Patent US5400949A successfully refreshed from Google Patents.
US5400949A
Expired / Lapsed
US
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Circuit board assembly
Assignee: Nokia Oyj
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Filing: 1994-01-18
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Granted: 1995-03-28
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Expires: 2014-01-18
Abstract
Abstract A circuit board assembly including a shielding housing mounted on a circuit board (1), the shielding housing being intended for radio-frequency shieldings. The shielding housing (2) having a wall inclined at an angle α to a plane orthogonal to the plane of the circuit board. The housing of the circuit board assembly being suitable for at least a partial embedding into an exterior wall of an electronic apparatus.
Inventors
- 👤 Timo Hirvonen
- 👤 Ari Leman
- 👤 Veli-Matti Valimaa
- 👤 Petri Hossi
- 👤 Jari Olkkola
- 👤 Lasse Uronen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 12:18
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0022; H05K9/0024; H05K9/0026; H05K9/0028; H05K9/003; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; Y; Y10; Y10S; Y10S174/00; Y10S174/35
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
154 words
A method of reflow soldering components to a circuit board comprising steps of: positioning an interference shielding housing on the circuit board to enclose predetermined electronic components located on the circuit board, the housing having apertures extending through a top surface and located between the circuit board and a bottom edge of the housing and, a substantially solid inclined wall between the bottom edge and top surface that does not have holes; and heating the circuit board, electronic components and housing by use of hot air, wherein the hot air flows into the apertures at the bottom edge of the housing and out of the housing through the apertures at the top surface with a chimney-like air flow such that the hot air heats solder enclosed by the housing to thereby cause melting and reflow of the solder to simultaneously reflow solder the housing and the enclosed predetermined electronic components to the circuit board.
Claim 2
Independent Claim
154 words
A method of reflow soldering components to a circuit board comprising steps of: positioning an interference shielding housing on the circuit board to enclose predetermined electronic components located on the circuit board, the housing having apertures extending through a top surface and located between the circuit board and a bottom edge of the housing and, a substantially solid inclined wall between the bottom edge and top surface that does not have holes; and heating the circuit board, electronic components and housing by use of hot air, wherein the hot air flows into the apertures at the bottom edge of the housing and out of the housing through the apertures at the top surface with a chimney-like air flow such that the hot air heats solder enclosed by the housing to thereby cause melting and reflow of the solder to simultaneously reflow solder the housing and the enclosed predetermined electronic components to the circuit board.
References Cited (Backward Citations)
US4410874A
Cited
US4370515A
Cited
US4517738A
Cited
JPS60148158A
Cited
US4626963A
Cited
EP0262332A2
Cited
US4838475A
Cited
US4839774A
Cited
FR2629664A1
Cited
JPH03206691A
Cited
EP0519768A2
Cited
FI914416L
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-27 | 1998-09-26 | 1999-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-27 | 2002-09-26 | 2003-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-27 | 2006-09-26 | 2007-03-28 | $7700.00 | Window Closed / Lapsed |