Patent US5362669A successfully refreshed from Google Patents.
US5362669A
Expired / Lapsed
US
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Method of making integrated circuits
Assignee: RPX Clearinghouse LLC
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Filing: 1993-06-24
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Granted: 1994-11-08
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Expires: 2013-06-24
Abstract
Abstract A method is provided for forming a fully planarized trench isolated region in a semiconductor substrate for an integrated circuit, for example, a trench isolated field oxide region, or a trench isolated semiconductor region in which thin film semiconductor devices are formed. Planarization is accomplished by a chemical mechanical polishing process in which coplanar layers of a chemical mechanical polish resistant material are provided in a centre region of wide trenches as well as on the semiconductor substrate surface adjacent the trenches. The chemical mechanical polish resistant layer in the centre region of a wide trench forms an etch stop to prevent dishing of layers filling the trench during overall wafer planarization by chemical mechanical polishing. The method is compatible with CMOS, Bipolar and Bipolar CMOS processes for submicron VLSI and ULSI integrated circuit structures.
Inventors
- 👤 John M. Boyd
- 👤 Joseph P. Ellul
- 👤 Sing P. Tay
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 07:23
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/06; H10P95/062; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/014; H10W10/0143; H10W10/041; H10W10/061; H10W10/10; H10W10/17; H10W10/181; H10W10/40; Y; Y10; Y10S; Y10S148/00; Y10S148/05
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
169 words
A method of fabricating an integrated circuit, comprising: providing a semiconductor substrate having a planar surface and comprising a surface layer of a chemical mechanical polish resistant material, the substrate having defined therein a steep sided trench; filling the trench with at least one conformal layer of a trench filling material and a conformal layer of chemical mechanical polish resistant material, the layer of chemical mechanical polish resistant material within the trench providing, in a centre region of the trench, a polish stop having a surface coplanar with the surface layer of chemical mechanical polish resistant material of the semiconductor substrate; and planarizing the resulting structure by a step of chemical mechanical polishing to remove all parts of each of the layers extending above the surface layer of chemical mechanical polish resistant material of the substrate and the coplanar surface of the polish stop in the centre region of the trench, whereby the polish stop in the centre region of the trench prevents dishing of the trench filling material.
Claim 2
Independent Claim
169 words
A method of fabricating an integrated circuit, comprising: providing a semiconductor substrate having a planar surface and comprising a surface layer of a chemical mechanical polish resistant material, the substrate having defined therein a steep sided trench; filling the trench with at least one conformal layer of a trench filling material and a conformal layer of chemical mechanical polish resistant material, the layer of chemical mechanical polish resistant material within the trench providing, in a centre region of the trench, a polish stop having a surface coplanar with the surface layer of chemical mechanical polish resistant material of the semiconductor substrate; and planarizing the resulting structure by a step of chemical mechanical polishing to remove all parts of each of the layers extending above the surface layer of chemical mechanical polish resistant material of the substrate and the coplanar surface of the polish stop in the centre region of the trench, whereby the polish stop in the centre region of the trench prevents dishing of the trench filling material.
Claim 3
Dependent Claim
47 words
A method according to claim 1 comprising providing said layer of chemical mechanical polish resistant material forming the polish stop in the centre region of the trench having a thickness equal to the thickness of the surface layer of chemical mechanical polish resistant material of the substrate.
Claim 4
Independent Claim
187 words
A method of fabricating an integrated circuit, comprising: providing a semiconductor substrate having a surface and having formed thereon a first chemical mechanical polish stop layer and an overlying first dielectric layer, the substrate having defined therein a steep sided trench; providing a conformal layer of a trench filling material overall extending over the surface of the first dielectric adjacent the trench and filling the trench, the thickness of the conformal trench filling layer being sufficient to fill a centre of the trench coplanar with the surface of the semiconductor substrate; providing overall an overlying conformal layer of a second chemical mechanical polish stop layer, whereby surfaces of parts of the first polish stop layer on the substrate surface and a part of the second polish stop layer in the centre of the trench are coplanar; and planarizing the resulting structure by chemical mechanical polishing to remove all parts of each layer extending above said coplanar surfaces of said parts of the first and second polish stop layers whereby the second polish stop layer in the centre of the trench prevents dishing of the trench filling material.
Claim 5
Independent Claim
187 words
A method of fabricating an integrated circuit, comprising: providing a semiconductor substrate having a surface and having formed thereon a first chemical mechanical polish stop layer and an overlying first dielectric layer, the substrate having defined therein a steep sided trench; providing a conformal layer of a trench filling material overall extending over the surface of the first dielectric adjacent the trench and filling the trench, the thickness of the conformal trench filling layer being sufficient to fill a centre of the trench coplanar with the surface of the semiconductor substrate; providing overall an overlying conformal layer of a second chemical mechanical polish stop layer, whereby surfaces of parts of the first polish stop layer on the substrate surface and a part of the second polish stop layer in the centre of the trench are coplanar; and planarizing the resulting structure by chemical mechanical polishing to remove all parts of each layer extending above said coplanar surfaces of said parts of the first and second polish stop layers whereby the second polish stop layer in the centre of the trench prevents dishing of the trench filling material.
Claim 6
Dependent Claim
27 words
A method according to claim 3 comprising a subsequent step of selectively removing the polish stop layers leaving a fully planarized surface coplanar with the substrate surface.
Claim 7
Dependent Claim
48 words
A method according to claim 3 wherein providing the conformal trench filling layer comprises: depositing a first conformal layer of a dielectric material and then depositing a second conformal layer of a semiconductor material whereby after the step of planarizing, a trench isolated semiconductor well region is provided.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-07 | 1998-05-09 | 1998-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-07 | 2002-05-09 | 2002-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-07 | 2006-05-09 | 2006-11-08 | $7700.00 | Window Closed / Lapsed |