Patent US5382333A successfully refreshed from Google Patents.
US5382333A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing copper clad laminate
Assignee: Mitsubishi Gas Chemical Co Inc
•
Filing: 1992-09-24
•
Granted: 1995-01-17
•
Expires: 2012-09-24
Abstract
Abstract A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
Inventors
- 👤 Kazuhiro Ando
- 👤 Takamasa Kawakami
- 👤 Yasuhiro Shouji
- 👤 Yasuo Tanaka
- 👤 Takeo Kanaoka
- 👤 Norio Sayama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:46
CPC Classifications
C; C23; C23C; C23C22/00; C23C22/82; C23C22/83; C23C22/05; C23C22/60; C23C22/63; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1157; H05K3/46; H05K3/4611
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
151 words
A process for producing a copper-clad laminate which comprises placing a (i) copper foil on (ii) prepregs to form an assembly and lamination molding the resulting assembly, wherein the (i) copper foil is an electrodeposited copper foil or a rolled copper foil and is obtained by treating a surface of a (iii) starting copper foil with an oxidizing aqueous alkaline solution to thereby form, on the surface of the (iii) starting copper foil, a fine roughness constituted of a copper oxide of a brown to black color and then reducing the copper oxide which constitutes the fine roughness in an atmosphere in which hydrazine as a reducing gas is present, to thereby form a roughened surface for adhesion while the fine roughness is maintained substantially unchanged, wherein said reducing is conducted at a temperature of from 60° to 160° C. under a hydrazine gas pressure of from 0.1 to 15 mmHg.
Claim 2
Dependent Claim
151 words
A process for producing a copper-clad laminate which comprises placing a (i) copper foil on (ii) prepregs to form an assembly and lamination molding the resulting assembly, wherein the (i) copper foil is an electrodeposited copper foil or a rolled copper foil and is obtained by treating a surface of a (iii) starting copper foil with an oxidizing aqueous alkaline solution to thereby form, on the surface of the (iii) starting copper foil, a fine roughness constituted of a copper oxide of a brown to black color and then reducing the copper oxide which constitutes the fine roughness in an atmosphere in which hydrazine as a reducing gas is present, to thereby form a roughened surface for adhesion while the fine roughness is maintained substantially unchanged, wherein said reducing is conducted at a temperature of from 60° to 160° C. under a hydrazine gas pressure of from 0.1 to 15 mmHg.
References Cited (Backward Citations)
US4189331A
Cited
US4328048A
Cited
US4833004A
Cited
US4865948A
Cited
EP0189913A1
Cited
US4642161A
Cited
US4795512A
Cited
EP0402966A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-16 | 1998-07-18 | 1999-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-16 | 2002-07-18 | 2003-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-16 | 2006-07-18 | 2007-01-17 | $7700.00 | Window Closed / Lapsed |