Method of producing pillar-shaped DRAM and ROM devices

Claim 1

A method of producing a semiconductor device, which comprises the steps of: preparing a semiconductor substrate; forming a semiconductor pillar, projecting upwardly from a main surface of a semiconductor substrate by a first height and having a circumferential sidewall surface substantially perpendicular to, and a top surface at the first height which is substantially parallel to, the main surface of the semiconductor substrate; forming a first insulating layer on the top surface of the semiconductor pillar, the first insulating layer having an upper surface; forming a second insulating layer by an oxidation process on the circumferential sidewall surface of the semiconductor pillar and the main surface of the substrate; forming a conductive sidewall on the second insulating layer, surrounding the circumferential sidewall of the semiconductor pillar and spaced therefrom by the second insulating layer, the conductive sidewall having a top edge at a second height, less than the first height of the top surface of the semiconductor pillar; forming a third insulating layer on the surface of the conductive sidewall; forming a fourth insulating layer on the entire exposed surface of the device so as to cover the exposed main surface of the substrate and bury the semiconductor pillar, including the conductive sidewall formed thereon and the top surface thereof; removing a portion of the fourth insulating layer so as to form an upper surface thereof which is substantially parallel to the main surface of the substrate and substantially coplanar with the upper surface of the first insulating layer formed on the top surface of the semiconductor pillar; selectively and without oxidizing the semiconductor pillar, oxidizing an upper portion of the conductive sidewall, including and extending from the top edge thereof, thereby to form an additional insulating portion integral with the third insulating layer formed on the surface of the conductive sidewall and with the second insulating layer formed on the circumferential sidewall surface of the semiconductor pillar, the additional insulating portion affording an improved breakdown voltage characteristic of the conductive sidewall relative to the upper surface of the fourth insulating layer; removing at least a part of the first insulating layer formed on the top surface of the semiconductor pillar thereby to expose at least a corresponding part of the top surface of the semiconductor pillar; and forming a conductive pattern on and in electrical contact with the at least a part of and exposed top surface of the semiconductor pillar and extending on the upper surface of the fourth insulating layer.

Claim 2

A method of producing a semiconductor device, which comprises the steps of: preparing a semiconductor substrate; forming a semiconductor pillar, projecting upwardly from a main surface of a semiconductor substrate by a first height and having a circumferential sidewall surface substantially perpendicular to, and a top surface at the first height which is substantially parallel to, the main surface of the semiconductor substrate; forming a first insulating layer on the top surface of the semiconductor pillar, the first insulating layer having an upper surface; forming a second insulating layer by an oxidation process on the circumferential sidewall surface of the semiconductor pillar and the main surface of the substrate; forming a conductive sidewall on the second insulating layer, surrounding the circumferential sidewall of the semiconductor pillar and spaced therefrom by the second insulating layer, the conductive sidewall having a top edge at a second height, less than the first height of the top surface of the semiconductor pillar; forming a third insulating layer on the surface of the conductive sidewall; forming a fourth insulating layer on the entire exposed surface of the device so as to cover the exposed main surface of the substrate and bury the semiconductor pillar, including the conductive sidewall formed thereon and the top surface thereof; removing a portion of the fourth insulating layer so as to form an upper surface thereof which is substantially parallel to the main surface of the substrate and substantially coplanar with the upper surface of the first insulating layer formed on the top surface of the semiconductor pillar; selectively and without oxidizing the semiconductor pillar, oxidizing an upper portion of the conductive sidewall, including and extending from the top edge thereof, thereby to form an additional insulating portion integral with the third insulating layer formed on the surface of the conductive sidewall and with the second insulating layer formed on the circumferential sidewall surface of the semiconductor pillar, the additional insulating portion affording an improved breakdown voltage characteristic of the conductive sidewall relative to the upper surface of the fourth insulating layer; removing at least a part of the first insulating layer formed on the top surface of the semiconductor pillar thereby to expose at least a corresponding part of the top surface of the semiconductor pillar; and forming a conductive pattern on and in electrical contact with the at least a part of and exposed top surface of the semiconductor pillar and extending on the upper surface of the fourth insulating layer.