US5382333A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing copper clad laminate
Assignee: Mitsubishi Gas Chemical Co Inc
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Filing: 1992-09-24
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Granted: 1995-01-17
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Expires: 2012-09-24
Abstract
Abstract A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
Inventors
- 👤 Kazuhiro Ando
- 👤 Takamasa Kawakami
- 👤 Yasuhiro Shouji
- 👤 Yasuo Tanaka
- 👤 Takeo Kanaoka
- 👤 Norio Sayama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 07:42
CPC Classifications
C; C23; C23C; C23C22/00; C23C22/82; C23C22/83; C23C22/05; C23C22/60; C23C22/63; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1157; H05K3/46; H05K3/4611
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
151 words
A process for producing a copper-clad laminate which comprises placing a (i) copper foil on (ii) prepregs to form an assembly and lamination molding the resulting assembly, wherein the (i) copper foil is an electrodeposited copper foil or a rolled copper foil and is obtained by treating a surface of a (iii) starting copper foil with an oxidizing aqueous alkaline solution to thereby form, on the surface of the (iii) starting copper foil, a fine roughness constituted of a copper oxide of a brown to black color and then reducing the copper oxide which constitutes the fine roughness in an atmosphere in which hydrazine as a reducing gas is present, to thereby form a roughened surface for adhesion while the fine roughness is maintained substantially unchanged, wherein said reducing is conducted at a temperature of from 60° to 160° C. under a hydrazine gas pressure of from 0.1 to 15 mmHg.
Claim 2
Dependent Claim
151 words
A process for producing a copper-clad laminate which comprises placing a (i) copper foil on (ii) prepregs to form an assembly and lamination molding the resulting assembly, wherein the (i) copper foil is an electrodeposited copper foil or a rolled copper foil and is obtained by treating a surface of a (iii) starting copper foil with an oxidizing aqueous alkaline solution to thereby form, on the surface of the (iii) starting copper foil, a fine roughness constituted of a copper oxide of a brown to black color and then reducing the copper oxide which constitutes the fine roughness in an atmosphere in which hydrazine as a reducing gas is present, to thereby form a roughened surface for adhesion while the fine roughness is maintained substantially unchanged, wherein said reducing is conducted at a temperature of from 60° to 160° C. under a hydrazine gas pressure of from 0.1 to 15 mmHg.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-16 | 1998-07-18 | 1999-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-16 | 2002-07-18 | 2003-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-16 | 2006-07-18 | 2007-01-17 | $7700.00 | Window Closed / Lapsed |