US4688151A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayered interposer board for powering high current chip modules
Assignee: International Business Machines Corp
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Filing: 1986-03-10
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Granted: 1987-08-18
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Expires: 2006-03-10
Abstract
Abstract A multilayered interposer powering board is disclosed for the distribution of required voltage levels to integrated circuit chip modules under conditions of high current demand and heat induced expansions. The interposer board is introduced between the module and its module mounting board. Flexible connector fingers are intermetallically or ohmically connected between a given level of the interposer board and a given power level of the module.
Inventors
- 👤 Charles J. Kraus
- 👤 Herbert I. Stoller
- 👤 Leon L. Wu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 10:33
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W90/00; H10W90/401; H05K1/0213; H05K1/0263; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10272; H05K2201/10295; H05K2201/10303; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3447; H05K3/36; H05K3/368
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
128 words
An interposer board positioned between a multilayered module and a module mounting board, said module having a plurality of chip powering levels and signal path levels for servicing a plurality of semiconductor circuit chips, said interposer board comprising a plurality of insulated current-carrying conductive planes of greater conductivity than said powering levels of said module, groups of flexible contacting members, each said plane being apertured and receiving one of said groups of flexible contacting members, each member of the same group, at one end, being ohmically connected to a respective first location on a respective plane and, at the other end, to a respective second location on an associated powering level, said first locations being at a multiplicity of points throughout the surface area of the respective plane.
Claim 2
Dependent Claim
128 words
An interposer board positioned between a multilayered module and a module mounting board, said module having a plurality of chip powering levels and signal path levels for servicing a plurality of semiconductor circuit chips, said interposer board comprising a plurality of insulated current-carrying conductive planes of greater conductivity than said powering levels of said module, groups of flexible contacting members, each said plane being apertured and receiving one of said groups of flexible contacting members, each member of the same group, at one end, being ohmically connected to a respective first location on a respective plane and, at the other end, to a respective second location on an associated powering level, said first locations being at a multiplicity of points throughout the surface area of the respective plane.
Claim 3
Dependent Claim
46 words
The interposer board defined in claim 1 wherein each said aperture is of sufficient dimensions to accommodate displacement of the respective member due to thermal expansion without causing contact between said respective member and any plane other than the plane to which it is ohmcally connected.
Claim 4
Dependent Claim
33 words
The interposer board defined in claim 1 wherein said planes are further apertured to allow passage of conductors from said signal path levels through said interposer board without contacting any of said planes.
Claim 5
Dependent Claim
72 words
The interposer board defined in claim 1 wherein each said aperture is of sufficient dimensions to accommodate displacement of the respective member due to thermal expansion without causing contact between said respective member and any plane other than the plane to which it is ohmically connected, and said planes are further apertured to allow passage of conductors from said signal path levels through said interposer board without contacting any of said planes.
Claim 6
Dependent Claim
24 words
The interposer board defined in claim 1 and further including a respective power bus connected to each of said planes for applying power thereto.
Claim 7
Dependent Claim
14 words
The interposer board defined in claim 1 wherein each of said planes comprises copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-08-17 | 1991-02-16 | 1991-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-08-17 | 1995-02-16 | 1995-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-08-17 | 1999-02-16 | 1999-08-18 | $7700.00 | Window Closed / Lapsed |