Mounting body of semiconductor component

Abstract

Abstract PURPOSE:To inexpensively, easily mount in a high density with high reliability by connecting leads of different film boards to rows of connecting terminals of a semiconductor component having a plurality of rows of the connecting terminals therearound. CONSTITUTION:Three rows of connecting terminals 2 are formed around a semiconductor component 1. Film boards 3-a, 3-b, 3-c are independent, the board 3-a has a lead 4-a to be connected to an outermost peripheral connecting terminal 2-a of the component 1, the board 3-b has a lead 4-b to be connected to a second connecting terminal 2-b, and the board 3-c has a lead 4-c to be connected to the innermost peripheral connecting terminal 2-c. The lead of the board 3-a is connected to the terminal 2-a of the component 1 by a normal thermo-compression bonding method. Then, the lead 4-b of the board 3-b is connected to the terminal 2-b and the lead 4-b of the board 3-c is eventually connected to the terminal 3-c by thermo-compression bonding.

Inventors

• 👤 Mutsuo Tsuji
• 👤 睦夫 辻
• 👤 Kenzo Hatada
• 👤 畑田　賢造

Bibliographic Details