Patent US5375041A successfully refreshed from Google Patents.
US5375041A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ra-tab array bump tab tape based I.C. package
Assignee: Intel Corp
•
Filing: 1992-12-02
•
Granted: 1994-12-20
•
Expires: 2012-12-02
Abstract
Abstract An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
Inventors
- 👤 John F. McMahon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/451; H10W70/453; H10W72/071; H10W72/077; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49128
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
118 words
An electronic assembly, comprising: a metal substrate having a top surface, a bottom surface and a cavity in said top surface; an electrical device mounted into said cavity of said substrate; and, a flexible circuit wrapped around said substrate, said flexible circuit having a first layer of dielectric that separates said substrate from a plurality of first signal lines and a second layer of dielectric that separates said first signal lines from a power/ground plane, said first signal lines and said power/ground plane being coupled to said electrical device, said flexible circuit having a plurality of metal pads located adjacent to said bottom surface of said substrate and coupled to said first signal lines and said power/ground plane.
Claim 2
Dependent Claim
118 words
An electronic assembly, comprising: a metal substrate having a top surface, a bottom surface and a cavity in said top surface; an electrical device mounted into said cavity of said substrate; and, a flexible circuit wrapped around said substrate, said flexible circuit having a first layer of dielectric that separates said substrate from a plurality of first signal lines and a second layer of dielectric that separates said first signal lines from a power/ground plane, said first signal lines and said power/ground plane being coupled to said electrical device, said flexible circuit having a plurality of metal pads located adjacent to said bottom surface of said substrate and coupled to said first signal lines and said power/ground plane.
Claim 3
Dependent Claim
21 words
The assembly as recited in claim 1, wherein at least one of said metal pads is coupled to said metal substrate.
Claim 4
Dependent Claim
48 words
The assembly as recited in claim 1, wherein said flexible circuit includes a plurality of second signal lines separated from said first signal lines by a layer of dielectric, said flexible circuit having a plurality of vias that couple said first signal lines to said second signal lines.
Claim 5
Dependent Claim
17 words
The assembly as recited in claim 1, further comprising a dielectric material that encapsulates said electrical device.
Claim 6
Dependent Claim
22 words
The assembly as recited in claim 1, wherein said flexible circuit has an outer layer of dielectric that covers said power/ground plane.
Claim 7
Dependent Claim
117 words
An electronic assembly, comprising: a metal substrate having a top surface, a bottom surface and a cavity in said top surface; an electrical device mounted into said cavity of said substrate; and, a flexible circuit wrapped around said substrate, said flexible circuit having a first layer of dielectric that separates said substrate from a power/ground plane and a second layer of dielectric that separates said power/ground plane from a plurality of first signal lines, said first signal lines and said power/ground plane being coupled to said electrical device, said flexible circuit having a plurality of metal pads located adjacent to said bottom surface of said substrate and coupled to said first signal lines and said power/ground plane.
Claim 8
Dependent Claim
117 words
An electronic assembly, comprising: a metal substrate having a top surface, a bottom surface and a cavity in said top surface; an electrical device mounted into said cavity of said substrate; and, a flexible circuit wrapped around said substrate, said flexible circuit having a first layer of dielectric that separates said substrate from a power/ground plane and a second layer of dielectric that separates said power/ground plane from a plurality of first signal lines, said first signal lines and said power/ground plane being coupled to said electrical device, said flexible circuit having a plurality of metal pads located adjacent to said bottom surface of said substrate and coupled to said first signal lines and said power/ground plane.
Claim 9
Dependent Claim
21 words
The assembly as recited in claim 6, wherein at least one of said metal pads is coupled to said metal substrate.
Claim 10
Dependent Claim
48 words
The assembly as recited in claim 7, wherein said flexible circuit includes a plurality of second signal lines separated from said first signal lines by a layer of dielectric, said flexible circuit having a plurality of vias that couple said first signal lines to said second signal lines.
Claim 11
Dependent Claim
17 words
The assembly as recited in claim 8, further comprising a dielectric material that encapsulates said electrical device.
Claim 12
Dependent Claim
25 words
The assembly as recited in claim 6, wherein said flexible circuit has an outer layer of dielectric that covers said plurality of first signal lines.
References Cited (Backward Citations)
FR2021484A1
Cited
US4885126A
Cited
WO1989010005A1
Cited
JPH0448741A
Cited
WO1992005582A1
Cited
US5166866A
Cited
US5229916A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-19 | 1998-06-20 | 1998-12-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-19 | 2002-06-20 | 2002-12-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-19 | 2006-06-20 | 2006-12-20 | $7700.00 | Window Closed / Lapsed |