US5369060A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for dicing composite wafers
Assignee: Robert Bosch GmbH
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Filing: 1993-06-01
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Granted: 1994-11-29
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Expires: 2013-06-01
Abstract
Abstract In a method for dicing multi-layer composite wafers, proceeding from an upper side of the wafer, cuts are introduced into an upper layer of the wafer and, proceeding from a lower side of the wafer, cuts are introduced into a lower layer of the wafer.
Inventors
- 👤 Helmut Baumann
- 👤 Juergen Kurle
- 👤 Peter Eiberger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:12
CPC Classifications
H; H10; H10P; H10P52/00; B; B28; B28D; B28D5/00; B28D5/02; B28D5/022; B28D5/029; Y; Y10; Y10S; Y10S148/00; Y10S148/028; Y10T; Y10T83/00; Y10T83/04; Y10T83/0581
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
141 words
A method of dicing a composite wafer into a plurality of chips, wherein the wafer is formed of first and second layers of different materials, thereby defining an interface between the first and second layers, comprising the steps of: making a first cut into the first layer at a first side of the wafer so that the first cut extends from the first side of the wafer to the interface between the first and second layers, the first layer being composed of a first material; and making a second cut into the second layer at a second side of the wafer so that the second cut extends from the second side of the wafer, through the second layer, to the interface between the first and second layers, the second layer being composed of a second material different than the first material.
Claim 2
Independent Claim
141 words
A method of dicing a composite wafer into a plurality of chips, wherein the wafer is formed of first and second layers of different materials, thereby defining an interface between the first and second layers, comprising the steps of: making a first cut into the first layer at a first side of the wafer so that the first cut extends from the first side of the wafer to the interface between the first and second layers, the first layer being composed of a first material; and making a second cut into the second layer at a second side of the wafer so that the second cut extends from the second side of the wafer, through the second layer, to the interface between the first and second layers, the second layer being composed of a second material different than the first material.
Claim 3
Dependent Claim
25 words
The method according to claim 1, wherein the first and second cuts meet at a point on the interface between the first and second layers.
Claim 4
Dependent Claim
48 words
The method according to claim 1, wherein: the first layer is an upper layer of the wafer; the first side is an upper side of the wafer; the second layer is a lower layer of the wafer; and the second side is a lower side of the wafer.
Claim 5
Dependent Claim
12 words
The method according to claim 1, wherein the first material is silicon.
Claim 6
Dependent Claim
12 words
The method according to claim 1, wherein the second material is glass.
Claim 7
Dependent Claim
16 words
The method according to claim 2, wherein the first and second cuts are made by sawing.
Claim 8
Dependent Claim
46 words
The method according to claim 6, wherein the sawing of the first cut is performed by a first saw blade adapted to cut the first material, and the sawing of the second cut is performed by a second saw blade adapted to cut the second material.
Claim 9
Dependent Claim
21 words
The method according to claim 1, further comprising the step of etching at least one diaphragm out of the first layer.
Claim 10
Dependent Claim
45 words
The method according to claim 7, wherein the first material is silicon and the second material is glass and wherein the first saw blade includes diamond particles arranged in a nickel matrix and the second saw blade includes diamond particles arranged in a plastic matrix.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-28 | 1998-05-30 | 1998-11-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-28 | 2002-05-30 | 2002-11-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-28 | 2006-05-30 | 2006-11-29 | $7700.00 | Window Closed / Lapsed |