US5380956A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip cooling module and method
Assignee: Sun Microsystems Inc
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Filing: 1993-07-06
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Granted: 1995-01-10
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Expires: 2013-07-06
Abstract
Abstract A liquid cooling module for semiconductor chips is disclosed. The module includes a plurality of substrates, each containing at least one chip. The substrates are arranged in the module so that when coolant flows through the module, the coolant is exposed to the top and bottom surfaces of the chips. A gasket is used between each substrate. The gasket is made if a Z-axis elastromeric material that is impervious to liquid and therefore directs the flow of the coolant in the module and makes the module liquid tight. The material also is conductive in the Z direction, but not the X or Y direction, thereby making electrical communication between the chips on different substrate levels possible. The module is intended to be attached to a circuit board, thus simplifying the layout of liquid cooled chips on the board.
Inventors
- 👤 Mike C. Loo
- 👤 Marlin R. Vogel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:14
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
43 words
A method of cooling a semiconductor chip, comprising the steps of: exposing a top surface and a bottom surface of a chip on a substrate; and circulating coolant over the exposed top surface and the bottom surface of the chip on the substrate.
Claim 2
Independent Claim
43 words
A method of cooling a semiconductor chip, comprising the steps of: exposing a top surface and a bottom surface of a chip on a substrate; and circulating coolant over the exposed top surface and the bottom surface of the chip on the substrate.
Claim 3
Dependent Claim
41 words
The method of claim 1, wherein the circulating step further comprises the steps of: passing the coolant over the top surface of the chip, passing the coolant through the substrate, and passing the coolant over the bottom surface of the chip.
Claim 4
Dependent Claim
35 words
The method of claim 1, further comprising the steps of: providing a second chip on a second substrate adjacent the first substrate; and circulating coolant over exposed top and bottom surfaces of the second chip.
Claim 5
Dependent Claim
24 words
The method of claim 3, further comprising the step of: providing a gasket between the first substrate and the second substrate in the module.
Claim 6
Dependent Claim
31 words
The method of claim 4, further comprising the step of electrically communicating between the first chip on the first substrate and the second chip on the second substrate through the gasket.
Claim 7
Dependent Claim
17 words
The method of claim 5, further comprising the step of using a Z-axis material as a gasket.
Claim 8
Dependent Claim
39 words
The method of claim 1, further comprising the steps of: providing a first plate for receiving coolant; providing a second plate for dispensing coolant; forming a cooling module by positioning the substrate between the first plate and second plate.
Claim 9
Independent Claim
55 words
A method for providing a cooling module for semiconductor chips, comprising the steps of: providing a member for carrying a chip; and positioning the chip on the member so that a substantial portion of a top surface and a bottom surface of the chip is exposed to coolant when coolant is circulated through the module.
Claim 10
Independent Claim
55 words
A method for providing a cooling module for semiconductor chips, comprising the steps of: providing a member for carrying a chip; and positioning the chip on the member so that a substantial portion of a top surface and a bottom surface of the chip is exposed to coolant when coolant is circulated through the module.
Claim 11
Dependent Claim
56 words
The method of claim 8, further comprising the steps of providing a top plate for receiving the coolant and providing a bottom plate for dispensing the coolant from the module, and the positioning step further includes the step of positioning the chip on the member between the first plate and the second plate in the module.
Claim 12
Dependent Claim
24 words
The method of claim 8, wherein the positioning step further comprises the step of inserting the chip into an open region in the member.
Claim 13
Dependent Claim
27 words
The method of claim 8, further comprising the step of forming a conduit in the member for channeling coolant over the exposed bottom surface of the chip.
Claim 14
Dependent Claim
35 words
The method of claim 8, further comprising the step of forming a hole in the member so that coolant can pass from the top surface of the chip to the bottom surface of the chip.
Claim 15
Dependent Claim
38 words
The method of claim 9, further comprising the step of providing a second member for carrying a second chip and positioning the member adjacent the second member between the top plate and the bottom plate of the module.
Claim 16
Dependent Claim
31 words
The method of claim 13, further comprising the step of providing a gasket adjacent the member and the second member between the top plate and the bottom plate in the module.
Claim 17
Dependent Claim
34 words
The method of claim 14, wherein the gasket is made of an elastomeric material for enabling electrical communication between the fast chip on the member and the adjacent second chip on the second member.
Claim 18
Dependent Claim
36 words
The method of claim 14, wherein the gasket is further for channeling coolant over the bottom surface of the first chip on the member and a top surface of the second chip on the second member.
Claim 19
Dependent Claim
49 words
The method of claim 13, further comprising the step of positioning the member so as to form a conduit for coolant starting at the inlet of the top plate, over the top surface of the first chip, through the member, and across the bottom surface of the first chip.
Claim 20
Dependent Claim
52 words
The method of claim 17, further comprising the step of positioning the second member so as to form a conduit for coolant starting at the top surface of the second chip, through the second member, across the bottom surface of the second chip, and then through the outlet of the second plate.
Claim 21
Dependent Claim
28 words
The method of claim 8, further including the step of providing a metal interconnect on the member for enabling the chip to electrically communicate with other electrical components.
Claim 22
Dependent Claim
20 words
The method of claim 19, wherein the external components are located either on the member or remote from the member.
Claim 23
Dependent Claim
29 words
The method of claim 8, further comprising the step of providing leads for the module to enable the chip to communicate with other electrical components external to the module.
Claim 24
Dependent Claim
24 words
The method of claim 9, further comprising the step of providing a second member for carrying a second chip that does not require cooling.
Claim 25
Dependent Claim
23 words
The method of claim 9, further comprising the step of providing a gasket between the top plate and the member in the module.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-09 | 1998-07-11 | 1999-01-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-09 | 2002-07-11 | 2003-01-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-09 | 2006-07-11 | 2007-01-10 | $7700.00 | Window Closed / Lapsed |