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US5361720A Expired / Lapsed US ⏱️ 0.0 years remaining

Epitaxial deposition

Assignee: BTG International Ltd
•
Filing: 1992-12-11
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Granted: 1994-11-08
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Expires: 2012-12-11
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Abstract

Abstract A method of manufacture of thin film devices involves the sputtering of an epitaxial barrier layer (11) of a metallic oxide such as magnesia on to which a further epitaxial thin film (12) is deposited. The substrate is preferably alumina and the thin film may be a high temperature superconductive compound of yttrium, barium, copper and oxygen.

Inventors

  • 👤 Jan E. Evetts
  • 👤 Robert E. Somekh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 18:14
CPC Classifications
H; H10; H10N; H10N60/00; H10N60/01; H10N60/0268; H10N60/0296; H10N60/0576; H10N60/0632; Y; Y10; Y10S; Y10S505/00; Y10S505/725; Y10S505/729

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 58 words
A method of manufacture of solid state devices characterised in that it consists essentially of the formation of an epitaxial layer of magnesia by sputtering of material from a magnesium-containing target on to an alumina-containing substrate and the subsequent formation of an epitaxial layer of a compound including yttrium, barium, copper and oxygen on said layer of magnesia.
Claim 2
Independent Claim 58 words
A method of manufacture of solid state devices characterised in that it consists essentially of the formation of an epitaxial layer of magnesia by sputtering of material from a magnesium-containing target on to an alumina-containing substrate and the subsequent formation of an epitaxial layer of a compound including yttrium, barium, copper and oxygen on said layer of magnesia.
Claim 3
Dependent Claim 40 words
A method of manufacture of solid state devices as claimed in claim 1 characterised in that said substrate is heated to a temperature of between 750° C. and 900° C. whilst the material is sputtered from said magnesium containing target.
Claim 4
Dependent Claim 32 words
A method of manufacture of solid state devices as claimed in claim 2 characterised in that an oxidising ambient atmosphere is maintained whilst the material is sputtered from said magnesium containing target.
Claim 5
Dependent Claim 22 words
A method of manufacture of solid state devices as claimed in claim 3 characterised in that the oxidising ambient atmosphere includes oxygen.
Claim 6
Dependent Claim 23 words
A method of manufacture of solid state devices as claimed in claim 3 characterised in that the oxidising ambient atmosphere includes nitrous oxide.
Claim 7
Dependent Claim 26 words
A method of manufacture of solid state devices as claimed in either claim 4 or claim 5 characterised in that the oxidising ambient atmosphere includes argon.
Claim 8
Independent Claim 57 words
A method of forming a barrier layer in a solid state device characterised in that it comprises depositing an epitaxial layer of a superconductor material on a substrate, depositing a monolayer of a second material including a metal and oxygen on said epitaxial layer and depositing a further epitaxial layer of said superconductor material on said monolayer.
Claim 9
Independent Claim 57 words
A method of forming a barrier layer in a solid state device characterised in that it comprises depositing an epitaxial layer of a superconductor material on a substrate, depositing a monolayer of a second material including a metal and oxygen on said epitaxial layer and depositing a further epitaxial layer of said superconductor material on said monolayer.
Claim 10
Dependent Claim 30 words
A method of forming a barrier layer in a solid state device as claimed in claim 7 characterised in that said monolayer is deposited simultaneously with said further epitaxial layer.
Claim 11
Dependent Claim 47 words
A method of forming a barrier layer in a solid state device as claimed in either claim 7 or claim 8 characterised in that a plurality of monolayers of said second material and corresponding further epitaxial layers of said superconductor material are successively deposited on said substrate.

References Cited (Backward Citations)

JPS62154676A Cited
US5077270A Cited
EP0292959A2 Cited
US4921833A Cited
EP0304078A2 Cited
US5084265A Cited
US5059585A Cited
JPH06215869A Cited
JPH06272187A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-11-07 1998-05-09 1998-11-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-11-07 2002-05-09 2002-11-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-11-07 2006-05-09 2006-11-08 $7700.00 Window Closed / Lapsed

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