US5400221A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board mounted with electric elements thereon
Assignee: NEC Corp
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Filing: 1993-10-21
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Granted: 1995-03-21
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Expires: 2013-10-21
Abstract
Abstract Electric elements such as a resistance chip, a capacitor chip, a semiconductor device package, and a connector are mounted on a printed circuit board by using at least two methods selected from the re-flow method using cream solder, the chip-on board method using bonding wires, the outer lead bonding method, and the thermal pressing method using heat-seal. The printed circuit board is provided with lands having surface layers of a non-electrolysis Ni--Au plate, a soft Au plate and an electrolysis solder plate, each corresponding to a selected mounting method.
Inventors
- 👤 Joji Kawaguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/36; H05K3/361; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
169 words
A printed circuit board comprising lands for mounting electric elements on said printed circuit board, said lands having a structure dependent upon which of a plurality of methods is used to mount electric elements on said printed circuit board; said lands having a structure comprising a predetermined pattern of a copper foil covered by a non-electrolysis Ni--Au plate when a re-flow method using cream solder is used, or a thermal pressing method is used; said lands having a structure comprising said predetermined pattern of a copper foil covered by said non-electrolysis Ni--Au plate, said non-electrolysis Ni--Au plate being in turn covered by an electrolysis solder plate when an outer lead bonding method is used to mount a tape carrier package; said lands having a structure comprising said predetermined pattern of a copper foil covered by said non-electrolysis Ni--Au plate, said non-electrolysis Ni--Au plate being covered in turn by a soft Au plate when a chip onboard method is used to mount said electric elements on said printed circuit board.
Claim 2
Dependent Claim
169 words
A printed circuit board comprising lands for mounting electric elements on said printed circuit board, said lands having a structure dependent upon which of a plurality of methods is used to mount electric elements on said printed circuit board; said lands having a structure comprising a predetermined pattern of a copper foil covered by a non-electrolysis Ni--Au plate when a re-flow method using cream solder is used, or a thermal pressing method is used; said lands having a structure comprising said predetermined pattern of a copper foil covered by said non-electrolysis Ni--Au plate, said non-electrolysis Ni--Au plate being in turn covered by an electrolysis solder plate when an outer lead bonding method is used to mount a tape carrier package; said lands having a structure comprising said predetermined pattern of a copper foil covered by said non-electrolysis Ni--Au plate, said non-electrolysis Ni--Au plate being covered in turn by a soft Au plate when a chip onboard method is used to mount said electric elements on said printed circuit board.
Claim 3
Dependent Claim
33 words
A printed circuit board, according to claim 1, wherein: said electric elements comprise at least two electric elements selected from a resistance chip, a capacitor chip, a semiconductor device package, and a connector.
Claim 4
Dependent Claim
119 words
A printed circuit board comprising: printed electric circuits formed with a predetermined pattern on said printed circuit board; and lands provided on said printed circuit board, said lands being connected to said printed electric circuit, and comprising a land having a non-electrolysis Ni--Au plate surface layer to be used for a re-flow and thermal pressing methods to mount electric elements on said printed circuit board, a land having a soft Au plate surface layer to be used for a chip onboard method to mount electric circuit elements on said printed board, and a land having an electrolysis solder plate surface layer to be used for an outer lead bonding method to mount electric elements on said printed circuit board.
Claim 5
Dependent Claim
119 words
A printed circuit board comprising: printed electric circuits formed with a predetermined pattern on said printed circuit board; and lands provided on said printed circuit board, said lands being connected to said printed electric circuit, and comprising a land having a non-electrolysis Ni--Au plate surface layer to be used for a re-flow and thermal pressing methods to mount electric elements on said printed circuit board, a land having a soft Au plate surface layer to be used for a chip onboard method to mount electric circuit elements on said printed board, and a land having an electrolysis solder plate surface layer to be used for an outer lead bonding method to mount electric elements on said printed circuit board.
Claim 6
Independent Claim
185 words
A method of fabricating a printed circuit board comprising lands for mounting a plurality of electric elements on said printed circuit board, said lands comprising a predetermined pattern of a copper foil covered by a non-electrolysis Ni--Au plate, said method comprising the steps of: covering said non-electrolysis Ni--Au plate of some of said lands with an electrolysis solder plate surface layer to allow a tape carrier package to be mounted by a local re-flow method on said lands covered by said electrolysis solder plate; covering said non-electrolysis Ni--Au plate of some of said lands with a soft Au plate surface layer to allow said electric elements to be mounted by a chip onboard method on said soft Au plate surface layer covered lands using bonding wires; mounting some of said plurality of electric elements on some of said lands covered by said non-electrolysis Ni--Au plate surface layer by a local re-flow method using cream solder; and mounting some of said plurality of electric elements on some of said lands covered by said non-electrolysis Ni--Au plate surface layer by a thermal pressing method providing heat seal.
Claim 7
Independent Claim
185 words
A method of fabricating a printed circuit board comprising lands for mounting a plurality of electric elements on said printed circuit board, said lands comprising a predetermined pattern of a copper foil covered by a non-electrolysis Ni--Au plate, said method comprising the steps of: covering said non-electrolysis Ni--Au plate of some of said lands with an electrolysis solder plate surface layer to allow a tape carrier package to be mounted by a local re-flow method on said lands covered by said electrolysis solder plate; covering said non-electrolysis Ni--Au plate of some of said lands with a soft Au plate surface layer to allow said electric elements to be mounted by a chip onboard method on said soft Au plate surface layer covered lands using bonding wires; mounting some of said plurality of electric elements on some of said lands covered by said non-electrolysis Ni--Au plate surface layer by a local re-flow method using cream solder; and mounting some of said plurality of electric elements on some of said lands covered by said non-electrolysis Ni--Au plate surface layer by a thermal pressing method providing heat seal.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-20 | 1998-09-19 | 1999-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-20 | 2002-09-19 | 2003-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-20 | 2006-09-19 | 2007-03-21 | $7700.00 | Window Closed / Lapsed |