Terminal connection

Abstract

Abstract PURPOSE: To make possible fine connection by fastening the components through irradiation of a high energy beam with a reduced spot diameter in the connection of a fine lead formed on the film carrier and a fine electrode provided on an IC chip or a printed board. CONSTITUTION: A plurality of fine electrodes 2 comprising a single or multiple layer metal thin film is formed on an IC chip or a printed board 1 by evaporation, sputtering, plating or the like. On the other hand, a metal thin film made of copper, gold or the like is provided on a transparent film 3 made of polyimide as film carrier by lamination, evaporation or the like and made a lead pattern 4 by etching. Then, facing each other, the electrode 2 and the pattern 4 are securely positioned with a tool, and the contact part thereof is fused together by a laser beam 5 irradiated vertically from the back of the film 3 in such a manner as to be reduced to almost the same size as the diameter of the electrode. With such an arrangement, the local heating makes possible a fine connection below 10μm and in a contactless manner. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Norio Matsui
• 👤 Takaaki Osaki
• 👤 Norio Nishi

Bibliographic Details