Wedge bump bonding apparatus and method

Claim 1

A bonding tool for use with a wedge bonder assembly for applying interconnect bumps to an integrated circuit, which bonding tool comprises: a tool body having a longitudinal axis and a distal end; a bonding portion on said distal end having a flat bonding face perpendicular to said longitudinal axis; a distal surface on said distal end perpendicular to said longitudinal axis, wherein said distal surface is parallel to and situated more proximally than said bonding face; a through passage having an outlet in said distal surface and defined by said tool body through which wire or ribbon is passed into proximity to the integrated circuit; and an edge element positioned between said bonding face and said outlet in said distal surface that terminates more distally than said bonding face, said edge element having a surface adjacent to and perpendicular to said bonding face and a convex surface adjacent to and extending proximally to said distal surface, wherein said edge element is adapted to weaken wire or ribbon located between said edge element and the integrated circuit that is in contact with said edge element and said convex surface is configured to facilitate the passage of wire or ribbon around said edge element below said bonding face; and wherein said bonding face is parallel to the integrated circuit and passes ultrasonic force is passed to bond wire or ribbon in contact with said bonding face and the integrated circuit.