CH613152A5
Expired / Lapsed
CH
⏱️ 0.0 years remaining
Process for producing a metallised laminate
Assignee: Uop Inc
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Filing: 1976-08-13
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Granted: —
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Expires: 1996-08-13
Abstract
Abstract The metallised laminate is produced by treating a substrate with a release agent, depositing a layer of metal on the thus treated surface of the substrate, treating the top side of this conductive metal with improvement of its adhesive properties, bonding the conductive metal to a laminate, removing the substrate and thus obtaining the resulting metallised laminate. The metal layer has a thickness of 1 to 20 mu . When the metallised laminate is produced in this manner, it can be readily stripped off the material of the respective substrate. Such a laminate is used for example in printed circuit technology.
Inventors
- 👤 Richard George Sarazin
- 👤 Alan Delbert Wilks
Bibliographic Details
Application Number
—
Jurisdiction
CH
Data Source
google_patents
Last Synchronized
2026-10-24 23:06
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/06; B32B27/10; B32B15/00; B32B15/04; B32B15/08; B32B27/38; B32B27/42; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; H05K3/38; H05K3/382; H05K3/385; B32B38/00; B32B2038/0052; B32B2038/0092; B32B2255/00; B32B2255/20; B32B2255/205; B32B2363/00; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0162; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/0156; H05K2203/03; H05K2203/0307; H05K2203/0315; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/0726; H05K3/10; H05K3/18; H05K3/181; H05K3/389
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