US5158466A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metallically encapsulated elevated interconnection feature
Assignee: Raytheon Co
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Filing: 1991-03-04
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Granted: 1992-10-27
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Expires: 2011-03-04
Abstract
Abstract A pressure type contact (10) for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers in which one wafer is plated with a raised conductive interconnection feature. The raised feature is formed by placing a small lump (44) of electrically conductive resin on a substrate (12) and then electrolytically forming on the substrate a trace (18) having an enlarged connector pad (20) that completely covers the cured projecting resin lump.
Inventors
- 👤 Christopher M. Schreiber
- 👤 David B. Swarbrick
- 👤 Haim Feigenbaum
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 17:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H01R12/65; H01R4/00; H01R4/04; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/035; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09818; H05K2201/09909; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/247; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
89 words
A method of forming an electrical connector part comprising the steps of: providing a flexible substrate; coating the substrate with a thin electrically conductive material; forming a raised lump of solid, relatively high strength non-elastomeric material on the coated substrate; wherein the lump comprises a resin laden with an electrically conductive material cured in place on the thin coating of the substrate; encapsulating the lump with an electrically conductive connector pad on the substrate; and forming an electrically conductive trace on the substrate in electrical connection with the pad.
Claim 2
Independent Claim
89 words
A method of forming an electrical connector part comprising the steps of: providing a flexible substrate; coating the substrate with a thin electrically conductive material; forming a raised lump of solid, relatively high strength non-elastomeric material on the coated substrate; wherein the lump comprises a resin laden with an electrically conductive material cured in place on the thin coating of the substrate; encapsulating the lump with an electrically conductive connector pad on the substrate; and forming an electrically conductive trace on the substrate in electrical connection with the pad.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein the resin is selected from the group consisting of silver epoxy, gold epoxy and aluminum epoxy.
Claim 4
Dependent Claim
28 words
The method of claim 1 wherein the step of encapsulating comprises electroforming the pad over the lump and on at least part of the substrate adjacent the lump.
Claim 5
Dependent Claim
29 words
The method of claim 1 wherein the steps of encapsulating and forming comprise electroforming on the substrate a conductive trace having a partially raised integral pad covering the lump.
Claim 6
Dependent Claim
101 words
An electrical connector part comprising: a flexible substrate, wherein the substrate comprises a dielectric material having a thin electrically conductive coating; a raised lump of solid, relatively high strength, non-elastomeric material formed on the substrate, wherein the lump comprises a resin laden with an electrically conductive material and cured in place on the thin coating of the substrate; an electrically conductive connector pad encapsulating the lump and formed on the substrate; and an electrically conductive trace formed on the substrate in electrical connection with the pad, wherein the trace and pad are electroformed on the thin coating and on the lump.
Claim 7
Dependent Claim
101 words
An electrical connector part comprising: a flexible substrate, wherein the substrate comprises a dielectric material having a thin electrically conductive coating; a raised lump of solid, relatively high strength, non-elastomeric material formed on the substrate, wherein the lump comprises a resin laden with an electrically conductive material and cured in place on the thin coating of the substrate; an electrically conductive connector pad encapsulating the lump and formed on the substrate; and an electrically conductive trace formed on the substrate in electrical connection with the pad, wherein the trace and pad are electroformed on the thin coating and on the lump.
Claim 8
Dependent Claim
22 words
The connector of claim 5 wherein the resin is selected from the group consisting of silver epoxy, gold epoxy and aluminum epoxy.
References Cited (Backward Citations)
US3680206A
Cited
US4000054A
Cited
US3936930A
Cited
US3971610A
Cited
US4116517A
Cited
US4403272A
Cited
US4758459A
Cited
US4813129A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-27 | 1996-04-27 | 1996-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-27 | 2000-04-27 | 2000-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-27 | 2004-04-27 | 2004-10-27 | $7700.00 | Window Closed / Lapsed |