Electrically conductive substrate interconnect continuity region and method of forming same with an angled implant

Claim 1

A method for providing a plurality of low resistance electrical paths in a substrate of a semiconductor device, comprising: a) creating a control layer overlying portions of the substrate, said control layer having diametrically opposed and exposed first and second edges, said first and second edges formed substantially normal to a face plane of the substrate; and b) performing an angled implant comprising, i) a first bombarding of said control layer with ions to implant ions in the substrate and to alter the conductivity thereof thereby forming a first low resistance electrical interconnect, said bombarding performed at an oblique angle with the first edge, said first low resistance electrical interconnect formed in a region underlying said control layer from a point where ion penetration is prohibited by a thickness of said control layer toward said first edge, and ii) a second bombarding of said control layer with ions to implant ions in the substrate and to alter the conductivity thereof thereby forming a second low resistance electrical interconnect, said bombarding performed at an oblique angle with the second edge, said second low resistance electrical interconnect formed in a region underlying said control layer from a point where ion penetration is prohibited by a thickness of said control layer toward said second edges; c) forming a first conductive region in a first region of the substrate without said control layer, said first conductive region adjacent to a plane in which said first exposed edge lies; d) forming a second conductive region in a second region of the substrate without said control layer, said second conductive region adjacent to a plane in which said second exposed edge lies; e) etching portions of said control layer to form a first and a second opening; f) forming a third conductive region in the substrate defined by said first opening; and g) forming a fourth conductive region in the substrate defined by said second opening, wherein said first, said second, said third, and said fourth conductive regions are distance one from the other, and wherein said first low resistance electrical interconnect is interposed between and provides electrical communication between said first and said third conductive regions, and wherein said second low resistance electrical interconnect is interposed between and provides electrical communication between said second and said fourth conductive regions, said first and said second low resistance electrical interconnects forming the plurality of low resistance electrical paths, wherein said first low resistance electrical interconnect and said first and said third conductive regions have a same conductivity type, and wherein said second low resistance electrical interconnect and said second and said fourth conductive regions have a same conductivity type.

Claim 2

A method for providing a plurality of low resistance electrical paths in a substrate of a semiconductor device, comprising: a) creating a control layer overlying portions of the substrate, said control layer having diametrically opposed and exposed first and second edges, said first and second edges formed substantially normal to a face plane of the substrate; and b) performing an angled implant comprising, i) a first bombarding of said control layer with ions to implant ions in the substrate and to alter the conductivity thereof thereby forming a first low resistance electrical interconnect, said bombarding performed at an oblique angle with the first edge, said first low resistance electrical interconnect formed in a region underlying said control layer from a point where ion penetration is prohibited by a thickness of said control layer toward said first edge, and ii) a second bombarding of said control layer with ions to implant ions in the substrate and to alter the conductivity thereof thereby forming a second low resistance electrical interconnect, said bombarding performed at an oblique angle with the second edge, said second low resistance electrical interconnect formed in a region underlying said control layer from a point where ion penetration is prohibited by a thickness of said control layer toward said second edges; c) forming a first conductive region in a first region of the substrate without said control layer, said first conductive region adjacent to a plane in which said first exposed edge lies; d) forming a second conductive region in a second region of the substrate without said control layer, said second conductive region adjacent to a plane in which said second exposed edge lies; e) etching portions of said control layer to form a first and a second opening; f) forming a third conductive region in the substrate defined by said first opening; and g) forming a fourth conductive region in the substrate defined by said second opening, wherein said first, said second, said third, and said fourth conductive regions are distance one from the other, and wherein said first low resistance electrical interconnect is interposed between and provides electrical communication between said first and said third conductive regions, and wherein said second low resistance electrical interconnect is interposed between and provides electrical communication between said second and said fourth conductive regions, said first and said second low resistance electrical interconnects forming the plurality of low resistance electrical paths, wherein said first low resistance electrical interconnect and said first and said third conductive regions have a same conductivity type, and wherein said second low resistance electrical interconnect and said second and said fourth conductive regions have a same conductivity type.