Patent US5384955A successfully refreshed from Google Patents.
US5384955A
Expired / Lapsed
US
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Method for replacing IC chip package interposer
Assignee: International Business Machines Corp
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Filing: 1994-01-05
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Granted: 1995-01-31
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Expires: 2014-01-05
Abstract
Abstract A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.
Inventors
- 👤 Richard B. Booth
- 👤 Robert H. Gephard
- 👤 Bradley S. Gremban
- 👤 Janet E. Poetzinger
- 👤 David T. M. Shen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K3/36; H05K3/368; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/641; H05K1/00; H05K1/02; H05K1/0272; H05K1/14; H05K1/144; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09436; H05K2201/095; H05K2201/09536; H05K2201/096; H05K2201/09818; H05K2201/09845; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K3/22; H05K3/225; H05K3/30; H05K3/32; H05K3/321; H05K3/40; H05K3/42; H05K3/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/49155; Y10T29/49165; Y10T29/49718; Y10T29/49721; Y10T29/49723; Y10T29/49725; Y10T29/49726; Y10T29/4973
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
81 words
A method of altering integrated circuit (IC) chip package wiring, said package having an interposer, said method comprising the steps of: a) removing an interposer from an IC chip package, said interposer having a plurality of interposer layers, said plurality of interposer layers being laminated to one another with adhesive material; b) replacing at least one of said interposer layer with a corrected interposer layer thereby producing a replacement interposer; and c) remounting said replacement interposer in said IC chip package.
Claim 2
Independent Claim
81 words
A method of altering integrated circuit (IC) chip package wiring, said package having an interposer, said method comprising the steps of: a) removing an interposer from an IC chip package, said interposer having a plurality of interposer layers, said plurality of interposer layers being laminated to one another with adhesive material; b) replacing at least one of said interposer layer with a corrected interposer layer thereby producing a replacement interposer; and c) remounting said replacement interposer in said IC chip package.
Claim 3
Dependent Claim
45 words
The method of altering integrated circuit chip package wiring of claim 1 wherein said replacing step b) comprises: i) delaminating said interposer layers; ii) replacing each said at least one interposer layer with said corrected layer; and iii) relaminating said interposer layers together with adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-30 | 1998-08-01 | 1999-01-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-30 | 2002-08-01 | 2003-01-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-30 | 2006-08-01 | 2007-01-31 | $7700.00 | Window Closed / Lapsed |