therefrom and contacting corresponding positions on the interconnection member when the interconnection member is placed on the jig, said plurality of support members being arranged in a pattern corresponding to the conductor pattern of the interconnection member; casting a resin on the interconnection member in the state in which the interconnection member is placed on the jig and so as to form a resin package in which the semiconductor chip and the interconnection member are embedded; removing the jig from the resin package, said resin package having a plurality of depressions therein corresponding to the positions at which the support members of the jig contacted the interconnection member; supplying a plurality of terminal members, each terminal member having a geometric form permitting substantially free rolling movement thereof when placed on a flat surface, to the resin package such that respective said terminal members settle in the plurality of depressions; and fusing the respective terminal members, as settled in the plurality of depressions, to the interconnection member.

Claim 7

A method for manufacturing a semiconductor device having a resin package, comprising the steps of: placing an interconnection member on a jig, the interconnection member having upper and lower major surfaces and carrying a semiconductor chip on one of the upper and lower major surfaces thereof, said interconnection member further having a conductor pattern in electrical connection with the semiconductor chip, the jig further having a plurality of support members projecting therefrom and contacting corresponding positions on the interconnection member when the interconnection member is placed on the jig, said plurality of support members being arranged in a pattern corresponding to the conductor pattern of the interconnection member; casting a resin on the interconnection member in the state in which the interconnection member is placed on the jig and so as to form a resin package in which the semiconductor chip and the interconnection member are embedded; removing the jig from the resin package, said resin package having a plurality of depressions therein corresponding to the positions at which the support members of the jig contacted the interconnection member; supplying a plurality of terminal members, each terminal member having a geometric form permitting substantially free rolling movement thereof when placed on a flat surface, to the resin package such that respective said terminal members settle in the plurality of depressions; and fusing the respective terminal members, as settled in the plurality of depressions, to the interconnection member.