US4642161A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of bonding copper and resin
Assignee: Hitachi Ltd
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Filing: 1986-01-27
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Granted: 1987-02-10
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Expires: 2006-01-27
Abstract
Abstract A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.
Inventors
- 👤 Haruo Akahoshi
- 👤 Kanji Murakami
- 👤 Motoyo Wajima
- 👤 Kiyonori Kogawa
- 👤 Ritsuji Toba
- 👤 Takeshi Shimazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:59
CPC Classifications
C; C09; C09J; C09J5/00; C09J5/02; B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B15/20; B32B38/00; B32B38/0036; B32B38/004; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C22/00; C23C22/05; C23C22/60; C23C22/63; C23C22/82; C23C22/83; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; B32B2305/00; B32B2305/07; B32B2305/076; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1157; H05K3/46; H05K3/4611
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
55 words
A method of bonding copper and a resin together comprising the steps of forming a copper oxide layer on the surface of copper by oxidiation of copper, reducing said copper oxide layer to metallic copper with a reducing solution, and bonding the surface of said metallic copper formed by said reduction and a resin together.
Claim 2
Independent Claim
55 words
A method of bonding copper and a resin together comprising the steps of forming a copper oxide layer on the surface of copper by oxidiation of copper, reducing said copper oxide layer to metallic copper with a reducing solution, and bonding the surface of said metallic copper formed by said reduction and a resin together.
Claim 3
Dependent Claim
60 words
A method of bonding copper and a resin together as claimed in claim 1, wherein said reducing solution is an aqueous solution containing at least one amine borane represented by the general formula: BH 3 .NHRR' (wherein R and R' are each a member selected from the group consisting of H, CH 3 , and CH 2 CH 3 )
Claim 4
Dependent Claim
34 words
A method of bonding copper and a resin together as claimed in claim 2, wherein said bonding is effected by heat-pressing said surface of said metallic copper formed by said reduction and said resin.
Claim 5
Dependent Claim
45 words
A method of bonding copper and a resin together as claimed in claim 3, wherein said resin is a member selected from the group consisting of polyimide resins, polyamide resins, epoxy resins, polyester resins, phenolic resins, polyethylene resins, polyphenylene sulfide resins, polyether-imide resins, and fluororesins.
Claim 6
Dependent Claim
41 words
A method of bonding copper and a resin together as claimed in claim 3, wherein said copper is immersed in an aqueous neutral or alkaline solution containing an oxidizing agent to form said copper oxide layer on the surface of copper.
Claim 7
Dependent Claim
24 words
A method of bonding copper and a resin together as claimed in claim 5, wherein said oxidizing agent is a chlorite or a persulfate.
Claim 8
Independent Claim
105 words
A method of bonding copper and a resin together comprising the step (i) of forming copper oxide layers on the surfaces of copper foils of a plurarity of copper clad laminates, the step (ii) of reducing said copper oxide layers to metallic copper with a reducing solution, and the step (iii) of heat-pressing an assembly of said copper clad laminates subjected to the step (ii) which are piled up with a prepreg(s) therebetween impregnated with a resin for contact of the surfaces of said metallic copper with said resin of said prepreg(s) to effect bonding of said metallic copper and said resin of said prepreg(s).
Claim 9
Independent Claim
105 words
A method of bonding copper and a resin together comprising the step (i) of forming copper oxide layers on the surfaces of copper foils of a plurarity of copper clad laminates, the step (ii) of reducing said copper oxide layers to metallic copper with a reducing solution, and the step (iii) of heat-pressing an assembly of said copper clad laminates subjected to the step (ii) which are piled up with a prepreg(s) therebetween impregnated with a resin for contact of the surfaces of said metallic copper with said resin of said prepreg(s) to effect bonding of said metallic copper and said resin of said prepreg(s).
Claim 10
Dependent Claim
22 words
A method of bonding copper and a resin together as claimed in claim 7, wherein said copper foils have predetermined patterns formed.
Claim 11
Dependent Claim
60 words
A method of bonding copper and a resin together as claimed in claim 8, wherein said reducing solution is an aqueous solution containing at least one amine borane represented by the general formula: BH 3 .NHRR' (wherein R and R' are each a member selected from the group consisting of H, CH 3 , and CH 2 CH 3 )
Claim 12
Dependent Claim
45 words
A method of bonding copper and a resin together as claimed in claim 9, wherein said resin is a member selected from the group consisting of polyimide resins, polyamide resins, epoxy resins, polyester resins, phenolic resins, polyethylene resins, polyphenylene sulfide resins, polyetherimide resins, and fluororesins.
Claim 13
Dependent Claim
45 words
A method of bonding copper and a resin together as claimed in claim 9, wherein said surface of copper foils are immersed in an aqueous neutral or alkaline solution containing an oxidizing agent to form said copper oxide layers on said surfaces of copper foils.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-09 | 1990-08-11 | 1991-02-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-09 | 1994-08-11 | 1995-02-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-09 | 1998-08-11 | 1999-02-10 | $7700.00 | Window Closed / Lapsed |