Device and method for forming bump

Abstract

Abstract PURPOSE:To form a bump without dispersion in the bump height by forming an impression portion to impress wire to a chip, and a conducting-out portion to conduct out wire to the impression portion, and by forming the protruded part for carving impressed marks on the surface of wire. CONSTITUTION:A wire 3 is conducted out from a conducting-out portion 22 to the lower part of an impression portion 21, and a wedge tool 2 is made to fall down so that the wire can get to the surface of a chip 5. Then, the wire 3 is impressed to the chip 5 with the support of the impression portion 21. At this time, a protruded portion 25 is also impressed on the surface of the wire 3, and impressed marks are carved on the wire 3 by the protruded portion 25. Next, a wedge tool 2 is elevated up, and at the same time, the wire 3 is clamped by a clamped 4, and the wire 3 is pulled up. Then, the wire 3 is disconnected from the portion where the impressed marks 6 were carved, and a bump 3a is formed on the surface of the chip 5. The surface a of the bump 3a which was formed in this way is flat, and the bump height H becomes the fixed height.

Inventors

• 👤 Masahide Koyama
• 👤 賢秀 小山

Bibliographic Details