Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
110 words
An improved electrical interconnect system for a flexible circuit comprising: a flexible first layer; at least one protrusion on said flexible first layer having an electrical contact; a planar rigid second layer; at least one recessed electrical contact provided on a bottom surface of a rectangular recess formed on said second layer; spring means coupled to said flexible first layer and to said second layer for pressing said electrical contact on said protrusion on said flexible first layer to said electrical contact on said second layer; and wherein said electrical contact on said protrusion on said flexible first layer is electrically coupled to said electrical contact on said second layer.
Claim 2
Dependent Claim
110 words
An improved electrical interconnect system for a flexible circuit comprising: a flexible first layer; at least one protrusion on said flexible first layer having an electrical contact; a planar rigid second layer; at least one recessed electrical contact provided on a bottom surface of a rectangular recess formed on said second layer; spring means coupled to said flexible first layer and to said second layer for pressing said electrical contact on said protrusion on said flexible first layer to said electrical contact on said second layer; and wherein said electrical contact on said protrusion on said flexible first layer is electrically coupled to said electrical contact on said second layer.
Claim 3
Dependent Claim
61 words
The improved electrical interconnect system for a flexible circuit of claim 1 wherein said spring means for pressing said electrical contact on said protrusion on said flexible first layer to said electrical contact on said second layer further comprises relief means for allowing said flexible first layer to deform during assembly of said improved electrical interconnect system for a flexible circuit.
Claim 4
Dependent Claim
108 words
The improved electrical interconnect system for a flexible circuit of claim 2 wherein said spring means for pressing said electrical contact on said protrusion on said flexible first layer to said electrical contact on said second layer further comprises: a frame coupled to said flexible first layer and to said second layer; and pressure means coupled to said frame and to said first flexible layer for pressing said protrusion on said first flexible layer to said second layer; wherein said protrusion on said first flexible layer is between said second layer and said pressure means for pressing said protrusion on said first flexible layer to said second layer.
Claim 5
Dependent Claim
47 words
The improved electrical system for a flexible circuit of claim 3 wherein said relief means for allowing said flexible first layer to deform during assembly of said improved electrical interconnect system for a flexible circuit further comprises a relief area between said pressure means and said frame.
Claim 6
Dependent Claim
23 words
The improved electrical interconnect system for a flexible circuit of claim 4 wherein said relief area further comprises a bevel on said frame.
Claim 7
Dependent Claim
41 words
The improved electrical interconnect system for a flexible circuit of claim 5 wherein said pressure means for pressing said protrusion on said first flexible layer to said second layer further comprises an elastomeric pad mounted in a recess in said frame.
Claim 8
Dependent Claim
41 words
The improved electrical interconnect system for a flexible circuit of claim 1: wherein said electrical contact on said protrusion on said flexible first layer is coated with gold; and wherein said electrical contact on said second layer is coated with gold.
Claim 9
Dependent Claim
44 words
The improved electrical interconnect system for a flexible circuit of claim 1 further comprising alignment means coupled to said flexible first layer and said second layer and said spring means for aligning said flexible first layer with said second layer and said spring means.
Claim 10
Dependent Claim
83 words
The improved electrical interconnect system for a flexible circuit of claim 8 wherein said alignment means for aligning said flexible first layer with said second layer and said spring means further comprises: at least one alignment pin mounted on said frame; at least one alignment hole in said flexible first layer corresponding to said alignment pin and coupled to said alignment pin; and at least one alignment hole in said second layer corresponding to said alignment pin and coupled to said alignment pin.
Claim 11
Dependent Claim
206 words
An improved electrical interconnect system for a flexible circuit comprising: a flexible first layer; a plurality of protrusions each having an electrical contact on said flexible first layer; a planar rigid second layer having a plurality of recessed electrical contacts; a frame coupled to said flexible first layer and to said second layer; an elastomeric pad mounted into a recess in said frame and coupled to said flexible first layer for applying pressure to said plurality of protrusions on said flexible first layer; bevel means coupled to said frame for allowing said flexible first layer to deform during assembly of said improved electrical interconnect system for a flexible circuit; at least one alignment pin mounted on said frame; at least one alignment hole in said flexible first layer corresponding to said alignment pin and coupled to said alignment pin; and at least one alignment hole in said second layer corresponding to said alignment pin and coupled to said alignment pin; wherein said plurality of protrusions on said flexible first layer are located between said second layer and said elastomeric pad; and wherein said electrical contacts on said plurality of protrusions on said flexible first layer are electrically coupled to said electrical contacts on said second layer.
Claim 12
Dependent Claim
206 words
An improved electrical interconnect system for a flexible circuit comprising: a flexible first layer; a plurality of protrusions each having an electrical contact on said flexible first layer; a planar rigid second layer having a plurality of recessed electrical contacts; a frame coupled to said flexible first layer and to said second layer; an elastomeric pad mounted into a recess in said frame and coupled to said flexible first layer for applying pressure to said plurality of protrusions on said flexible first layer; bevel means coupled to said frame for allowing said flexible first layer to deform during assembly of said improved electrical interconnect system for a flexible circuit; at least one alignment pin mounted on said frame; at least one alignment hole in said flexible first layer corresponding to said alignment pin and coupled to said alignment pin; and at least one alignment hole in said second layer corresponding to said alignment pin and coupled to said alignment pin; wherein said plurality of protrusions on said flexible first layer are located between said second layer and said elastomeric pad; and wherein said electrical contacts on said plurality of protrusions on said flexible first layer are electrically coupled to said electrical contacts on said second layer.